Light emitting diode package

- Lextar Electronics Corp.
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Description

FIG. 1 is a front perspective view of light emitting diode package showing the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for light emitting diode package, as shown and described.

Patent History
Patent number: D678225
Type: Grant
Filed: Dec 14, 2011
Date of Patent: Mar 19, 2013
Assignee: Lextar Electronics Corp. (Hsinchu)
Inventors: Bo-Yu Ko (New Taipei), Chun-Wei Wang (New Taipei), Sheng-Pei Lin (Taichung)
Primary Examiner: Selina Sikder
Application Number: 29/408,556
Classifications