Abstract: A microscope module includes a light source assembly, a sampling assembly and a diffusing element. The light source assembly includes a light source and a light guide element. The light source is disposed close to the light incidence end of the light guide element. The sampling assembly includes a cover and a base. The cover and the base are combined to define a sample accommodating space, which is located at the light exit end of the light guide element. The diffusing element is disposed between the light source and the sample accommodating space. The light emitted from the light source passes through the diffusing element and then enters the sample accommodating space. A microscope device containing the microscope module is also disclosed.

Abstract: A foldable bench having a seat and front support members that may be rotated between a folded position and an unfolded position includes a backrest, first and second front support members, a seat, and a latch. The front support members are mounted to the font of the backrest and rotate laterally between a folded and unfolded position. The seat is mounted to the front of the backrest and rotates vertically between a folded and unfolded position. In the folded position, the seat is sandwiched between the backrest and the front support members. In the unfolded position, the seat prevents the front support members from rotating inwards to the folded position. The seat is supported in an unfolded position by seat supports located on each of the front support members, which are received by receivers in the seat. A latch located on one of the arms selectively engages an opening in the seat to secure the seat in the unfolded position.

Abstract: A multi-channel optical transmitter or transceiver includes an optical multiplexer with input and output ports on a single side. The optical multiplexer receives optical signals at different channel wavelengths on a plurality of mux input ports on one side and combines the optical signals into a multiplexed optical signal, which is output on an optical output port on the same side. The optical multiplexer may be located at a distal end of a transceiver or transmitter housing. In one embodiment, the optical multiplexer is a reversed planar lightwave circuit (PLC) splitter including splitter output ports that are used as the mux input ports and a splitter input port that is used as the mux output port. The mux input ports may be optically coupled to respective transmitter optical subassembly (TOSA) modules with optical fibers.

Abstract: This present invention provides a method of manufacturing a chip scale sensing chip package, comprising the steps of: providing a sensing device wafer having a first top surface and a first bottom surface opposite to each other, whereby the sensing device wafer comprises a plurality of chip areas, and each of the chip areas comprising a sensing device and a plurality of conductive pads adjacent to the sensing chip nearby the first top surface; providing a cap wafer having a second top surface and a second bottom surface opposite to each other, and bonding the second surface of the cap wafer to the first top surface of the sensing device wafer by sandwiching a first adhesive layer therebetween; providing a temporary carrier substrate, and bonding the temporary carrier substrate to the second top surface of the cap wafer by sandwiching a second adhesive layer therebetween; forming a wiring layer connecting to each of the conductive pads on the first bottom surface of the sensing device wafer; providing a first

Abstract: The invention provides a remote control system, including a cloud server, a first device and a portable electronic device. The first device includes a transmission interface for connecting to a second device. The portable electronic device sets up a transmission path to connect with the first device via the cloud server. The first device transmits type information including a type of the transmission interface to the portable electronic device through the transmission path. The portable electronic device encodes original data based on the type information to generate encoded data conforming to the transmission interface, and transmits the encoded data to the first device through the transmission path. The first device transmits the encoded data to the second device through the transmission interface, so as to control the second device.

Abstract: To allow a user to temporarily move access to premium content to another location, e.g. outside the vicinity of the home, while adequately protecting the rights of a broadcast content provider, the various examples implement a transfer of an object for an identified right of content usage between premium content reproduction devices and a mobile device. The mobile device enables such transfer to support viewing of the premium content by a user outside of the user's home.

Abstract: A method of manufacturing chip package includes providing a semiconductor substrate having at least a photo diode and an interconnection layer. The interconnection layer is disposed on an upper surface of the semiconductor substrate and above the photo diode and electrically connected to the photo diode. At least a redistribution circuit is formed on the interconnection layer. The redistribution circuit is electrically connected to the interconnection layer. A packaging layer is formed on the redistribution circuit. Subsequently, a carrier substrate is attached to the packaging layer. A color filter is formed on a lower surface of the semiconductor substrate. A micro-lens module is formed under the color filter. The carrier substrate is removed.

Abstract: A chip package includes a chip, a first adhesive layer, a second adhesive layer, and a protection cap. The chip has a sensing area, a first surface, a second surface that is opposite to the first surface, and a side surface adjacent to the first and second surfaces. The sensing area is located on the first surface. The first adhesive layer covers the first surface of the chip. The second adhesive layer is located on the first adhesive layer, such that the first adhesive layer is between the first surface and the second adhesive layer. The protection cap has a bottom board and a sidewall that surrounds the bottom board. The bottom board covers the second adhesive layer, and the sidewall covers the side surface of the chip.

Abstract: A wireless sensor includes a wireless power module, a sensor module generating a sensor output, an analog-to-digital converter (ADC) module connected to the sensor module, a wireless transceiver (TRX) module operating in a receiving state by default to receive an RF input signal, transmitting an RF output signal based on digital signals when in a transmitting state, and switching back to the receiving state after a period, and a processing module connected to the ADC and TRX modules, activating the ADC module to convert the sensor output to the digital outputs when the TRX module is in the receiving state, and when receiving the digital signals, deactivating the ADC module and switching the TRX module to the transmitting state.

Abstract: A multi-channel optical transmitter or transceiver includes an optical multiplexer with input and output ports on a single side. The optical multiplexer receives optical signals at different channel wavelengths on a plurality of mux input ports on one side and combines the optical signals into a multiplexed optical signal, which is output on an optical output port on the same side. The optical multiplexer may be located at a distal end of a transceiver or transmitter housing. In one embodiment, the optical multiplexer is a reversed planar lightwave circuit (PLC) splitter including splitter output ports that are used as the mux input ports and a splitter input port that is used as the mux output port. The mux input ports may be optically coupled to respective transmitter optical subassembly (TOSA) modules with optical fibers.

Abstract: A flash memory control technology with high reliability. In a power recovery process, a microcontroller is configured to duplicate a last write page of a run-time write block of a flash memory and thereby generate a duplicated page in the run-time write block. The microcontroller is further configured use the mapping information accessed from the duplicated page in rebuilding a physical-to-logical address mapping table rather than the mapping information accessed from the last write page. The microcontroller is configured to maintain the physical-to-logical address mapping table on a random access memory for the run-time write block and is further configured to use the physical-to-logical address mapping table to update a logical-to-physical address mapping table maintained in the flash memory.

Abstract: The present invention provides a data storage device including a flash memory and a controller. The flash memory has a plurality of single-level-cell units and a plurality of triple-level cell units. The controller performs a first predetermined number of read processes on a second predetermined number of specific single-level-cell units to program data stored in the second predetermined number of specific single-level-cell units into a specific triple-level cell unit of the triple-level cell units and determines whether any of the second predetermined number of specific single-level-cell units has not been read successfully by any of the read processes when the specific triple-level cell unit cannot be read successfully.

Abstract: Organometallic compounds, organic light-emitting devices, and lighting devices employing the same are provided. The organometallic compound has a chemical structure represented by formula (I) or (II): wherein n is 1 or 2; each R1 is independent and can be hydrogen, C1-8 alkyl, C1-8 alkoxy, C5-10 aryl, or C2-8 heteroaryl; each R2 is independent and can be hydrogen, C1-8 fluoroalkyl, or C1-8 alkyl; A is N, or CH; B is N, or CH; D is N, or C—R3, wherein R3 is H, or C1-8 alkyl; and R1 is not hydrogen when R2 is hydrogen.

Abstract: A securing apparatus configured to mount a data storage device in an enclosure includes a shielding assembly configured to be secured to a panel of the enclosure and a sliding pole. The shielding assembly includes a frame and a rotating plate rotatably mounted to the frame. The sliding pole is slidably mounted to the frame and defines a plurality of latching slots. The frame defines an aperture for the data storage device to pass through; the rotating plate comprises a plurality of hooks. The sliding pole is slidable relative to the frame to engage the hooks in the latching slots. The rotating plate is secured to the frame and shields the aperture, preventing the data storage device from being taken out of the enclosure.

Abstract: An image-sensor structure is provided. The image-sensor structure includes a substrate having a first surface and a second surface and including a sensing area, a first metal layer formed above the first surface of the substrate and surrounding the sensing area, and a protection layer formed above the first surface of the substrate and overlying the sensing area and a part of the first metal layer to expose an exposed area of the first metal layer. The exposed area includes a first portion having a first width, a second portion having a second width, a third portion having a third width and a fourth portion having a fourth width.

Abstract: A heat sink structure and a manufacturing method thereof. The heat sink includes a main body having multiple main body connection sections and multiple radiating fins each having a connection section. The main body has a first end and a second end. The first and second ends define a longitudinal direction. The multiple radiating fins are placed in a mold. A mechanical processing measure is used to high-speed impact the main body so as to thrust the main body into the mold. Accordingly, the connection sections of the radiating fins placed in the mold are high-speed thrust into the main body connection sections and moved in the longitudinal direction to the second end of the main body to tightly integrally connect with the main body.

Abstract: A double frequency-shift keying modulating device includes a modulation module. The modulation module receives an oscillating signal and a digital signal, and generates a modulation output signal that has a first frequency. The first frequency is associated with a frequency of the oscillating signal and varies periodically at a second frequency. The second frequency is associated with the digital signal and the frequency of the oscillating signal.

Abstract: Some embodiments are directed to a wafer polishing tool. The wafer polishing tool includes a first polisher, a second polisher downstream of the first polisher, a third polisher downstream of the second polisher, and a fourth polisher downstream of the third polisher. The first polisher receives a wafer having a front side and a back side with integrated circuit component devices disposed on the front side of the wafer, and polishes a center region on the back side of the wafer. The second polisher receives the wafer via transporting equipment and buffs the center region of the back side of the wafer. The third polisher receives the wafer via the transporting equipment and polishes a back side edge region of the wafer. The fourth polisher receives the wafer via the transporting equipment and buffs the back side edge region of the wafer.

Abstract: A radio frequency (RF) power amplifier includes an amplifying stage that includes an amplifying module, an input module and a feedback module. The amplifying module receives an RF to-be-amplified signal, and performs power amplification on the RF to-be-amplified signal to generate an RF output signal. The input module receives an RF input signal. The feedback module receives the RF output signal, cooperates with the input module to provide the RF to-be-amplified signal based on the RF input and output signals, and cooperates with the amplifying module to forma positive feedback loop that provides a loop gain which is less than one.

Abstract: A tandem solar cell module includes a transparent substrate, a first solar cell unit, and a second solar cell unit disposed between the transparent substrate and the first solar cell unit. The first solar cell unit includes a first electrode, a second electrode, and a first absorption layer disposed between the first electrode and the second electrode, and the second solar cell unit includes a third electrode, a fourth electrode, and a second absorption layer disposed between the third electrode and the fourth electrode, wherein the second electrode is located adjacent to the third electrode, and the positions of the second electrode, the third electrode, and the fourth electrode are corresponding to each other.