Abstract: The present disclosure generally relates to systems and methods for image data processing. In certain embodiments, an image processing pipeline may be configured to receive a frame of the image data having a plurality of pixels acquired using a digital image sensor. The image processing pipeline may then be configured to determine a first plurality of correction factors that may correct each pixel in the plurality of pixels for fixed pattern noise. The first plurality of correction factors may be determined based at least in part on fixed pattern noise statistics that correspond to the frame of the image data. After determining the first plurality of correction factors, the image processing pipeline may be configured to configured to apply the first plurality of correction factors to the plurality of pixels, thereby reducing the fixed pattern noise present in the plurality of pixels.

Abstract: A control method of a memory device includes: updating a wear leveling related data temporarily stored in a buffer memory; obtaining multiple parameters; determining a write frequency according to the multiple parameters; and copying the wear leveling related data from the buffer memory to a flash memory module included in the memory device according to the write frequency.

Abstract: A pressure sensing device, comprising: a frame work; a capacitive pressure sensor layer, surrounding the frame work; a capacitive touch sensor layer; and a flexible material layer, located between the pressure sensor layer and the touch sensor layer and surrounding the capacitive pressure sensor layer. The capacitive touch sensor layer is above the flexible material layer when the capacitive pressure sensor layer is below the flexible material layer. The capacitive touch sensor layer has a first driving electrode and a first sensing electrode. The capacitive pressure sensor layer has a second driving electrode and a second sensing electrode. A 3D gesture control system and a vehicle control system applying the pressure sensing device are also disclosed. Via the pressure sensing device, the 3D gesture control system and the vehicle control system can generate control commands according to a touch or a pressure provided by a user.

Abstract: A package structure includes a circuit substrate, a semiconductor package, a thermal interface material, a lid structure and a heat dissipation structure. The semiconductor package is disposed on and electrically connected to the circuit substrate. The thermal interface material is disposed on the semiconductor package. The lid structure is disposed on the circuit substrate and surrounding the semiconductor package, wherein the lid structure comprises a supporting part that is partially covering and in physical contact with the thermal interface material. The heat dissipation structure is disposed on the lid structure and in physical contact with the supporting part of the lid structure.

Abstract: A hydrogel composition, a hydrogel biomedical material, a method for facilitating regeneration of a bone and a manufacturing method of a hydrogel composition are provided. The hydrogel composition includes a first deionized water, a gel powder, a transglutaminase mixture and a hyaluronic acid powder. The gel powder includes gelatin and alginic acid. The first deionized water, the gel powder, the transglutaminase mixture and the hyaluronic acid powder are evenly mixed. Based on the hydrogel composition being 100 wt %, the first deionized water is 95 wt % to 98.46 wt %, the gel powder is 1 wt % to 3 wt %, the transglutaminase mixture is 0.04 wt % to 0.15 wt %, and the hyaluronic acid powder is 0.5 wt % to 1.5 wt %.

Abstract: Semiconductor devices and methods of manufactured are presented in which a first redistribution structure is formed, semiconductor devices are bonded to the first redistribution structure, and the semiconductor devices are encapsulated in an encapsulant. First openings are formed within the encapsulant, such as along corners of the encapsulant, in order to help relieve stress and reduce cracks.

Abstract: A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.

Abstract: A package assembly includes an interposer module on a package substrate, a liquid alloy thermal interface material (TIM) on the interposer module, a seal ring surrounding the liquid alloy TIM, and a package lid on the liquid alloy TIM and seal ring, wherein the seal ring, interposer module and package lid seal the liquid alloy TIM.

Abstract: An electric nail gun includes a main body unit, a hammer unit, and a motor unit. The hammer unit includes a hammer member that is adapted for striking a nail, and a resilient member that has two opposite ends respectively abutting against the hammer member and the main body unit. The resilient member of the hammer unit constantly provides a hammer restoring force for the hammer member to move in a striking direction for striking the nail. The motor unit is mounted to the main body unit, and includes a lifting wheel. The lifting wheel has at least one pushing portion that separably engages the hammer member, and that is operable to push the hammer member to move in an energy storage direction opposite to the striking direction such that the resilient member of the hammer unit is compressed and provides the hammer restoring force to the hammer member.

Abstract: A heat pipe comprises a flat tube and a wick structure. The flat tube includes a hollow chamber and has a front and a rear sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the flat tube. The wick structure is divided into a front, a middle and a rear sections sequentially along the axial direction. The front section is near the front sealed end, the rear section is near the rear sealed end. The front, middle and rear sections have a maximum length parallel to the width direction, respectively. The maximum length of the front section is greater than that of the middle section, and the maximum length of the middle section is greater than that of the rear section.

Abstract: A package structure is provided. The package structure includes a first package component mounted on a substrate, a lid structure disposed on the substrate and around the first package component, and a thermal interface material vertically sandwiched between the plurality of integrated circuit dies of the first package component and the lid structure. The first package component includes a plurality of integrated circuit dies and an underfill formed between the integrated circuit dies. The lid structure covers the integrated circuit dies and exposes the underfill. A first portion and a second portion of the thermal interface material are laterally separated from each other, and a space between the first portion and the second portion is exposed from the lid structure.

Abstract: Various solutions for enhanced user equipment (UE) route selection policy (URSP) with green incentives for environmental conservation are described. An apparatus may receive information of an application associated with one or more eco-friendly requirements. Then, the apparatus may select a URSP rule from a list of URSP rules, and the selected URSP rule includes one or more descriptors matching the one or more eco-friendly requirements. Also, the apparatus may determine a data session for routing traffic of the application between the apparatus and a wireless network based on one or more parameters included in a route selection descriptor (RSD) of the selected URSP rule.

Abstract: Disclosed is an optical module, including a lower housing, an upper housing covering the lower housing, a circuit board, a first metal base, a second metal base, a silicon photonic chip, and a light emission module including a laser chip and an optical path assembly. The first metal base is disposed on one side of the upper housing. The second metal base is disposed on one side of the lower housing. The circuit board with a hollow region is disposed on the second metal base. The silicon photonic chip is disposed on the second metal base exposed from the hollow region. The laser chip is disposed on the first metal base. The optical path assembly is disposed on the first metal base and/or on the second metal base exposed from the hollow region, and guides a third optical signal emitted by the laser chip to the silicon photonic chip.

Abstract: A mobile device includes a hybrid antenna, a tunable circuit element, an RF (Radio Frequency) module, and a proximity sensor. The tunable circuit element provides an impedance value. The RF module generates RF power. The hybrid antenna is coupled through the tunable circuit element to the RF module. The proximity sensor is respectively coupled to the hybrid antenna, the tunable circuit element, and the RF module, and is configured to detect a specific distance between the hybrid antenna and a conductive element. The tunable circuit element and the RF module are operated according to relative information of the specific distance. If the specific distance is shorter than or equal to a first threshold distance, the RF module will reduce the RF power. If the specific distance is shorter than or equal to a second threshold distance, the tunable circuit element will change the impedance value.

Abstract: Optical devices and methods of manufacture are presented in which a multi-tier connector is utilized to transmit and receive optical signals to and from an optical device. In embodiments a multi-tier connection unit receives optical signals from outside of an optical device, wherein the optical signals are originally in multiple levels. The multi-tier connection unit then routes the optical signals into a single level of optical components.

Abstract: A metal interconnect structure includes a first metal interconnection in an inter-metal dielectric (IMD) layer on a substrate, a second metal interconnection on the first metal interconnection, and a cap layer between the first metal interconnection and the second metal interconnection. Preferably, a top surface of the first metal interconnection is even with a top surface of the IMD layer and the cap layer is made of conductive material.

Abstract: Field effect transistor (FET) devices having a heterogeneous/segmented channel region and methods for fabricating the same are provided. In one example, a fin-like field effect transistor (FinFET) device includes a substrate, a fin structure disposed on the substrate, a segmented channel region formed in the fin structure, two source/drain (S/D) regions separated by the segmented channel region, and a gate structure wrapping around the segmented channel region. The segmented channel region further includes multiple channel segments sequentially arranged in the segmented channel region, and the multiple channel segments include a first channel segment and a second channel segment. The first channel segment includes a first channel barrier material dispersed therein and has a first energy barrier, and the first energy barrier is at least 0.1 electron volts (eV) in a carrier flow path between the two S/D regions when the FinFET device is not activated for operation.

Abstract: An in vitro training method for training genioglossus muscle strength includes adhering an electrode patch of an in vitro training device to a bottom of a chin of a user during a non-sleep period. The electrode patch receives an electrical stimulation signal from an electrical stimulation module of the in vitro training device to stimulate the genioglossus muscle of the user through transdermal electrical stimulation. The electrode patch includes a body surface adhering face and an assembling face opposite to the body surface adhering face. The body surface adhering face is adhered to the bottom of the chin of the user to align with the genioglossus muscle. The electrical stimulation module is disposed on the assembling face and in electrical connection with the electrode patch. The electrical stimulation module sends an electrical stimulation signal to stimulate the genioglossus muscle through transdermal electrical stimulation.

Abstract: A memory device in an integrated circuit is provided, including an input/output (I/O) circuit, a first memory segment and a second memory segment that separated from the first memory segment in a first direction, a first pair of data lines on a first side of the integrated circuit, extending in the first direction and configured to couple the first memory segment to the I/O circuit, and a second pair of data lines separated from the first pair of data lines in a second direction, different from the first direction, on a second side, opposite to the first side, of the integrated circuit, and configured to couple the second memory segment to the I/O circuit. A first width of the first pair of data lines is different from a second width of the second pair of data lines.

Abstract: An integrated circuit and a formation method thereof are provided. The integrated circuit includes: an active structure, formed on a semiconductor substrate, and extending along a first lateral direction; first and second gate lines, extending along a second lateral direction on the semiconductor substrate, and crossing the active structure; an isolation wall, extending along the second lateral direction between the first and second gate lines, and cutting through the active structure; a first source/drain contact, extending along the second lateral direction between the first gate line and the isolation wall, and crossing the active structure; and a first source/drain via, disposed on the first source/drain contact, and laterally extending along the first direction to overlap the isolation wall.