Abstract: A method of preparing carbon nanotube/polymer composite having electromagnetic interference (EMI) shielding effectiveness is disclosed, which includes: dispersing multi-walled carbon nanotubes (MWCNT) in an organic solvent such as N,N-Dimethylacetamide (DMAc); dissolving monomers such as methyl methacrylate (MMA) and an initiator such as 2,2-azobisisobutyronitrile (AIBN) in the MWCNT dispersion; and polymerizing the monomers in the resulting mixture at an elevated temperature such as 120° C. to form a MWCNT/PMMA composite. The composite is coated onto a PET film, and the coated PET film alone or a stack of multiple coated PET films can be applied as an EMI shielding material.

Abstract: The present invention relates to a thermoset resin modified polyimide resin composition, which comprises (a) polyimide resin, (b) cyanate, (c)bismaleimide, and (d) nanometer filler. By using the present thermoset resin modified polyimide resin composition, heat expansion coefficient of polyimide can be reduced. Also, heat resistance and dimension stability of the polyimide resin can be improved and thus it is suitable for cladding with copper foil to produce printed circuit board.

Abstract: The present invention relates to a polyimide composite flexible board and a process for preparing the same. The process comprises sequentially applying polyamic acids individually having a coefficient of thermal expansion (CTE) after imidization of more than 20 ppm and less than 20 ppm on a metal foil, subsequently subjecting the polyamic acids to imidization into polyimide by heating, to produce a polyimide composite flexible board, which is used as a printed circuit flexible board. According to the present invention, it can obtain a polyimide composite flexible board having an excellent mechanical property, high heat resistance, and excellent dimension stability, and no warp without using an adhering agent.

Abstract: The present invention relates to a polyimide composite flexible board and a process for preparing the same. The process comprises mixing a polyamic acid resin having a CTE value after imidization of more than 20 ppm and a polyamic acid resin having a CTE value after imidization of less than 20 ppm in a certain ratio, and coating the mixture on a metal foil, then subjecting the polyamic acids to imidization, to obtain the polyimide composite flexible board. According to the present invention, it can obtain a polyimide composite flexible board having an excellent mechanical property, high heat resistance, and excellent dimension stability, and no warp without using an adhering agent.

Abstract: The present invention relates to a polyimide composite flexible board and a process for preparing the same. The process comprises sequentially applying polyamic acids individually having a glass transition temperature of from 280 to 330° C. and from 190 to 280° C. after imidization on a metal foil, subsequently subjecting the polyamic acids to imidization into polyimide by heating, and then pressing the polyimide-containing metal foil with each other or with another metal foil under high temperature to produce a two-metal-side printed circuit flexible board. According to the present invention, it can obtain a polyimide composite flexible board having an excellent mechanical property, high heat resistance, and excellent dimension stability without using an adhering agent.

Abstract: The present invention relates to a polyimide composite flexible board and a process for preparing the same. The process comprises sequentially applying polyamic acids each having a glass transition temperature of from 280 to 300° C., from 300 to 350° C., and from 190 to 280° C. after imidization on a metal foil, subsequently subjecting the polyamic acids to imidization into polyimide by heating, and then pressing the polyimide-containing metal foil with a metal foil under high temperature to produce a two-metal-side printed circuit flexible board. According to the present invention, it can obtain a polyimide composite flexible board having an excellent mechanical property, high heat resistance, and excellent dimension stability without using an adhering agent.

Abstract: The present invention relates to a flame-retarding epoxy resin composition containing no halogen, which comprises an epoxy resin containing no halogen, a toughening agent, and a flame retarding agent. The present flame-retarding epoxy resin composition exhibits a high heat-resistance and excellent adhesion and is useful as adhesive agent in flexible printed circuit board.

Abstract: The present invention relates to a polyamic acid resin composition, which is characterized by containing nanolayer silica sheet and/or nanometer silica powder. The present invention also relates to a polyimide film prepared from the composition, the resultant film exhibits improved dimension stability, low water-absorbability, high transparency, and low Coefficient of Thermal Expansion (CTE) value and is suitable used in flexible print wiring board and wiring board for liquid crystal display (LCD).

Abstract: The present invention provides a polyimide resin, which is prepared by epolycondensing a dianhydride monomer including at least a dianhydride represented by formula (I) wherein R is O or O(CH2)nO, n is an integer of 1 to 2 and a diamine monomer represented by formula (II) H2N—Ar—NH2 ??(II) wherein Ar is defined as in the text then imidizing the resulting polyamic acid resin to form a polyimide resin. Through using the dianhydride represented by formula (I) as the polymerizing unit, a biphenyl moiety and an ester moiety are introduced into the main chain of the polyimide resin, such that the resulting polyimide resin has lower moisture absorption and smaller linear thermal expansion coefficient and therefore have satisfactory heat resistance and dimensional stability, in addition, become more soluble in organic solvents.

Abstract: The present invention provides a polyimide resin formed by polycondensating a dianhydride monomer including at least a dianhydride monomer represented by formula (I) and a diamine monomer to form a polyamic acid resin, and then cyclodehydrating the polyamic acid. Through using the dianhydride monomer of formula (I) as the polymerizing unit, a biphenyl moiety is introduced into the main chain of polyimide resin, such that the resulting polyimide resin has lower moisture absorption and smaller thermal expansion coefficient, as well as satisfactory heat resistance and dimensional stability.

Abstract: The present invention provides a polyoxyalkylene amine-modified polyamideimide resin and a polyamideimide resin composition includes said polyoxyalkylene amine-modified polyamideimide resin, a thermosetting resin and a rubber elastomer, and may further include an inorganic filler. The polyamideimide resin composition of the present invention has high heat resistance and high bond strength and can achieve sufficient adhesion at lower temperature, for example, 160 to 180° C. Thus, the resin composition of the present invention is suitable for use in bonding circuit boards and IC members.

Abstract: Disclosed is a halogen-free resin composition comprising: (A) one or more phosphorus-containing epoxy resins; (B) a hardener; (C) a hardening accelerator; (D) a polyphenylene oxide resin; and (E) a filling material, wherein the hardener of component B has the structure represented by the following formula (I): wherein each symbol is as defined above. The halogen-free resin composition of the present invention without adding halogen has excellent heat resistance and flame retardant property, and excellent dielectric property. The halogen-free resin composition of the present invention is particularly useful in the application of bonding sheets, composite materials, laminated plates, printed circuit boards, copper foil adhesives, inks used for build-up process, semiconductor packaging materials and the like.

Abstract: Disclosed is a halogen-free resin composition comprising: (A) one or more phosphorus-containing epoxy resins; (B) a hardener; (C) a hardening accelerator; (D) a polyphenylene oxide resin; and (E) a filling material, wherein the hardener of component B has the structure represented by the following formula (I): 1