Abstract: A manufacturing method of a semiconductor structure includes the following steps. A first isolation layer is formed on a first surface of a wafer substrate. A conductive pad is formed on the first isolation layer. A hollow region through the first surface and a second surface of the wafer substrate is formed, such that the first isolation layer is exposed through the hollow region. A laser etching treatment is performed on the first isolation layer that is exposed through the hollow region, such that a first opening is formed in the first isolation layer, and a concave portion exposed through the first opening is formed in the conductive pad.

Abstract: An electrical charging or recharging control device applied in moving vehicles includes at least one processor and a storage device that stores one or more programs, when executed by the at least one processor, cause the at least one processor to. A data as to working status transmitted by an electric vehicle is received, the data including information of a position of the electric vehicle, a destination, and a remaining charge level of the electric vehicle. A general electricity demand of the electric vehicle is calculated. A charging request is generated when charging is determined to be necessary according to the general electricity demand and the remaining charge level of the electric vehicle. The charging request leads to the electric vehicle being recharged by a charging vehicle, a charging system and a charging method for a motoring service using the control device are also disclosed.

Abstract: A chip package including a substrate is provided. The substrate has a first surface and a second surface opposite thereto. The substrate includes a sensing or device region which is adjacent to the first surface. A recess is in the substrate. The recess extends from the second surface towards the first surface, and vertically overlaps the sensing or device region. A redistribution layer is electrically connected to the sensing or device region, and extends from the second surface into the recess. A method of forming the chip package is also provided.

Abstract: A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate; forming a fin-shaped structure on the substrate; performing a first etching process to remove part of the fin-shaped structure for forming a trench; and performing a second etching process to extend the depth of the trench and divide the fin-shaped structure into a first portion and a second portion.

Abstract: A method for forming a thin film having sulfide single-crystal nanoparticles includes dropping a sulfide precursor solution on the surface of a Group VI absorption layer, and then performing thermal decomposition on the sulfide precursor solution under a predetermined temperature to form a thin film consisting of sulfide single-crystal nanoparticles on the surface of the Group VI absorption layer.

Abstract: A down-conversion mixer includes a trans conductance unit, a resonant unit and a mixing unit. The transconductance unit converts a differential input voltage signal pair into a differential input current signal pair. The resonant unit provides a negative resistance and a differential auxiliary current signal pair. The mixing unit mixes a combination of the differential input current signal pair and the differential auxiliary current signal pair with a differential oscillatory voltage signal pair to generate a differential mixed voltage signal pair.

Abstract: A suitcase structure includes a back case component, a front lid component and a ring-shaped gusset component. The opposite sides of the ring-shaped gusset component are connected with the edge of the back case component and the edge of the front lid component respectively, so as to form an accommodation space used for being closed. The ring-shaped gusset component includes a plurality of sidewall portions and a plurality of flexible structures linking the sidewall portions. The flexible deformation capability of the flexible structures is greater than the flexible deformation capability of the sidewall portions. The flexible structures has an inclination, and two of the sidewall portions adjacent to each other can be bent and therefore be stacked opposite to each other by the flexible structures linking the two of the sidewall portions.

Abstract: A manufacturing method of a semiconductor structure includes the following steps. A first isolation layer is formed on a first surface of a wafer substrate. A conductive pad is formed on the first isolation layer. A hollow region through the first surface and a second surface of the wafer substrate is formed, such that the first isolation layer is exposed through the hollow region. A laser etching treatment is performed on the first isolation layer that is exposed through the hollow region, such that a first opening is formed in the first isolation layer, and a concave portion exposed through the first opening is formed in the conductive pad.

Abstract: A folding suitcase includes a back case component, a front lid component, a circumferential surface component, and a restoring component. Two opposite sides of the circumferential surface component are connected with the back case component and the front lid component, respectively, so as to form an accommodating space selectively. The circumferential surface component has multiple sidewall parts and multiple bending parts connected with the multiple sidewall parts. The multiple bending parts are bendable to lead the multiple sidewall parts to be capable of being folded oppositely or being erected on the back case component. The restoring component is located on at least one bending part. The restoring component is elastic for erecting the multiple sidewall parts.

Abstract: A finger metal oxide metal capacitor including an outer conducting structure and an inner conducting structure. The outer conducting structure is defined in a plurality of metal layers and a plurality of via layers of an integrated circuit and includes first and second side portions. An inner conducting structure is defined in the plurality of metal layers and the plurality of via layers of the integrated circuit. Each of the outer conducting structure and the inner conducting structure includes respective finger sections extending in the plurality of metal layers. Oxide is arranged between the outer conducting structure and the inner conducting structure.

Abstract: A platform structure for manufacturing a scaffold for use in tissue engineering, comprising a frame; a ring-shaped thermally conductive member fixedly disposed in the frame; a thermally conductive platform centrally movably disposed in the ring-shaped thermally conductive member and having edges in direct contact with inner walls of the ring-shaped thermally conductive member, wherein the thermally conductive platform and the ring-shaped thermally conductive member together define a space of a variable depth; a vertically movable mechanism connected to a bottom of the thermally conductive platform and adapted to drive the thermally conductive platform to sink and thus increase gradually the depth of the space; and a low temperature generating mechanism connected to the ring-shaped thermally conductive member and the thermally conductive platform to cool down the ring-shaped thermally conductive member and the thermally conductive platform, to prevent deformation and ensure uniform dimensions of tall scaffolds

Abstract: A manufacturing apparatus for use in the low-temperature high-speed manufacturing of a support structure is introduced. The support structure thus manufactured is for supporting a low-temperature manufacturing scaffold for use in tissue engineering.

Abstract: Chemical-mechanical polishing (CMP) devices, tools, and methods are disclosed. In some embodiments, a device for a CMP tool includes a carrier and an embedded dummy disk coupled to the carrier. The embedded dummy disk comprises a substrate and a film disposed over the substrate. The carrier is coupleable to an arm of a handler of the CMP tool. The carrier and the embedded dummy disk are adapted to be embedded within a housing of the CMP tool. The embedded dummy disk is adapted to be polished by the CMP tool in preparation for a polishing process for a wafer.

Abstract: A collapsible table includes a tabletop, a first pair of collapsible legs, and a second pair of collapsible legs. The first pair of legs includes a first support bar for connecting a first leg to a second leg adjacent their top end portions, and the first support bar is pivotally connected to the bottom surface of the tabletop. The second pair of legs includes a second support bar for connecting a third leg to a fourth leg and a third support bar spaced apart from the second support bar for connecting the third leg to the fourth leg. One or more brackets are disposed adjacent the bottom surface of the tabletop and are positioned and configured to removably secure the second support bar to the bottom surface of the tabletop in a use position and removably secure the third support bar to the bottom surface in a storage position.

Abstract: A multi-channel transmitter optical subassembly (TOSA) with an off-center fiber in an optical coupling is disclosed, and can provide passive compensation for beam displacement introduced by optical isolators. The optical coupling receptacle can include an optical isolator configured to receive a focused light beam from a focus lens within the TOSA. The optical coupling receptacle may be offset such that a center line of the focused light beam entering the optical isolator is offset from a center line of a fiber within optical coupling receptacle. Thus the optical isolator receives the focused light beam from the focus lens and introduces beam displacement such that an optical signal is launched generally along a center line of the fiber. Thus the expected beam displacement introduced by the optical isolator is eliminated or otherwise mitigated by the offset between a center line of the fiber and a center position of the focus lens.

Abstract: A device management method for use in a cloud system including a remote device, a mobile device and a cloud server is provided. The method includes the steps of: using, by the mobile device and the remote device, a same login information to log in the cloud server; sending, by the remote device, a push notification message to the mobile device through the cloud server when detecting that a first device is connected to a connection port, wherein the push notification message includes first identification information corresponding to the first device; and in response to receiving the push notification message, identifying, by the mobile device, the first device according to the first identification information to activate a respective application so as to perform data transmission with the first device through the respective application.

Abstract: Some embodiments relate to a method of using a polishing system. In this method, a wafer is secured in a carrier head. The carrier head includes a housing, which includes a retaining ring recess, enclosing the wafer. A retaining ring is positioned in the retaining ring recess. The retaining ring surrounds the wafer, and has a hardness ranging from about 5 shore A to about 80 shore D. The wafer is pressed against a polishing pad, and at least one of the carrier head or the polishing pad is moved relative to the other.

Abstract: A double frequency-shift keying modulating device includes a modulation module. The modulation module receives an oscillating signal and a digital signal, and generates a modulation output signal that has a first frequency. The first frequency is associated with a frequency of the oscillating signal and varies periodically at a second frequency. The second frequency is associated with the digital signal and the frequency of the oscillating signal.

Abstract: A light sensing device includes a substrate, a semiconductor device layer, a metal and insulation material stacked structure, and a light absorption layer. The substrate has a recessed portion. The semiconductor device layer is located on the substrate. The metal and insulation material stacked structure is located on the semiconductor device layer and includes a first interconnect structure, a second interconnect structure surrounding the first interconnect structure, and a device conductive line. The light absorption layer is located on the metal and insulation material stacked structure. The first interconnect structure is located between the light absorption layer and the semiconductor device layer, such that the light absorption layer and the semiconductor device layer located at different levels can be connected to each other and exchange heat.

Abstract: The invention provides a remote control system, including a cloud server, a first device and a portable electronic device. The first device includes a transmission interface for connecting to a second device. The portable electronic device sets up a transmission path to connect with the first device via the cloud server. The first device transmits type information including a type of the transmission interface to the portable electronic device through the transmission path. The portable electronic device encodes original data based on the type information to generate encoded data conforming to the transmission interface, and transmits the encoded data to the first device through the transmission path. The first device transmits the encoded data to the second device through the transmission interface, so as to control the second device.