Abstract: The present disclosure is directed to a wafer drying method that detects molecular contaminants in a drying gas as a feedback parameter for a multiple wafer drying process. For example, the method includes dispensing, in a wafer drying module, a drying gas over a batch of wafers. Further, the method includes collecting the drying gas from an exhaust of the wafer drying module and determining the concentration of contaminants in the drying gas. The method also includes re-dispensing the drying gas over the batch of wafers if the concentration of contaminants is greater than a baseline value and transferring the batch of wafers out of the wafer drying module if the concentration is equal to or less than the baseline value.

Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

Abstract: The present disclosure is directed to a wafer drying method that detects airborne molecular contaminants in a drying gas as a feedback parameter for a single wafer or multi-wafer drying process. For example, the method includes dispensing in a wafer drying station a drying gas over one or more wafers; collecting the drying gas from an exhaust of the wafer drying station; determining the concentration of contaminants in the drying gas; re-dispensing the drying gas over the one or more wafers if the concentration of contaminants is higher than a baseline value; and transferring the one or more wafers out of the wafer drying station if the concentration is equal to or less than the baseline value.

Abstract: The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.

Abstract: The present disclosure describes a method for controlling a wet processing system includes dispensing one or more chemicals into a processing chamber according to one or more process parameters. The method also includes injecting one or more illumination markers into the processing chamber and obtaining images representing locations of the one or more illumination markers. The method further includes determining a trajectory of an illumination marker of the one or more illumination markers based on the images and determining whether the determined trajectory is outside a predetermined trajectory range. In response to the determined trajectory being outside the predetermined trajectory range, the method further includes adjusting the one or more process parameters.

Abstract: A vertical furnace includes a heat treatment tube, at least one reactive gas inlet, first adiabatic plates and second adiabatic plates. The at least one reactive gas inlet is disposed at or near a bottom end of the heat treatment tube. The first adiabatic plates are stacked in the heat treatment tube, each of the first adiabatic plates having a flow channel structure for allowing a gas to pass through, in which all the corners in the flow channel structure are rounded. The second adiabatic plates are stacked below the first adiabatic plates in the heat treatment tube.

Abstract: A connector is provided, including a connector body, a fastener and an elastomer. The fastener is pivoted on the connector body with a hook end and a press end positioned on both sides thereof, respectively. The two ends of the elastomer contact the connector body and the press end of the fastener, respectively. The connector of the invention may accomplish plugging and unplugging of an electronic equipment in a single hand press way without bracer arrangement by a configuration of the press end, and may maintain an engagement state between the hook end and the electronic equipment with an arrangement of the elastomer.

Abstract: An optical-electrical converter includes a converter body, two optical-electrical conversion modules and a housing. One end of the converter body is provided with an optical fiber insertion port. The optical-electrical conversion modules are arranged on two sides of the converter body to perform conversion of optical-electrical signal, respectively. The housing is used for covering a portion of the converter body to shield the optical-electrical conversion modules. Because of multiple optical-electrical conversion modules provided by the optical-electrical converter, the arrangement number and volume of the optical-electrical converter in optical fiber network equipment may be reduced significantly to comply with the miniaturization trend of optical fiber network equipment.

Abstract: An optical transceiver device has an optical transceiver component, an O/E conversion substrate and a switch control substrate. The optical transceiver component is connected to the first, second optical fiber network equipments for the transmission of optical signal, respectively. The O/E conversion substrate is electrically connected to an in-line equipment at a first location for transmission of electrical signal, and may convert the received optical signal into the electrical signal or convert the received electrical signal into the optical signal. The switch control substrate is electrically connected with an optical switching switch and is connected with the in-line equipment at a second location to receive a control signal for the optical switch from the in-line equipment such that the optical switching switch operates at an normal mode or an bypass mode to guarantee normal network communication of the first, second optical network equipment.

Abstract: An electronic device includes a first body and a second body. The first body includes a first main body and a first magnetic element fixed in the first main body. The second body includes a second main body, a supporting unit, a second magnetic element, and a third magnetic element. The second main body is adapted to hold the first body. The supporting unit is pivoted to the second main body. The second magnetic element is fixed in the second main body. The third magnetic element is slidably configured in the second main body to restrict a rotation of the supporting unit relative to the second main body. When the first body leans against the second main body, the third magnetic element is subject to a magnetic attraction force from the first magnetic element and escapes from the supporting unit, so that the supporting unit supports the first body.

Abstract: A connector is provided, including a connector body, a fastener and an elastomer. The fastener is pivoted on the connector body with a hook end and a press end positioned on both sides thereof, respectively. The two ends of the elastomer contact the connector body and the press end of the fastener, respectively. The connector of the invention may accomplish plugging and unplugging of an electronic equipment in a single hand press way without bracer arrangement by a configuration of the press end, and may maintain an engagement state between the hook end and the electronic equipment with an arrangement of the elastomer.

Abstract: A vertical furnace includes a heat treatment tube, at least one reactive gas inlet, first adiabatic plates and second adiabatic plates. The at least one reactive gas inlet is disposed at or near a bottom end of the heat treatment tube. The first adiabatic plates are stacked in the heat treatment tube, each of the first adiabatic plates having a flow channel structure for allowing a gas to pass through, in which all the corners in the flow channel structure are rounded. The second adiabatic plates are stacked below the first adiabatic plates in the heat treatment tube.

Abstract: An optical-electrical converter includes a converter body, two optical-electrical conversion modules and a housing. One end of the converter body is provided with an optical fiber insertion port. The optical-electrical conversion modules are arranged on two sides of the converter body to perform conversion of optical-electrical signal, respectively. The housing is used for covering a portion of the converter body to shield the optical-electrical conversion modules. Because of multiple optical-electrical conversion modules provided by the optical-electrical converter, the arrangement number and volume of the optical-electrical converter in optical fiber network equipment may be reduced significantly to comply with the miniaturization trend of optical fiber network equipment.

Abstract: An optical transceiver device has an optical transceiver component, an O/E conversion substrate and a switch control substrate. The optical transceiver component is connected to the first, second optical fiber network equipments for the transmission of optical signal, respectively. The O/E conversion substrate is electrically connected to an in-line equipment at a first location for transmission of electrical signal, and may convert the received optical signal into the electrical signal or convert the received electrical signal into the optical signal. The switch control substrate is electrically connected with an optical switching switch and is connected with the in-line equipment at a second location to receive a control signal for the optical switch from the in-line equipment such that the optical switching switch operates at an normal mode or an bypass mode to guarantee normal network communication of the first, second optical network equipment.

Abstract: An electronic device includes a first body and a second body. The first body includes a first main body and a first magnetic element fixed in the first main body. The second body includes a second main body, a supporting unit, a second magnetic element, and a third magnetic element. The second main body is adapted to hold the first body. The supporting unit is pivoted to the second main body. The second magnetic element is fixed in the second main body. The third magnetic element is slidably configured in the second main body to restrict a rotation of the supporting unit relative to the second main body. When the first body leans against the second main body, the third magnetic element is subject to a magnetic attraction force from the first magnetic element and escapes from the supporting unit, so that the supporting unit supports the first body.