Patents by Inventor Sheng-Wei Wu
Sheng-Wei Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12257610Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.Type: GrantFiled: January 26, 2024Date of Patent: March 25, 2025Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Bo Chen Chen, Sheng-Wei Wu, Yung-Li Tsai
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Patent number: 12252777Abstract: A physical vapor deposition (PVD) system is provided. The PVD system includes a PVD chamber defining a PVD volume within which a target material of a target is deposited onto a wafer. The PVD system includes the target in the PVD chamber. The target is configured to overlie the wafer. An edge of the target extends from a first surface of the target to a second surface of the target, opposite the first surface of the target. A first portion of the edge of the target has a first surface roughness. The first portion of the edge of the target extends at most about 6 millimeters from the first surface of the target to a second portion of the edge of the target. The second portion of the edge of the target has a second surface roughness less than the first surface roughness.Type: GrantFiled: May 7, 2021Date of Patent: March 18, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDInventors: Sheng-Ying Wu, Ming-Hsien Lin, Po-Wei Wang, Hsiao-Feng Lu
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Publication number: 20250082994Abstract: The present invention provides a method for training respiratory muscles comprising steps of setting a respiratory resistance, setting a training standard information, proceeding training procedure such that user performs at least one times of inhaling exercise or exhaling exercise under the respirator resistance so as to reach the training standard information. Alternatively, the present invention also provides apparatus for implementing the method. By means of adjusting the respiratory resistance for simulating breathing obstruction during the inhaling exercise or exhaling exercise, and setting inhaling or exhaling objective, the user could breathe according to the inhaling or exhaling objective, whereby the effect of training respiratory muscles could be achieved through the breathing exercises. We also use monitor devices on mask, mouth piece, pharyngeal muscle groups, abdominal or chest to ensure the trained muscle group function graded increment.Type: ApplicationFiled: September 6, 2024Publication date: March 13, 2025Inventors: Sung-Lien Lin, Jin-Liang Chen, Shan-San Wu, Sheng-Wei Peng
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Publication number: 20250068467Abstract: A contiguous memory allocation device includes a memory and a processor. The memory is configured to store at least one command. The processor is configured to read the at least one command to execute following steps: calculating a page thrashing value of the memory; determining a corresponding relation between the page thrashing value and a predetermined thrashing value; and deciding whether to lend a contiguous memory according to the corresponding relation.Type: ApplicationFiled: August 23, 2024Publication date: February 27, 2025Inventors: Yi-Kuan WU, Hsiang-Wei SUNG, Meng-Sin WU, Sheng-Kai HUNG, Tsai-Chin CHENG
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Publication number: 20250040148Abstract: A magnetoresistive random access memory (MRAM) includes a first transistor and a second transistor on a substrate, a source line coupled to a first source/drain region of the first transistor, and a first metal interconnection coupled to a second source/drain region of the first transistor. Preferably, the first metal interconnection is extended to overlap the first transistor and the second transistor and the first metal interconnection further includes a first end coupled to the second source/drain region of the first transistor and a second end coupled to a magnetic tunneling junction (MTJ).Type: ApplicationFiled: October 16, 2024Publication date: January 30, 2025Applicant: UNITED MICROELECTRONICS CORP.Inventors: Kuo-Hsing Lee, Sheng-Yuan Hsueh, Te-Wei Yeh, Chien-Liang Wu
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Publication number: 20250020692Abstract: An adhered multilayer die unit includes at least one probe zone and at least one non-probe zone for probes to be inserted in the probe zone. The adhered multilayer die unit includes dies and at least one adhesive layer. Each die includes at least one connecting surface, and through holes in the at least one probe zone for the probes to be inserted through the through holes of each die. The at least one adhesive layer adheres the connecting surfaces of the dies to each other. The at least one adhesive layer is entirely in the at least one non-probe zone. Accordingly, the adhered multilayer die unit of the invention has great structural strength in large-area condition, avoids drilling process difficulty problem and size restriction of fastening combining manner, avoids adhesive spillage and its affection on probes, and avoids adhesive-caused problems of adhesive spillage and die levelness deviation.Type: ApplicationFiled: April 15, 2024Publication date: January 16, 2025Applicant: MPI CORPORATIONInventors: SHENG-YU LIN, SHANG-JUNG HSIEH, CHE-WEI LIN, HSUEH-CHIH WU
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Publication number: 20240304481Abstract: The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.Type: ApplicationFiled: May 16, 2024Publication date: September 12, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Bo Chen CHEN, Sheng-Wei Wu, Yung-Li Tsai
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Patent number: 12020964Abstract: The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.Type: GrantFiled: March 21, 2022Date of Patent: June 25, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Bo Chen Chen, Sheng-Wei Wu, Yung-Li Tsai
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Publication number: 20240157412Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.Type: ApplicationFiled: January 26, 2024Publication date: May 16, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Bo Chen CHEN, Sheng-Wei Wu, Yung-Li Tsai
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Patent number: 11958090Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.Type: GrantFiled: July 28, 2022Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Bo Chen Chen, Sheng-Wei Wu, Yung-Li Tsai
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Patent number: 11927392Abstract: The present disclosure is directed to a wafer drying system and method that detects airborne molecular contaminants in a drying gas as a feedback parameter for a single wafer or multi-wafer drying process. For example, the system comprises a wafer drying station configured to dispense a drying gas over one or more wafers to dry the one or more wafers, a valve configured to divert the drying gas to a first portion and a second portion, and an exhaust line configured to exhaust the first portion of the drying gas. The system further comprises a detector configured to receive the second portion of the drying gas and to determine a real time property of the second portion of the drying gas, and a control unit configured to control a feedback operation of the wafer drying station based on the real time property of the second portion of the drying gas.Type: GrantFiled: March 29, 2021Date of Patent: March 12, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Wei-Chun Hsu, Sheng-Wei Wu, Shu-Yen Wang
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Publication number: 20230384030Abstract: The present disclosure is directed to a wafer drying system and method that detects airborne molecular contaminants in a drying gas as a feedback parameter for a single wafer or multi-wafer drying process. For example, the system comprises a wafer drying station configured to dispense a drying gas over one or more wafers to dry the one or more wafers, a valve configured to divert the drying gas to a first portion and a second portion, and an exhaust line configured to exhaust the first portion of the drying gas. The system further comprises a detector configured to receive the second portion of the drying gas and to determine a real time property of the second portion of the drying gas, and a control unit configured to control a feedback operation of the wafer drying station based on the real time property of the second portion of the drying gas.Type: ApplicationFiled: August 9, 2023Publication date: November 30, 2023Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Wei-Chun Hsu, Sheng-Wei Wu, Shu-Yen Wang
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Patent number: 11766703Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.Type: GrantFiled: August 6, 2019Date of Patent: September 26, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Bo Chen Chen, Sheng-Wei Wu, Yung-Li Tsai
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Publication number: 20230062848Abstract: A semiconductor device manufacturing system and a method for manufacturing semiconductor device are provided. The semiconductor device manufacturing system includes a substrate processing device and a processor. The substrate processing device includes a processing chamber, a gas supply module and a gas source. The processor is configured to monitor and control the gas supplied into the substrate processing device.Type: ApplicationFiled: August 30, 2021Publication date: March 2, 2023Inventors: WEI-CHUN HSU, YUNG-LI TSAI, SHENG-WEI WU, CHIH-HAO CHAO, YU-HAO HUANG
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Patent number: 11581199Abstract: A wafer drying method that detects molecular contaminants in a drying gas as a feedback parameter for a multiple wafer drying process is disclosed. For example, the method includes dispensing, in a wafer drying module, a drying gas over a batch of wafers. Further, the method includes collecting the drying gas from an exhaust of the wafer drying module and determining the concentration of contaminants in the drying gas. The method also includes re-dispensing the drying gas over the batch of wafers if the concentration of contaminants is greater than a baseline value and transferring the batch of wafers out of the wafer drying module if the concentration is equal to or less than the baseline value.Type: GrantFiled: May 24, 2019Date of Patent: February 14, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Wei-Chun Hsu, Sheng-Wei Wu, Shu-Yen Wang
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Publication number: 20230017404Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.Type: ApplicationFiled: July 28, 2022Publication date: January 19, 2023Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: BO CHEN CHEN, Sheng-Wei Wu, Yung-Li Tsai
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Publication number: 20220208581Abstract: The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.Type: ApplicationFiled: March 21, 2022Publication date: June 30, 2022Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Bo Chen CHEN, Sheng-Wei Wu, Yung-Li Tsai
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Patent number: 11282728Abstract: The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.Type: GrantFiled: June 10, 2019Date of Patent: March 22, 2022Inventors: Bo Chen Chen, Sheng-Wei Wu, Yung-Li Tsai
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Publication number: 20210215424Abstract: The present disclosure is directed to a wafer drying system and method that detects airborne molecular contaminants in a drying gas as a feedback parameter for a single wafer or multi-wafer drying process. For example, the system comprises a wafer drying station configured to dispense a drying gas over one or more wafers to dry the one or more wafers, a valve configured to divert the drying gas to a first portion and a second portion, and an exhaust line configured to exhaust the first portion of the drying gas. The system further comprises a detector configured to receive the second portion of the drying gas and to determine a real time property of the second portion of the drying gas, and a control unit configured to control a feedback operation of the wafer drying station based on the real time property of the second portion of the drying gas.Type: ApplicationFiled: March 29, 2021Publication date: July 15, 2021Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Wei-Chun HSU, Sheng-Wei Wu, Shu-Yen Wang
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Patent number: 10962285Abstract: A wafer drying method to detect airborne molecular contaminants in a drying gas as a feedback parameter for a single wafer or multi-wafer drying process is provided. For example, the method includes dispensing in a wafer drying station a drying gas over one or more wafers; collecting the drying gas from an exhaust of the wafer drying station; determining the concentration of contaminants in the drying gas; re-dispensing the drying gas over the one or more wafers if the concentration of contaminants is higher than a baseline value; and transferring the one or more wafers out of the wafer drying station if the concentration is equal to or less than the baseline value.Type: GrantFiled: July 13, 2018Date of Patent: March 30, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Wei-Chun Hsu, Sheng-Wei Wu, Shu-Yen Wang