Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.

Abstract: A multimedia file recommending device capable of matching entertainment file to user mood or state includes an input device to receive emotional value X sensed from or inputted by a user, a storage device, and a processor. The storage device stores multimedia files each associated with an emotional value. The processor selects a multimedia file from the multimedia database according to default rules, wherein a difference between the emotional value associated with the selected multimedia files and the emotional value X falling within a preset range. A multimedia file recommending method is also provided.

Abstract: A method includes attaching a first semiconductor package on a carrier, wherein the first semiconductor package comprises a plurality of stacked semiconductor dies and a plurality of contact pads, depositing a first molding compound layer over the carrier, wherein the first semiconductor package is embedded in the first molding compound layer, forming a plurality of vias over the plurality of contact pads, attaching a semiconductor die on the first molding compound layer, depositing a second molding compound layer over the carrier, wherein the semiconductor die and the plurality of vias are embedded in the second molding compound layer, forming an interconnect structure over the second molding compound layer and forming a plurality of bumps over the interconnect structure.

Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a chip, a molding compound, and a dielectric layer. The chip has a connector thereon. The molding compound encapsulates the chip, wherein a surface of the molding compound is substantially lower than an active surface of the chip. The dielectric layer is disposed over the chip and the molding compound, wherein the dielectric layer has a planar surface, and a material of the dielectric layer is different from a material of the molding compound.

Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a chip, a molding compound, and a dielectric layer. The chip has a connector thereon. The molding compound encapsulates the chip, wherein a surface of the molding compound is substantially lower than an active surface of the chip. The dielectric layer is disposed over the chip and the molding compound, wherein the dielectric layer has a planar surface, and a material of the dielectric layer is different from a material of the molding compound.

Abstract: A method includes attaching a first semiconductor package on a carrier, wherein the first semiconductor package comprises a plurality of stacked semiconductor dies and a plurality of contact pads, depositing a first molding compound layer over the carrier, wherein the first semiconductor package is embedded in the first molding compound layer, forming a plurality of vias over the plurality of contact pads, attaching a semiconductor die on the first molding compound layer, depositing a second molding compound layer over the carrier, wherein the semiconductor die and the plurality of vias are embedded in the second molding compound layer, forming an interconnect structure over the second molding compound layer and forming a plurality of bumps over the interconnect structure.

Abstract: A method for controlling input in a mobile terminal can first set multiple operation modes for the mobile terminal and set multiple relation lists each of which defines a relationship between multiple predetermined functions to be executed in a corresponding operation mode and information regarding multiple predetermined touch operations input in the corresponding operation mode, and switches the operation mode of the mobile terminal among multiple operation modes, and controls the mobile terminal to execute multiple predetermined functions associated with multiple predetermined touch operations applied to a touch screen of the mobile terminal.

Abstract: Package structures and methods for forming the same are provided. The package structure includes an integrated circuit die and a first shielding feature over a base layer. The package structure also includes a package layer encapsulating the integrated circuit die and the first shielding feature. The package structure further includes a second shielding feature extending from the side surface of the base layer towards the first shielding feature to electrically connect to the first shielding feature. The side surface of the second shielding feature faces away from the side surface of the base layer and is substantially coplanar with the side surface of the package layer.

Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.

Abstract: A method includes attaching a first semiconductor package on a carrier, wherein the first semiconductor package comprises a plurality of stacked semiconductor dies and a plurality of contact pads, depositing a first molding compound layer over the carrier, wherein the first semiconductor package is embedded in the first molding compound layer, forming a plurality of vias over the plurality of contact pads, attaching a semiconductor die on the first molding compound layer, depositing a second molding compound layer over the carrier, wherein the semiconductor die and the plurality of vias are embedded in the second molding compound layer, forming an interconnect structure over the second molding compound layer and forming a plurality of bumps over the interconnect structure.

Abstract: Package structures and methods for forming the same are provided. The package structure includes an integrated circuit die and a first shielding feature over a base layer. The package structure also includes a package layer encapsulating the integrated circuit die and the first shielding feature. The package structure further includes a second shielding feature extending from the side surface of the base layer towards the first shielding feature to electrically connect to the first shielding feature. The side surface of the second shielding feature faces away from the side surface of the base layer and is substantially coplanar with the side surface of the package layer.

Abstract: A multimedia file recommending device capable of matching entertainment file to user mood or state includes an input device to receive emotional value X sensed from or inputted by a user, a storage device, and a processor. The storage device stores multimedia files each associated with an emotional value. The processor selects a multimedia file from the multimedia database according to default rules, wherein a difference between the emotional value associated with the selected multimedia files and the emotional value X falling within a preset range. A multimedia file recommending method is also provided.

Abstract: A method for unlocking an electronic lock includes receiving a password transmitted from an electronic device, and determining whether the received password matches a preset password, the preset password is a certain movement of one or more electronic devices. If the received password matches the preset password, determining whether the electronic lock is operating in a temporary pass state or in a non-temporary pass state. The electronic lock is unlocked if the electronic lock is operating in the temporary pass state, but further user verifications are required if the electronic lock is operating in the non-temporary pass state.

Abstract: The present invention provides a catalyst for producing hydrogen and a preparing method thereof. The method includes the steps of adding a first metal source, a second metal source, a third metal source and a cerium source into a first organic solvent containing a surfactant to form a colloidal mixture, wherein a metal of the first metal source is a Group IIIB metal; a metal of the second metal source is selected from the group consisting of alkali metals, alkaline earth metals and Group IIIB metals, and a metal of the third metal source is a transition metal; calcining the colloidal mixture to form a metal solid solution; and allowing the metal solid solution to be carried on a carrier to obtain the catalyst. When the catalyst of the present invention is used for an ethanol oxidation reformation, the reaction temperature of the ethanol oxidation reformation can be significantly decreased.

Abstract: A smart control device for controlling a television (TV) set includes at least one sensing device and a processor. The sensing device is configured to detect whether a person is in front of the TV set, and generate a first control signal upon determining that at least one person is in front of the TV set, or generate a second control signal upon determining that no people are in front of the TV set. The processor obtains the control signal generated by the sensing device, and turns on the TV set when the control signal is the first control signal and if the TV set was turned off, or turns off the TV set after a first predetermined time period elapsed, when the control signal is the second control signal and if the TV set was turned on.

Abstract: The present invention provides a catalyst for producing hydrogen and a preparing method thereof. The method includes the steps of adding a first metal source, a second metal source, a third metal source and a cerium source into a first organic solvent containing a surfactant to form a colloidal mixture, wherein a metal of the first metal source is a Group IIIB metal; a metal of the second metal source is selected from the group consisting of alkali metals, alkaline earth metals and Group IIIB metals, and a metal of the third metal source is a transition metal; calcining the colloidal mixture to form a metal solid solution; and allowing the metal solid solution to be carried on a carrier to obtain the catalyst. When the catalyst of the present invention is used for an ethanol oxidation reformation, the reaction temperature of the ethanol oxidation reformation can be significantly decreased.

Abstract: A method for controlling input in a mobile terminal can first set multiple operation modes for the mobile terminal and set multiple relation lists each of which defines a relationship between multiple predetermined functions to be executed in a corresponding operation mode and information regarding multiple predetermined touch operations input in the corresponding operation mode, and switches the operation mode of the mobile terminal among multiple operation modes, and controls the mobile terminal to execute multiple predetermined functions associated with multiple predetermined touch operations applied to a touch screen of the mobile terminal.

Abstract: A smart control device for controlling a television (TV) set includes at least one sensing device and a processor. The sensing device is configured to detect whether a person is in front of the TV set, and generate a first control signal upon determining that at least one person is in front of the TV set, or generate a second control signal upon determining that no people are in front of the TV set. The processor obtains the control signal generated by the sensing device, and turns on the TV set when the control signal is the first control signal and if the TV set was turned off, or turns off the TV set after a first predetermined time period elapsed, when the control signal is the second control signal and if the TV set was turned on.

Abstract: A method for coupling a mobile device with a host computer of a vehicle includes establishing a connection relationship between the mobile device and the host computer, sending an invitation to the mobile device according to the established connection relationship, and coupling the mobile device to the host computer after accepting the invitation. The invitation is sent by the host computer automatically after the host computer is turned on. The mobile device couples to the host computer automatically through a corresponding coupling mechanism after accepting the invitation.

Abstract: A method for unlocking an electronic lock includes receiving a password transmitted from an electronic device, and determining whether the received password matches a preset password, the preset password is a certain movement of one or more electronic devices. If the received password matches the preset password, determining whether the electronic lock is operating in a temporary pass state or in a non-temporary pass state. The electronic lock is unlocked if the electronic lock is operating in the temporary pass state, but further user verifications are required if the electronic lock is operating in the non-temporary pass state.