Abstract: The present disclosure provides a light emitting module, which includes a base board, a light emitting diode chip, a transparent thermoplastic layer, and fluorescent glue. The base board includes a die-bonding zone. The light emitting diode chip is bonded on the die-bonding zone. The light emitting diode chip includes an upper surface, a lower surface opposite to the upper surface, and a plurality of side surfaces adjoined between the upper surface and lower surfaces. A transparent thermoplastic layer encloses at least one portion of the light emitting diode chip. The fluorescent glue disposed over to cover the base board, the light emitting diode chip, and the transparent thermoplastic layer.

Abstract: A solid-state light-emitting package includes a leadframe, a light-emitting chip, and a sealant. The leadframe includes a first electrode and a second electrode. The first electrode has at least one first contact end, and the second electrode has at least one second contact end. The light-emitting chip is electrically connected to the first electrode and the second electrode and is disposed between the first contact end and the second contact end. The sealant covers the leadframe and the light-emitting chip and has a first surface and a second surface. The first surface is the light output surface for the light-emitting chip. The first electrode and the second electrode are bent toward the first surface, where the first contact end and the second contact end are exposed by the first surface.