Patents by Inventor Sheng YU

Sheng YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11027900
    Abstract: A cap closing structure for a sealed container includes an upper cover, a lower cover, an elastic element and a handle member. The upper cover includes a top plate having a through hole and a circumferential bracket having a retaining slanted surface. The lower cover underneath the upper cover includes a base plate having a latch member penetrating into the through hole and a sealing ring. The latch member includes a guiding structure. One end of the sealing ring is at outer side of the retaining slanted surface. The elastic element is mounted onto the latch member and clamped between the top and base plates. The handle member includes a dial lever and an arm with a shaft operably moving inside the guiding structure for the sealing ring to be sealed between the retaining slanted surface and container.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: June 8, 2021
    Assignees: FREE-FREE(USA) INC, FREE-FREE INDUSTRIAL CORP
    Inventor: Sheng-Yu Liu
  • Patent number: 11032600
    Abstract: A method for controlling the operation of a plurality of consumer electronic devices by displaying a plurality of broadcast channel identifiers each corresponding to a broadcast channel in a display of a controlling device adapted to command at least channel tuning operations of the plurality of consumer electronic devices. Input is accepted into the controlling device that functions to designate one of the plurality of broadcast channel identifiers and the controlling device uses the designation of the one of the plurality of broadcast channel identifiers to cause a transmission of a wireless signal from the controlling device to a one of the plurality of consumer electronic devices to thereby cause the one of the plurality of consumer electronic devices to tune to the broadcast channel corresponding to the designated one of the plurality of broadcast channel identifiers.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: June 8, 2021
    Assignee: Universal Electronics Inc.
    Inventors: Joseph Lee Haughawout, Mauro Dresti, Sandro David Klein, Alex Louie, Han-Sheng Yu, Steve LanPing Huang, Patrick H. Hayes, Weidong William Wang
  • Publication number: 20210165555
    Abstract: The technology disclosed relates to user interfaces for controlling augmented reality environments. Real and virtual objects can be seamlessly integrated to form an augmented reality by tracking motion of one or more real objects within view of a wearable sensor system using a combination a RGB (red, green, and blue) and IR (infrared) pixels of one or more cameras. It also relates to enabling multi-user collaboration and interaction in an immersive virtual environment. In particular, it relates to capturing different sceneries of a shared real world space from the perspective of multiple users. The technology disclosed further relates to sharing content between wearable sensor systems. In particular, it relates to capturing images and video streams from the perspective of a first user of a wearable sensor system and sending an augmented version of the captured images and video stream to a second user of the wearable sensor system.
    Type: Application
    Filed: February 12, 2021
    Publication date: June 3, 2021
    Applicant: Ultrahaptics IP Two Limited
    Inventors: David S. Holz, Barrett Fox, Kyle A. Hay, Gabriel A. Hare, Wilbur Yung Sheng Yu, Dave Edelhart, Jody Medich, Daniel Plemmons
  • Publication number: 20210118833
    Abstract: Connector structures and methods of forming the same are provided. A method includes forming a first patterned passivation layer on a workpiece, the first patterned passivation layer having a first opening exposing a conductive feature of the workpiece. A seed layer is formed over the first patterned passivation layer and in the first opening. A patterned mask layer is formed over the seed layer, the patterned mask layer having a second opening exposing the seed layer, the second opening overlapping with the first opening. A connector is formed in the second opening. The patterned mask layer is partially removed, an unremoved portion of the patterned mask layer remaining in the first opening. The seed layer is patterned using the unremoved portion of the patterned mask layer as a mask.
    Type: Application
    Filed: December 7, 2020
    Publication date: April 22, 2021
    Inventors: Chen-Shien Chen, Sheng-Yu Wu, Mirng-Ji Lii, Chita Chuang
  • Patent number: 10985114
    Abstract: A system and method for preventing cracks in a passivation layer is provided. In an embodiment a contact pad has a first diameter and an opening through the passivation layer has a second diameter, wherein the first diameter is greater than the second diameter by a first distance of about 10 ?m. In another embodiment, an underbump metallization is formed through the opening, and the underbump metallization has a third diameter that is greater than the first diameter by a second distance of about 5 ?m. In yet another embodiment, a sum of the first distance and the second distance is greater than about 15 ?m. In another embodiment the underbump metallization has a first dimension that is less than a dimension of the contact pad and a second dimension that is greater than a dimension of the contact pad.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: April 20, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Feng Chen, Yen-Liang Lin, Tin-Hao Kuo, Sheng-Yu Wu, Chen-Shien Chen
  • Patent number: 10976655
    Abstract: A lithography system includes a radiation source configured to generate an extreme ultraviolet (EUV) light. The lithography system includes a mask that defines one or more features of an integrated circuit (IC). The lithography system includes an illuminator configured to direct the EUV light onto the mask. The mask diffracts the EUV light into a 0-th order ray and a plurality of higher order rays. The lithography system includes a wafer stage configured to secure a wafer that is to be patterned according to the one or more features defined by the mask. The lithography system includes a pupil phase modulator positioned in a pupil plane that is located between the mask and the wafer stage. The pupil phase modulator is configured to change a phase of the 0-th order ray.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: April 13, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yen-Cheng Lu, Shinn-Sheng Yu, Jeng-Horng Chen, Anthony Yen
  • Publication number: 20210096475
    Abstract: A method of manufacturing a semiconductor device includes dividing a number of dies along an x axis in a die matrix in each exposure field in an exposure field matrix delineated on the semiconductor substrate, wherein the x axis is parallel to one edge of a smallest rectangle enclosing the exposure field matrix. A number of dies is divided along a y axis in the die matrix, wherein the y axis is perpendicular to the x axis. Sequences SNx0, SNx1, SNx, SNxr, SNy0, SNy1, SNy, and SNyr are formed. p*(Nbx+1)?2 stepping operations are performed in a third direction and first sequence exposure/stepping/exposure operations and second sequence exposure/stepping/exposure operations are performed alternately between any two adjacent stepping operations as well as before a first stepping operation and after a last stepping operation. A distance of each stepping operation in order follows the sequence SNx.
    Type: Application
    Filed: December 14, 2020
    Publication date: April 1, 2021
    Inventors: Shinn-Sheng YU, Ru-Gun LIU, Hsu-Ting HUANG, Kenji YAMAZOE, Minfeng CHEN, Shuo-Yen CHOU, Chin-Hsiang LIN
  • Patent number: 10965406
    Abstract: Methods described herein are for wireless communication systems. One aspect of the invention is directed to a method for a HARQ process, in which the HARQ process includes a first transmission of an encoder packet and at least one retransmission. The method involves allocating a transmission resource for each respective transmission. The method involves transmitting control information from a base station to a mobile station for each respective transmission. The control information includes information to uniquely identify the HARQ process and an identification of one of a time resource, a frequency resource and a time and frequency resource that is allocated for the transmission. In some embodiments of the invention, specific control information is signalled from a base station to a mobile station to enable RAS-HARQ operation. In some embodiments of the invention, retransmission signaling in included as part of regular unicast signaling used for both first transmission and retransmissions.
    Type: Grant
    Filed: December 8, 2019
    Date of Patent: March 30, 2021
    Assignee: Apple Inc.
    Inventors: Mo-han Fong, Sophie Vrzic, Robert Novak, Jun Yuan, Dong-Sheng Yu
  • Patent number: 10955746
    Abstract: An extreme ultraviolet lithography method is disclosed. In an example, the EUVL method includes forming a resist layer on a substrate; performing a first exposure process to image a first pattern of a first sub-region of a first mask to the resist layer; performing a second exposure process to image a second pattern of a second sub-region of the first mask to the resist layer; and performing a third exposure process to image a third pattern of a first sub-region of a second mask to the resist layer. The second and third patterns are identical to the first pattern. The first, second and third exposure processes collectively form a latent image of the first pattern on the resist layer.
    Type: Grant
    Filed: January 3, 2018
    Date of Patent: March 23, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shinn-Sheng Yu, Ching-Fang Yu, Wen-Chuan Wang, Ting-Hao Hsu, Sheng-Chi Chin, Anthony Yen
  • Publication number: 20210084665
    Abstract: A method and system are provided for scheduling data transmission in a Multiple-Input Multiple-Output (MIMO) system. The MIMO system may comprise at least one MIMO transmitter and at least one MIMO receiver. Feedback from one or more receivers may be used by a transmitter to improve quality, capacity, and scheduling in MIMO communication systems. The method may include generating or receiving information pertaining to a MIMO channel metric and information pertaining to a Channel Quality Indicator (CQI) in respect of a transmitted signal; and sending a next transmission to a receiver using a MIMO mode selected in accordance with the information pertaining to the MIMO channel metric, and an adaptive coding and modulation selected in accordance with the information pertaining to the CQI.
    Type: Application
    Filed: November 13, 2020
    Publication date: March 18, 2021
    Inventors: Wen Tong, Ming Jia, Jianming WU, Dong-Sheng Yu, Peiying Zhu
  • Publication number: 20210076510
    Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.
    Type: Application
    Filed: September 6, 2019
    Publication date: March 11, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ming-Hung CHEN, Yung I. YEH, Chang-Lin YEH, Sheng-Yu CHEN
  • Publication number: 20210066354
    Abstract: A semiconductor device package includes a main substrate, at least one thin film transistor (TFT) module, at least one first electronic component, at least one encapsulant and a plurality of light emitting devices. The main substrate has a first surface and a second surface opposite to the first surface. The thin film transistor (TFT) module is disposed adjacent to and electrically connected to the first surface of the main substrate. The first electronic component is disposed adjacent to and electrically connected to the first surface of the main substrate. The encapsulant covers the at least one thin film transistor (TFT) module and the at least one first electronic component. The light emitting devices are electrically connected to the at least one thin film transistor (TFT) module.
    Type: Application
    Filed: August 30, 2019
    Publication date: March 4, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ming-Hung CHEN, Yung I. YEH, Chang-Lin YEH, Sheng-Yu CHEN
  • Publication number: 20210056076
    Abstract: A novel high-throughput embedding generation and comparison system for executable code is presented in this invention. More specifically, the invention relates to a deep-neural-network based graph embedding generation and comparison system. A novel bi-directional code graph embedding generation has been proposed to enrich the information extracted from code graph. Furthermore, by deploying matrix manipulation, the throughput of the system has significantly increased for embedding generation. Potential applications such as executable file similarity calculation, vulnerability search are also presented in this invention.
    Type: Application
    Filed: May 12, 2020
    Publication date: February 25, 2021
    Inventors: Heng Yin, Xunchao Hu, Sheng Yu, Yu Zheng
  • Publication number: 20210057572
    Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.
    Type: Application
    Filed: August 23, 2019
    Publication date: February 25, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ming-Hung CHEN, Sheng-Yu CHEN, Chang-Lin YEH, Yung-I YEH
  • Publication number: 20210057398
    Abstract: A semiconductor device package includes a first substrate, a dielectric layer, a thin film transistor (TFT) and an electronic component. The first substrate has a first surface and a second surface opposite to the first surface. The dielectric layer is disposed on the first surface of the first substrate. The dielectric layer has a first surface facing away from the first substrate and a second surface opposite to the first surface. The TFT layer is disposed on the dielectric layer. The electronic component is disposed on the second surface of the first substrate. A roughness of the first surface of the dielectric layer is less than a roughness of the first surface of the first substrate.
    Type: Application
    Filed: August 23, 2019
    Publication date: February 25, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ming-Hung CHEN, Sheng-Yu CHEN, Chang-Lin YEH, Yung-I YEH
  • Patent number: 10921949
    Abstract: The technology disclosed relates to user interfaces for controlling augmented reality environments. Real and virtual objects can be seamlessly integrated to form an augmented reality by tracking motion of one or more real objects within view of a wearable sensor system using a combination a RGB (red, green, and blue) and IR (infrared) pixels of one or more cameras. It also relates to enabling multi-user collaboration and interaction in an immersive virtual environment. In particular, it relates to capturing different sceneries of a shared real world space from the perspective of multiple users. The technology disclosed further relates to sharing content between wearable sensor systems. In particular, it relates to capturing images and video streams from the perspective of a first user of a wearable sensor system and sending an augmented version of the captured images and video stream to a second user of the wearable sensor system.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: February 16, 2021
    Assignee: Ultrahaptics IP Two Limited
    Inventors: David S. Holz, Barrett Fox, Kyle A. Hay, Gabriel A. Hare, Wilbur Yung Sheng Yu, Dave Edelhart, Jody Medich, Daniel Plemmons
  • Publication number: 20210043122
    Abstract: The invention relates to a source driver and a composite level shifter. The source driver comprises a data buffer circuit, a plurality of level shifters and a plurality of driving circuits. The data buffer circuit receives and registers a plurality of pixel data during a driving period. The level shifters convert the voltage levels of the pixel data registered in the data buffer circuit during the driving period. The driving circuits generate a plurality of source signals according to the converted pixel data during driving period. The data buffer circuit may comprise a plurality of composite level shifters for converting the voltage levels of the pixel data, and latching the converted pixel data.
    Type: Application
    Filed: October 1, 2019
    Publication date: February 11, 2021
    Inventor: SHENG-YU LIN
  • Patent number: 10913301
    Abstract: An array-type electrode, which may include a substrate, an isolating layer, an electrode and a micro-structure layer. The isolating layer may be disposed on one side of the substrate. The first part of the electrode may be disposed on one side of the substrate and covered by the isolating layer; the second part of the electrode penetrates through the substrate; the third part of the electrode may be disposed on the other side of the substrate; the first part may be connected to the third part via the second part. The micro-structure layer may be disposed on the isolating layer.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: February 9, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wei-Yuan Chen, Yu-Ming Wang, Sheng-Yu Lin, Yi-Wei Lin
  • Publication number: 20210028266
    Abstract: A display device includes a semiconductor substrate, an isolation layer, a light-emitting layer and a second electrode. The semiconductor substrate has a pixel region and a peripheral region located around the pixel region. The semiconductor substrate includes first electrodes and a driving element layer. The first electrodes are disposed in the pixel region and the first electrodes are electrically connected to the driving element layer. The isolation layer is disposed on the semiconductor substrate. The isolation layer includes a first isolation pattern disposed in the peripheral region, and the first isolation pattern has a first side surface and a second side surface opposite to the first side surface. The light-emitting layer is disposed on the isolation layer and the first electrodes, and covers the first side surface and the second side surface of the first isolation pattern. The second electrode is disposed on the light-emitting layer.
    Type: Application
    Filed: May 4, 2020
    Publication date: January 28, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Sheng-Yu Wu, Mirng-Ji Lii, Shang-Yun Tu, Ching-Hui Chen
  • Publication number: 20210014616
    Abstract: A wireless audio output device including a first audio output unit and a second audio output unit is provided. The wireless audio output device establishes a wireless link with an audio source, which outputs a first original audio data and a second original audio data. The first and the second audio output units simultaneously output and play the first and the second original audio data. When the first audio output unit successfully receives the first original audio data but the second audio output unit fails to receive the second original audio data, the first audio output unit drops the received first original audio data, and the first and the second audio output units generate a first concealment audio data and a second concealment audio data, respectively, by using a PLC algorithm and play the first concealment audio data and the second concealment audio data, respectively.
    Type: Application
    Filed: July 10, 2020
    Publication date: January 14, 2021
    Inventors: Sheng-Yu CHIU, Kai-Sheng CHEN, Hsi-Yuan TSAI, Chih-Kang WANG