Patents by Inventor Sheng-Yu Lin

Sheng-Yu Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11315513
    Abstract: A driving circuit for display panel is provided. Wherein, a first and a second power supply circuits produce a first and a second supply voltages. The electric charge provided by the second power supply circuit is less than that provided by the first power supply circuit. A plurality of drivers include a plurality of first power input terminals and a plurality of second power input terminals. The first power input terminals are coupled to the first power supply circuit and receives the first supply voltage. The second power input terminals are coupled to the second power supply circuit and receives the second supply voltage. The drivers increase the voltage levels of a plurality of gate signals in a voltage rising period according to the first supply voltage. The drivers hold the voltage levels of gate signals in a voltage holding period according to the second supply voltage.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: April 26, 2022
    Assignee: Sitronix Technology Corp.
    Inventors: Kuan-Chao Liao, Sheng-Yu Lin
  • Patent number: 11312123
    Abstract: A vacuum lamination system includes a film supply assembly, a film collection assembly, a lower lamination body, an upper lamination body, an air extractor, a moving assembly and a cutting assembly. The lower lamination body includes a first casing base and a lower heating assembly vertically movable and disposed in the first casing base. The lower heating assembly carries and moves the substrate so that the substrate is substantially flush with a top surface of the first casing base or retracted into the first casing base. The upper lamination body is vertically movable and disposed above the lower lamination body and includes an upper casing and an upper heating assembly disposed on the upper casing. The air extractor is connected to the lower lamination body. The moving assembly changes a height of a portion of the film. The cutting assembly cuts a portion of the film laminated onto the substrate.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: April 26, 2022
    Assignee: ELEADTK CO., LTD.
    Inventors: Ching-Nan Chang, Sheng-Yu Lin, Ming-Chan Chen
  • Publication number: 20210373048
    Abstract: A probe head includes upper and lower die units, and a linear probe inserted therethrough and thereby defined with tail, body and head portions. A first bottom surface of the upper die unit and a second top surface of the lower die unit face each other, thereby defining an inner space wherein the body portion is located and includes a plurality of sections each having front width larger than or equal to back width, including a narrowest section whose upper and lower ends have a distance from the first bottom surface and the second top surface respectively. The head and tail portions are offset from each other along two horizontal axes and the body portion is thereby curved. The present invention is favorable in dynamic behavior control of the linear probe which is easy in manufacturing, lower in cost and has more variety in material.
    Type: Application
    Filed: May 25, 2021
    Publication date: December 2, 2021
    Applicant: MPI Corporation
    Inventors: TZU-YANG CHEN, CHIN-YI LIN, CHEN-RUI WU, SHENG-YU LIN, MING-TA HSU, CHIA-JU WEI
  • Publication number: 20210370657
    Abstract: A vacuum lamination system includes a film supply assembly, a film collection assembly, a lower lamination body, an upper lamination body, an air extractor, a moving assembly and a cutting assembly. The lower lamination body includes a first casing base and a lower heating assembly vertically movable and disposed in the first casing base. The lower heating assembly carries and moves the substrate so that the substrate is substantially flush with a top surface of the first casing base or retracted into the first casing base. The upper lamination body is vertically movable and disposed above the lower lamination body and includes an upper casing and an upper heating assembly disposed on the upper casing. The air extractor is connected to the lower lamination body. The moving assembly changes a height of a portion of the film. The cutting assembly cuts a portion of the film laminated onto the substrate.
    Type: Application
    Filed: July 8, 2020
    Publication date: December 2, 2021
    Applicant: ELEADTK CO., LTD.
    Inventors: Ching-Nan Chang, Sheng-Yu Lin, Ming-Chan Chen
  • Publication number: 20210329790
    Abstract: A method of manufacturing a structure having conductive lines is disclosed by forming a patterned catalyst material layer on a substrate; activating the patterned catalyst material layer to form an activated patterned catalyst material layer including activated catalysts; and growing a conductive layer on the activated catalysts of the activated patterned catalyst material layer. The patterned catalyst material layer is formed from a catalyst material including 40 wt % to 90 wt % of polymer and 10 wt % to 60 wt % of catalyzer. An uppermost portion of the activated patterned catalyst material layer includes the activated catalysts, and the activated catalysts include metal reduced from the catalyzer. The pattern of the conductive layer corresponds to that of the patterned catalyst material layer. The structure of the conductive line of the disclosure has the characteristics of high conductivity.
    Type: Application
    Filed: June 29, 2021
    Publication date: October 21, 2021
    Inventors: Yu-Ming WANG, Sheng-Yu LIN, Wei-Yuan CHEN, Kai-Jiun WANG
  • Publication number: 20210043122
    Abstract: The invention relates to a source driver and a composite level shifter. The source driver comprises a data buffer circuit, a plurality of level shifters and a plurality of driving circuits. The data buffer circuit receives and registers a plurality of pixel data during a driving period. The level shifters convert the voltage levels of the pixel data registered in the data buffer circuit during the driving period. The driving circuits generate a plurality of source signals according to the converted pixel data during driving period. The data buffer circuit may comprise a plurality of composite level shifters for converting the voltage levels of the pixel data, and latching the converted pixel data.
    Type: Application
    Filed: October 1, 2019
    Publication date: February 11, 2021
    Inventor: SHENG-YU LIN
  • Patent number: 10913301
    Abstract: An array-type electrode, which may include a substrate, an isolating layer, an electrode and a micro-structure layer. The isolating layer may be disposed on one side of the substrate. The first part of the electrode may be disposed on one side of the substrate and covered by the isolating layer; the second part of the electrode penetrates through the substrate; the third part of the electrode may be disposed on the other side of the substrate; the first part may be connected to the third part via the second part. The micro-structure layer may be disposed on the isolating layer.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: February 9, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wei-Yuan Chen, Yu-Ming Wang, Sheng-Yu Lin, Yi-Wei Lin
  • Publication number: 20200258465
    Abstract: A driving circuit for display panel is provided. Wherein, a first and a second power supply circuits produce a first and a second supply voltages. The electric charge provided by the second power supply circuit is less than that provided by the first power supply circuit. A plurality of drivers include a plurality of first power input terminals and a plurality of second power input terminals. The first power input terminals are coupled to the firs power supply circuit and receives the first supply voltage. The second power input terminals are coupled to the second power supply circuit and receives the second supply voltage. The drivers increase the voltage levels of a plurality of gate signals in a voltage rising period according to the first supply voltage. The drivers hold the voltage levels of gate signals in a voltage holding period according to the second supply voltage.
    Type: Application
    Filed: December 20, 2018
    Publication date: August 13, 2020
    Inventors: KUAN-CHAO LIAO, SHENG-YU LIN
  • Publication number: 20190343004
    Abstract: A method of forming a protective film on at least one electronic module is provided. The method includes the following steps. A protective material is disposed on at least one electronic module such that the protective material and the electronic modules are in contact with each other. The electronic modules and the protective material disposed on the electronic modules are disposed in a chamber, and a first ambient pressure is provided in the chamber. The protective material in the chamber is heated to a first temperature to soften the protective material disposed on the electronic modules. After the protective material is softened, a second ambient pressure greater than the first ambient pressure is provided in the chamber, wherein a gas in the chamber directly pressurizes the protective material such that the protective material conformally covers a top of the electronic modules.
    Type: Application
    Filed: April 25, 2019
    Publication date: November 7, 2019
    Applicant: ELEADTK CO., LTD.
    Inventors: Ching-Nan Chang, Sheng-Yu Lin, Ming-Chan Chen
  • Patent number: 10342585
    Abstract: An apparatus, for reinforcing bone and tools for mounting the same, has an implant including a barrel and a device. The implant can be expanded by an expanding apparatus including an outer tube, a base, a hollow body and a handle. The expanding apparatus can be bound to the implant to place the implant into a bone to be treated and adjust the expansion degree. The expanding apparatus can be replaced by an injector apparatus including a container for bone cement and an injecting handle. The injector apparatus can inject a mixture for reinforcing bone (e.g., bone cement) into the bone through an exit, the device, the aperture, the barrel and the window of the barrel, and into the to-be treated area.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: July 9, 2019
    Assignee: CHANG GUNG UNIVERSITY
    Inventors: Shiuann-Sheng Lee, Wen-Jer Chen, Ching-Lung Tai, De-Mei Lee, Jiunn-Jong Wu, Chih-Ta Yu, Tsung-Hsin Wu, Sheng-Yu Lin
  • Publication number: 20190135010
    Abstract: An array-type electrode, which may include a substrate, an isolating layer, an electrode and a micro-structure layer. The isolating layer may be disposed on one side of the substrate. The first part of the electrode may be disposed on one side of the substrate and covered by the isolating layer; the second part of the electrode penetrates through the substrate; the third part of the electrode may be disposed on the other side of the substrate; the first part may be connected to the third part via the second part. The micro-structure layer may be disposed on the isolating layer.
    Type: Application
    Filed: December 26, 2017
    Publication date: May 9, 2019
    Inventors: WEI-YUAN CHEN, YU-MING WANG, SHENG-YU LIN, YI-WEI LIN
  • Publication number: 20190053381
    Abstract: A structure of conductive lines and method of manufacturing the same are disclosed by forming a patterned catalyst material layer on a substrate; activating the patterned catalyst material layer to form an activated patterned catalyst material layer comprising activated catalysts; and growing a conductive layer on the activated catalysts of the activated patterned catalyst material layer. The patterned catalyst material layer is formed from a catalyst material comprising 40 wt % to 90 wt % of polymer and 10 wt % to 60 wt % of catalyzer. An uppermost portion of the activated patterned catalyst material layer comprises the activated catalysts, and the activated catalysts comprises metal reduced from the catalyzer. The pattern of the conductive layer corresponds to that of the patterned catalyst material layer. The structure of the conductive line of the disclosure has the characteristics of high conductivity.
    Type: Application
    Filed: October 12, 2018
    Publication date: February 14, 2019
    Inventors: Yu-Ming WANG, Sheng-Yu LIN, Wei-Yuan CHEN, Kai-Jiun WANG
  • Patent number: 10050103
    Abstract: A method of making a metal insulator metal (MIM) capacitor includes forming a copper bulk layer in a base layer, wherein the copper bulk layer includes a hillock extending from a top surface thereof. The method further includes depositing an etch stop layer over the base layer and the copper bulk layer. The method further includes depositing an oxide-based dielectric layer over the etch stop layer. The method further includes forming a capacitor over the oxide-based dielectric layer. The method further includes forming a contact extending through the oxide-based dielectric layer and the etch stop layer to contact the copper bulk layer, wherein the forming of the contact removes the hillock.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: August 14, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Fang-Ting Kuo, Ren-Wei Xiao, Sheng Yu Lin, Chia-Wei Liu, Chun Hua Chang, Chien-Ying Wu
  • Publication number: 20170263694
    Abstract: A method of making a metal insulator metal (MIM) capacitor includes forming a copper bulk layer in a base layer, wherein the copper bulk layer includes a hillock extending from a top surface thereof. The method further includes depositing an etch stop layer over the base layer and the copper bulk layer. The method further includes depositing an oxide-based dielectric layer over the etch stop layer. The method further includes forming a capacitor over the oxide-based dielectric layer. The method further includes forming a contact extending through the oxide-based dielectric layer and the etch stop layer to contact the copper bulk layer, wherein the forming of the contact removes the hillock.
    Type: Application
    Filed: May 25, 2017
    Publication date: September 14, 2017
    Inventors: Fang-Ting KUO, Ren-Wei XIAO, Sheng Yu LIN, Chia-Wei LIU, Chun Hua CHANG, Chien-Ying WU
  • Patent number: 9666660
    Abstract: A metal insulator metal (MIM) capacitor includes a base layer and a copper bulk layer in the base layer. The MIM capacitor further includes an etch stop layer over the base layer and the copper bulk layer and an oxide-based dielectric layer over the etch stop layer. The MIM capacitor further includes a capacitor bottom layer over the oxide-based dielectric layer, an insulator layer over the capacitor bottom layer, and a capacitor top layer over the insulator layer.
    Type: Grant
    Filed: August 16, 2013
    Date of Patent: May 30, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Fang-Ting Kuo, Ren-Wei Xiao, Sheng Yu Lin, Chia-Wei Liu, Chun Hua Chang, Chien-Ying Wu
  • Publication number: 20170119442
    Abstract: An apparatus, for reinforcing bone and tools for mounting the same, has an implant including a barrel and a device. The implant can be expanded by an expanding apparatus including an outer tube, a base, a hollow body and a handle. The expanding apparatus can be bound to the implant to place the implant into a bone to be treated and adjust the expansion degree. The expanding apparatus can be replaced by an injector apparatus including a container for bone cement and an injecting handle. The injector apparatus can inject a mixture for reinforcing bone (e.g., bone cement) into the bone through an exit, the device, the aperture, the barrel and the window of the barrel, and into the to-be treated area.
    Type: Application
    Filed: January 11, 2017
    Publication date: May 4, 2017
    Applicant: CHANG GUNG UNIVERSITY
    Inventors: Shiuann-Sheng Lee, WEN-JER CHEN, CHING-LUNG TAI, DE-MEI LEE, JIUNN-JONG WU, CHIH-TA YU, TSUNG-HSIN WU, SHENG-YU LIN
  • Patent number: 9597136
    Abstract: An apparatus, for reinforcing bone and tools for mounting the same, has an implant including a barrel and a device. The implant can be expanded by an expanding apparatus including an outer tub, a base, a hollow body and a handle. The expanding apparatus can be bound to the implant to place the implant into a bone to be treated and adjust the expansion degree. The expanding apparatus can be replaced by an injector apparatus including a container for bone cement and an injecting handle. The injector apparatus can inject a mixture for reinforcing bone (e.g., bone cement) into the bone through an exit, the device, the aperture, the barrel and the window of the barrel, and into the to-be treated area.
    Type: Grant
    Filed: July 10, 2013
    Date of Patent: March 21, 2017
    Assignee: CHANG GUNG UNIVERSITY
    Inventors: Shiuann-Sheng Lee, Wen-Jer Chen, Ching-Lung Tai, De-Mei Lee, Jiunn-Jong Wu, Chih-Ta Yu, Tsung-Hsin Wu, Sheng-Yu Lin
  • Patent number: 9468095
    Abstract: A manufacturing method of multilayer wiring is provided, wherein a multilayer wiring structure including a wiring layer and a conductive via is formed on a substrate. The wiring layer is formed by forming a patterned colloidal layer having a first catalyzer on the substrate, activating the first catalyzer, and forming a conductive layer on a surface of the patterned colloidal layer. The conductive via is formed by forming an insulation colloidal layer containing a second catalyzer on the substrate and the conductive layer and forming at least one opening in the colloidal insulation layer by laser to expose the conductive layer and activate a portion of the second catalyzer. Electroless plating is performed on the activated second catalyzer to form the conductive via in the opening. An interface is between the patterned colloidal layer and the conductive layer in the multilayer wiring structure.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: October 11, 2016
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Ming Wang, Sheng-Yu Lin, Kai-Jiun Wang, Wei-Yuan Chen
  • Publication number: 20160157344
    Abstract: A structure of conductive lines and method of manufacturing the same are disclosed by forming a patterned catalyst material layer on a substrate, activating the patterned catalyst material layer and growing a conductive layer on the patterned catalyst material layer. The pattern of the conductive layer corresponds to that of the patterned catalyst material layer. The patterned catalyst material layer and the conductive layer formed thereon constitute the structure of conductive lines of the embodiment. The structure of the conductive line of the disclosure has the characteristics of high conductivity. According to the embodiment, the catalyst material layer includes at least 40 wt %˜90 wt % of polymer and 10 wt %˜60 wt % of catalyzer. The catalyzer comprises one or more materials selected from organic-metallic compounds, metal particles, or a combination thereof.
    Type: Application
    Filed: December 26, 2014
    Publication date: June 2, 2016
    Inventors: Yu-Ming WANG, Sheng-Yu LIN, Wei-Yuan CHEN, Kai-Jiun WANG
  • Publication number: 20150048483
    Abstract: A metal insulator metal (MIM) capacitor includes a base layer and a copper bulk layer in the base layer. The MIM capacitor further includes an etch stop layer over the base layer and the copper bulk layer and an oxide-based dielectric layer over the etch stop layer. The MIM capacitor further includes a capacitor bottom layer over the oxide-based dielectric layer, an insulator layer over the capacitor bottom layer, and a capacitor top layer over the insulator layer.
    Type: Application
    Filed: August 16, 2013
    Publication date: February 19, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Fang-Ting KUO, Ren-Wei XIAO, Sheng Yu LIN, Chia-Wei LIU, Chun Hua CHANG, Chien-Ying WU