Patents by Inventor Sheng-Yu Lin

Sheng-Yu Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170119442
    Abstract: An apparatus, for reinforcing bone and tools for mounting the same, has an implant including a barrel and a device. The implant can be expanded by an expanding apparatus including an outer tube, a base, a hollow body and a handle. The expanding apparatus can be bound to the implant to place the implant into a bone to be treated and adjust the expansion degree. The expanding apparatus can be replaced by an injector apparatus including a container for bone cement and an injecting handle. The injector apparatus can inject a mixture for reinforcing bone (e.g., bone cement) into the bone through an exit, the device, the aperture, the barrel and the window of the barrel, and into the to-be treated area.
    Type: Application
    Filed: January 11, 2017
    Publication date: May 4, 2017
    Applicant: CHANG GUNG UNIVERSITY
    Inventors: Shiuann-Sheng Lee, WEN-JER CHEN, CHING-LUNG TAI, DE-MEI LEE, JIUNN-JONG WU, CHIH-TA YU, TSUNG-HSIN WU, SHENG-YU LIN
  • Patent number: 9597136
    Abstract: An apparatus, for reinforcing bone and tools for mounting the same, has an implant including a barrel and a device. The implant can be expanded by an expanding apparatus including an outer tub, a base, a hollow body and a handle. The expanding apparatus can be bound to the implant to place the implant into a bone to be treated and adjust the expansion degree. The expanding apparatus can be replaced by an injector apparatus including a container for bone cement and an injecting handle. The injector apparatus can inject a mixture for reinforcing bone (e.g., bone cement) into the bone through an exit, the device, the aperture, the barrel and the window of the barrel, and into the to-be treated area.
    Type: Grant
    Filed: July 10, 2013
    Date of Patent: March 21, 2017
    Assignee: CHANG GUNG UNIVERSITY
    Inventors: Shiuann-Sheng Lee, Wen-Jer Chen, Ching-Lung Tai, De-Mei Lee, Jiunn-Jong Wu, Chih-Ta Yu, Tsung-Hsin Wu, Sheng-Yu Lin
  • Patent number: 9468095
    Abstract: A manufacturing method of multilayer wiring is provided, wherein a multilayer wiring structure including a wiring layer and a conductive via is formed on a substrate. The wiring layer is formed by forming a patterned colloidal layer having a first catalyzer on the substrate, activating the first catalyzer, and forming a conductive layer on a surface of the patterned colloidal layer. The conductive via is formed by forming an insulation colloidal layer containing a second catalyzer on the substrate and the conductive layer and forming at least one opening in the colloidal insulation layer by laser to expose the conductive layer and activate a portion of the second catalyzer. Electroless plating is performed on the activated second catalyzer to form the conductive via in the opening. An interface is between the patterned colloidal layer and the conductive layer in the multilayer wiring structure.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: October 11, 2016
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Ming Wang, Sheng-Yu Lin, Kai-Jiun Wang, Wei-Yuan Chen
  • Publication number: 20160157344
    Abstract: A structure of conductive lines and method of manufacturing the same are disclosed by forming a patterned catalyst material layer on a substrate, activating the patterned catalyst material layer and growing a conductive layer on the patterned catalyst material layer. The pattern of the conductive layer corresponds to that of the patterned catalyst material layer. The patterned catalyst material layer and the conductive layer formed thereon constitute the structure of conductive lines of the embodiment. The structure of the conductive line of the disclosure has the characteristics of high conductivity. According to the embodiment, the catalyst material layer includes at least 40 wt %˜90 wt % of polymer and 10 wt %˜60 wt % of catalyzer. The catalyzer comprises one or more materials selected from organic-metallic compounds, metal particles, or a combination thereof.
    Type: Application
    Filed: December 26, 2014
    Publication date: June 2, 2016
    Inventors: Yu-Ming WANG, Sheng-Yu LIN, Wei-Yuan CHEN, Kai-Jiun WANG
  • Publication number: 20150048483
    Abstract: A metal insulator metal (MIM) capacitor includes a base layer and a copper bulk layer in the base layer. The MIM capacitor further includes an etch stop layer over the base layer and the copper bulk layer and an oxide-based dielectric layer over the etch stop layer. The MIM capacitor further includes a capacitor bottom layer over the oxide-based dielectric layer, an insulator layer over the capacitor bottom layer, and a capacitor top layer over the insulator layer.
    Type: Application
    Filed: August 16, 2013
    Publication date: February 19, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Fang-Ting KUO, Ren-Wei XIAO, Sheng Yu LIN, Chia-Wei LIU, Chun Hua CHANG, Chien-Ying WU
  • Publication number: 20140135780
    Abstract: An apparatus for reinforcing bone and tools for mounting the same are provided. The apparatus comprises an implant, including a barrel and a device. The implant can be expanded by an expanding apparatus, comprising an outer tube and a base, a hollow body and a handler. The expanding apparatus can be bound to the implant to place the implant into a bone to be treated and adjust the expansion degree. The expanding apparatus can be replaced by an injector apparatus, which comprises a container for bone cement and an injecting handler. The injector apparatus can inject a mixture for reinforcing bone (e.g., bone cement) into the bone through an exit, the device, the aperture, the barrel and the window of the barrel, and into the to-be treated area.
    Type: Application
    Filed: July 10, 2013
    Publication date: May 15, 2014
    Inventors: Shiuann-Sheng Lee, WEN-JER CHEN, CHING-LUNG TAl, DE-MEl LEE, JIUNN-JONG WU, CHIH-TA YU, TSUNG-HSIN WU, SHENG-YU LIN
  • Publication number: 20110093252
    Abstract: A method of accurately simulating a target machine on a simulator, wherein, a mapping table is set up in a main program to record correspondence relations between target machine instructions and host machine instructions, and a signal handler is registered in a host machine for calling said mapping table. When an interrupt occurs while said simulator is performing simulation for a target program on the host machine, signal handler searches the mapping table to obtain or dynamically calculates to obtain host machine instruction corresponding to the next target machine instruction to be executed in target program; and replacing said host machine instruction with a return instruction, thus when executing said return instruction, the simulator will return to main program in checking said interrupt and proceeding with necessary proceedings required. Through the present invention, when said interrupt occurs, said simulator may return to main program in time for handling the interrupt.
    Type: Application
    Filed: October 16, 2009
    Publication date: April 21, 2011
    Inventors: Shi-Wu Lo, Sheng-Yu Lin, Yi Lee