Patents by Inventor Sheng Tang
Sheng Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8696806Abstract: An asphalt binder includes asphalt and an asphalt binder modifier, which includes bio-oil. The asphalt binder can include a carboxyl additive. The asphalt can optionally include polymer-modified asphalt. An asphalt material includes mineral aggregate, an asphalt material binder including asphalt, and an asphalt binder modifier including bio-oil. A method for making the asphalt binder is disclosed. The asphalt material includes asphalt pavement and roofing shingles. The asphalt binder can be emulsified with water and a surfactant for use as a weatherproofing sealant or as an adhesive.Type: GrantFiled: May 3, 2010Date of Patent: April 15, 2014Assignee: Iowa State University Research Foundation, Inc.Inventors: Ronald Christopher Williams, Robert C. Brown, Sheng Tang
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Publication number: 20140091329Abstract: The present disclosure involves a lighting instrument. The lighting instrument includes a board or substrate, for example, a printed circuit board substrate. The lighting instrument includes a plurality of light-emitting diode (LED) dies disposed on the substrate. The LED dies are spaced apart from one another. Each LED die is covered with a respective individual phosphor coating that is coated around the LED die conformally. Due at least in part to the individual phosphor coatings, the LED dies and the lighting instrument may assume a substantially white appearance in an off state. The lighting instrument also includes an encapsulation structure disposed over the substrate. The encapsulation structure may be a diffuser cap that encapsulates the light-emitting dies within. A diffuser gel fills the space between the encapsulation structure and the LED dies.Type: ApplicationFiled: September 28, 2012Publication date: April 3, 2014Applicant: TSMC Solid State Lighting Ltd.Inventors: Hsiao-Wen Lee, Chi-Xiang Tseng, Yu-Sheng Tang, Jung-Tang Chu
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Patent number: 8602225Abstract: A mounting apparatus for fixing a slide rail to either a first rack post or a second rack post with different sizes or shapes of locating holes, includes a mounting bracket secured to the slide rail, a latch member rotatably mounted to the mounting bracket, and a restoring member. The mounting bracket includes a locating pin having a first segment adapted to extending through the first rack post locating hole, and a second segment adapted to extending through the second rack post locating hole. The latch member includes an arm received in the locating pin, with first and second holding teeth. In the locking position, either the first or the second teeth extend out of the locating pin to clasp the first or the second rack post, the unlocking position is achieved against spring pressure.Type: GrantFiled: September 18, 2011Date of Patent: December 10, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Shu-Chen Lin, Chen-Sheng Tang
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Publication number: 20130309789Abstract: A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.Type: ApplicationFiled: July 19, 2013Publication date: November 21, 2013Inventors: Ching-Yi Chen, Yu-Sheng Tang, Hao-Yu Yang, Hsin-Hung Chen, Tzu-Wen Shih
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Publication number: 20130299855Abstract: An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.Type: ApplicationFiled: July 15, 2013Publication date: November 14, 2013Inventors: Hao-Wei Ku, Chung Yu Wang, Yu-Sheng Tang, Hain-Hung Chen, Hao-Yu Yang, Ching-Yi Chen, Hsiao-Wen Lee, Chi Xiang Tseng, Sheng-Shin Guo, Tien-Ming Lin, Shang-Yu Tsai
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Publication number: 20130285102Abstract: An embodiment of the disclosure includes a LED module. A substrate is provided. A light sensor is positioned in the substrate. A LED chip is attached to the substrate. The LED chip has a first side and a second side. The second side is covered by an opaque layer with an opening. The opening is substantially aligned with the light sensor. The light sensor receives a light output emitting from the LED chip through the opening.Type: ApplicationFiled: June 26, 2013Publication date: October 31, 2013Inventors: Yu-Sheng Tang, Yi-Tsuo Wu
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Patent number: 8497519Abstract: An LED emitter uses a molded lens with phosphor material embedded in a circumferential trench to generate a batwing beam pattern. After the lens is molded over a package substrate with connected LED dies thereon, the phosphor material is molded, injected, or dispensed into a circumferential trench. The molded lens is shaped such that a majority of the light emitted by the one or more LED dies is reflected by the top surface to the side surfaces through the phosphor material.Type: GrantFiled: May 24, 2011Date of Patent: July 30, 2013Assignee: TSMC Solid State Lighting Ltd.Inventors: Ching-Yi Chen, Yu-Sheng Tang, Hao-Yu Yang, Hsin-Hung Chen, Tzu-Wen Shih
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Patent number: 8496353Abstract: An embodiment of the disclosure includes a LED module. A substrate is provided. A light sensor is positioned in the substrate. A LED chip is attached to the substrate. The LED chip has a first side and a second side. The second side is covered by an opaque layer with an opening. The opening is substantially aligned with the light sensor. The light sensor receives a light output emitting from the LED chip through the opening.Type: GrantFiled: September 14, 2010Date of Patent: July 30, 2013Assignee: TSMC Solid State Lighting Ltd.Inventors: Yu-Sheng Tang, Yi-Tsuo Wu
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Patent number: 8486724Abstract: An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.Type: GrantFiled: October 22, 2010Date of Patent: July 16, 2013Assignee: TSMC Solid State Lighting Ltd.Inventors: Hao-Wei Ku, Chung Yu Wang, Yu-Sheng Tang, Hsin-Hung Chen, Hao-Yu Yang, Ching-Yi Chen, Hsiao-Wen Lee, Chi Xiang Tseng, Sheng-Shin Guo, Tien-Ming Lin, Shang-Yu Tsai
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Publication number: 20130155314Abstract: A lens module for capturing an object light-beam from an object-side is provided. The lens module includes a first lens group, a second lens group, a third lens group, a fourth lens group and a fifth lens group sequentially-arranged from the object-side to an image-side. The five lens groups respectively have at least one lens with positive refractive-power and at least one lens with negative refractive-power. The first, third and fifth lens groups are fixed groups, while the second and fourth lens groups are movable groups. An image apparatus including the lens module is also provided.Type: ApplicationFiled: July 25, 2012Publication date: June 20, 2013Applicant: YOUNG OPTICS INC.Inventors: Kuo-Chuan Wang, Sheng-Tang Lai
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Publication number: 20130056432Abstract: A mounting apparatus for fixing a slide rail to either a first rack post or a second rack post with different sizes or shapes of locating holes, includes a mounting bracket secured to the slide rail, a latch member rotatably mounted to the mounting bracket, and a restoring member. The mounting bracket includes a locating pin having a first segment adapted to extending through the first rack post locating hole, and a second segment adapted to extending through the second rack post locating hole. The latch member includes an arm received in the locating pin, with first and second holding teeth. In the locking position, either the first or the second teeth extend out of the locating pin to clasp the first or the second rack post, the unlocking position is achieved against spring pressure.Type: ApplicationFiled: September 18, 2011Publication date: March 7, 2013Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: SHU-CHEN LIN, CHEN-SHENG TANG
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Patent number: 8322668Abstract: A mounting apparatus for a slide rail includes a post, a mounting bracket, a fixing plate, and two fasteners. The post longitudinally defines two positioning holes. The mounting bracket is capable of being connected to an end of the slide rail. An end plate is formed on an end of the mounting bracket, and two through holes are defined in the end plate. The fixing plate defines two fixing holes. The fasteners are respectively extended through the positioning holes of the post and the through holes of the end plate, and engaged in the fixing holes of the fixing plate, to allow the fixing plate to be locked to the post. The mounting bracket is transversely slidably coupled to the post and the fixing plate via the two fasteners.Type: GrantFiled: April 1, 2011Date of Patent: December 4, 2012Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Chen-Sheng Tang, Shu-Chen Lin, Hsueh-Chin Lu, Hung-Ting Su
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Publication number: 20120299017Abstract: An LED emitter uses a molded lens with phosphor material embedded in a circumferential trench to generate a batwing beam pattern. After the lens is molded over a package substrate with connected LED dies thereon, the phosphor material is molded, injected, or dispensed into a circumferential trench. The molded lens is shaped such that a majority of the light emitted by the one or more LED dies is reflected by the top surface to the side surfaces through the phosphor material.Type: ApplicationFiled: May 24, 2011Publication date: November 29, 2012Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Ching-Yi CHEN, Yu-Sheng TANG, Hao-Yu YANG, Hsin-Hung CHEN, Tzu-Wen SHIH
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Publication number: 20120292274Abstract: A demountable mounting apparatus for fixing a slide rail to a post includes a mounting bracket secured to the slide rail, a coupling member fixed to the mounting bracket, a latch member rotatably mounted to the mounting bracket, and a restoring member between the latch member and the mounting bracket. The coupling member includes an inserting pin extending into the through hole of the post, and defining a receiving slot. The latch member includes an arm to be received in the receiving slot of the inserting pin, and a hook protruding from the arms. The latch member is locked in a position by the hooks engaging the far surface of the post. A rotation of latch member makes the hooks disengage from the post, thereby allowing the release of the slide rail from the post. The restoring member biases the latch member to the locked position.Type: ApplicationFiled: June 2, 2011Publication date: November 22, 2012Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: SHU-CHEN LIN, CHEN-SHENG TANG
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Publication number: 20120241784Abstract: A light-emitting diode (LED) package system includes a LED disposed over a surface of a substrate. A molding material covers the LED. A phosphor-containing material is disposed over and spaced from the LED by the molding material.Type: ApplicationFiled: March 22, 2011Publication date: September 27, 2012Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANTY, LTD.Inventors: Yu-Sheng Tang, Hsin-Hung Chen, Hao-Wei Ku
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Patent number: 8257829Abstract: The present invention fluorescence material has a particle diameter of the crystal area defined as dc, and the scope of dc is: 150 nm?dc?10 nm. The coat of the outside of the fluorescence material has one sheet of coating medium at least. Of course, there is at least a geometrical etching layer on the particle of the fluorescence material. The above-described structures will promote the extraction efficiency of light.Type: GrantFiled: February 9, 2009Date of Patent: September 4, 2012Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology CorporationInventors: Yu-Sheng Tang, Shu-Fen Hu, Ru-Shi Liu, Hung-Yuan Su, Cheng-Wen Tsai
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Publication number: 20120183242Abstract: A slide rail assembly includes a first slide member, and a second slide member. The first slide member defines an opening. The second slide member forms a cantilevered resilient arm extending forwards. An engaging portion is formed on a distal end of the resilient arm. When the second slide member is received in the first slide member, the engaging portion is pressed by the first slide member to deform the resilient arm away from the first slide member. When the second slide member is slid forwards to be out of the first slide member, the resilient arm is restored to allow the engaging portion to engage with a section of the first slide member bounding a front end of the opening, to prevent the second slide member from sliding out of the first slide member.Type: ApplicationFiled: April 14, 2011Publication date: July 19, 2012Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: CHEN-SHENG TANG, SHU-CHEN LIN, HUNG-TING SU
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Publication number: 20120175477Abstract: A mounting apparatus for a slide rail includes a post, a mounting bracket, a fixing plate, and two fasteners. The post longitudinally defines two positioning holes. The mounting bracket is capable of being connected to an end of the slide rail. An end plate is formed on an end of the mounting bracket, and two through holes are defined in the end plate. The fixing plate defines two fixing holes. The fasteners are respectively extended through the positioning holes of the post and the through holes of the end plate, and engaged in the fixing holes of the fixing plate, to allow the fixing plate to be locked to the post. The mounting bracket is transversely slidably coupled to the post and the fixing plate via the two fasteners.Type: ApplicationFiled: April 1, 2011Publication date: July 12, 2012Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: CHEN-SHENG TANG, SHU-CHEN LIN, HSUEH-CHIN LU, HUNG-TING SU
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Publication number: 20120104435Abstract: Two or more molded ellipsoid lenses are formed on a packaged LED die by injecting a glue material into a mold over the LED die and curing the glue material. After curing, the refractive index of the lens in contact with the LED die is greater than the refractive index of the lens not directly contacting the LED die. At least one phosphor material is incorporated into the glue material for at least one of the lenses not directly contacting the LED die. The lens directly contacting the LED die may also include one or more phosphor material. A high refractive index coating may be applied between the LED die and the lens.Type: ApplicationFiled: October 27, 2010Publication date: May 3, 2012Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hsiao-Wen LEE, Shang-Yu TSAI, Tien-Ming LIN, Chyi Shyuan CHERN, Hsin-Hsien WU, Fu-Wen LIU, Huai-En LAI, Yu-Sheng TANG
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Publication number: 20120097986Abstract: An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.Type: ApplicationFiled: October 22, 2010Publication date: April 26, 2012Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hao-Wei KU, Chung Yu WANG, Yu-Sheng Tang, Hsin-Hung Chen, Hao-Yu Yang, Ching-Yi Chen, Hsiao-Wen Lee, Chi Xiang Tseng, Sheng-Shin Guo, Tien-Ming Lin, Shang-Yu Tsai