Patents by Inventor Shepard D. Johnson
Shepard D. Johnson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8809734Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.Type: GrantFiled: July 3, 2012Date of Patent: August 19, 2014Assignee: Electron Scientific Industries, Inc.Inventors: James J. Cordingley, Jonathan S. Ehrmann, David M. Filgas, Shepard D. Johnson, Joohan Lee, Donald V. Smart, Donald J. Svetkoff
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Publication number: 20130200050Abstract: The present invention relates to the field of laser processing methods and systems, and specifically, to laser processing methods and systems for laser processing multi-material devices. Systems and methods may utilize high speed deflectors to improve processing energy window and/or improve processing speed. In some embodiments, a deflector is used for non-orthogonal scanning of beam spots. In some embodiment, a deflector is used to implement non-synchronous processing of target structures.Type: ApplicationFiled: September 10, 2012Publication date: August 8, 2013Applicant: GSI GROUP CORPORATIONInventors: Jonathan S. Ehrmann, Joseph J. Griffiths, James J. Cordingley, Donald J. Svetkoff, Shepard D. Johnson, Michael Plotkin
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Patent number: 8329600Abstract: A method, system and scan lens for use therein are provided for high-speed, laser-based, precise laser trimming at least one electrical element along a trim path. The method includes generating a pulsed laser output with a laser, the output having one or more laser pulses at a repetition rate. A fast rise/fall time, pulse-shaped q-switched laser or an ultra-fast laser may be used. Beam shaping optics may be used to generate a flat-top beam profile. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance, high absorption and reduced or eliminated heat-affected zone (HAZ) along the trim path, but not so short so as to cause microcracking. In this way, resistance drift after the trimming process is reduced.Type: GrantFiled: July 8, 2009Date of Patent: December 11, 2012Assignee: GSI Group CorporationInventors: Bo Gu, Jonathan S. Ehrmann, Joseph V. Lento, Bruce L. Couch, Yun Fee Chu, Shepard D. Johnson
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Publication number: 20120276754Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.Type: ApplicationFiled: July 3, 2012Publication date: November 1, 2012Applicant: GSI GROUP CORPORATIONInventors: James J. Cordingley, Jonathan S. Ehrmann, David M. Filgas, Shepard D. Johnson, Joohan Lee, Donald V. Smart, Donald J. Svetkoff
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Patent number: 8269137Abstract: The present invention relates to the field of laser processing methods and systems, and specifically, to laser processing methods and systems for laser processing multi-material devices. Systems and methods may utilize high speed deflectors to improve processing energy window and/or improve processing speed. In some embodiments, a deflector is used for non-orthogonal scanning of beam spots. In some embodiment, a deflector is used to implement non-synchronous processing of target structures.Type: GrantFiled: September 18, 2008Date of Patent: September 18, 2012Assignee: GSI Group CorporationInventors: Jonathan S. Ehrmann, Joseph J. Griffiths, James J. Cordingley, Donald J. Svetkoff, Shepard D. Johnson, Michael Plotkin
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Patent number: 8253066Abstract: Laser-based methods and systems for removing one or more target link structures of a circuit fabricated on a substrate includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.Type: GrantFiled: November 19, 2010Date of Patent: August 28, 2012Assignee: GSI Group CorporationInventors: Bo Gu, Donald V. Smart, James J. Cordingley, Joohan Lee, Donald J. Svetkoff, Shepard D. Johnson, Jonathan S. Ehrmann
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Patent number: 8217304Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.Type: GrantFiled: March 27, 2002Date of Patent: July 10, 2012Assignee: GSI Group CorporationInventors: James J. Cordingley, Jonathan S. Ehrmann, David M. Filgas, Shepard D. Johnson, Joohan Lee, Donald V. Smart, Donald J. Svetkoff
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Publication number: 20120083049Abstract: A method is disclosed for on-the-fly processing at least one structure of a group of structures with a pulsed laser output, The method includes the steps of relatively positioning the group of structures and the pulsed laser output axis with non-constant velocity, and applying the pulsed laser output to the at least one structure of the group of structures during the step of relatively positioning the group of structures and the pulsed laser output axis with non-constant velocity.Type: ApplicationFiled: November 23, 2011Publication date: April 5, 2012Applicant: GSI GROUP CORPORATIONInventors: Shepard D. Johnson, Bo Gu
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Patent number: 8084706Abstract: A method is disclosed for on-the-fly processing at least one structure of a group of structures with a pulsed laser output. The method includes the steps of relatively positioning the group of structures and the pulsed laser output axis with non-constant velocity, and applying the pulsed laser output to the at least one structure of the group of structures during the step of relatively positioning the group of structures and the pulsed laser output axis with non-constant velocity.Type: GrantFiled: September 15, 2006Date of Patent: December 27, 2011Assignee: GSI Group CorporationInventors: Shepard D. Johnson, Bo Gu
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Publication number: 20110210105Abstract: Link processing systems and methods use controlled two dimensional deflection of a beam along an optical axis trajectory to process links positioned along and transverse to the trajectory during a pass of the optical axis along the trajectory. Predictive position calculations allow link blowing accuracy during constant velocity and accelerating trajectories.Type: ApplicationFiled: December 22, 2010Publication date: September 1, 2011Applicant: GSI GROUP CORPORATIONInventors: Dmitry N. Romashko, Michael Plotkin, Jonathan S. Ehrmann, James J. Cordingley, Shepard D. Johnson
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Patent number: 7955906Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.Type: GrantFiled: July 1, 2008Date of Patent: June 7, 2011Assignee: GSI Group CorporationInventors: James J. Cordingley, Jonathan S. Ehrman, David M. Filgas, Shepard D. Johnson, Joohan Lee, Donald V. Smart, Donald J. Svetkoff
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Patent number: 7955905Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.Type: GrantFiled: December 20, 2006Date of Patent: June 7, 2011Assignee: GSI Group CorporationInventors: James J. Cordingley, Jonathan S. Ehrmann, David M. Filgas, Shepard D. Johnson, Joohan Lee, Donald V. Smart, Donald J. Svetkoff
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Publication number: 20110108534Abstract: A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. Beam scanning and deflection are both used to distribute beam spots to elements of an array of elements for selective processing. The deflection can be performed with a solid state deflector.Type: ApplicationFiled: January 11, 2011Publication date: May 12, 2011Applicant: GSI GROUP CORPORATIONInventors: Bruce L. Couch, Jonathan S. Ehrmann, Yun Fee Chu, Joseph V. Lento, Shepard D. Johnson
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Publication number: 20110062127Abstract: Laser-based methods and systems for removing one or more target link structures of a circuit fabricated on a substrate includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.Type: ApplicationFiled: November 19, 2010Publication date: March 17, 2011Applicant: GSI GROUP CORPORATIONInventors: Bo Gu, Donald V. Smart, James J. Cordingley, Joohan Lee, Donald J. Svetkoff, Shepard D. Johnson, Jonathan S. Ehrmann
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Patent number: 7871903Abstract: A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. Beam scanning and deflection are both used to distribute beam spots to elements of an array of elements for selective processing. The deflection can be performed with a solid state deflector.Type: GrantFiled: December 22, 2009Date of Patent: January 18, 2011Assignee: GSI Group CorporationInventors: Bruce L. Couch, Jonathan S. Erhmann, Yun Fee Chu, Joseph V. Lento, Shepard D. Johnson
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Patent number: 7838794Abstract: Laser-based methods and systems for removing one or more target link structures of a circuit fabricated on a substrate includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.Type: GrantFiled: January 31, 2007Date of Patent: November 23, 2010Assignee: GSI Group CorporationInventors: Bo Gu, Donald V. Smart, James J. Cordingley, Joohan Lee, Donald J. Svetkoff, Shepard D. Johnson, Jonathan S. Ehrmann
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Publication number: 20100140239Abstract: A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. Beam scanning and deflection are both used to distribute beam spots to elements of an array of elements for selective processing. The deflection can be performed with a solid state deflector.Type: ApplicationFiled: December 22, 2009Publication date: June 10, 2010Applicant: GSI GROUP CORPORATIONInventors: Bruce L. Couch, Jonathan S. Ehrmann, Yun Fee Chu, Joseph V. Lento, Shepard D. Johnson
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Patent number: 7723642Abstract: A laser-based method of removing a target link structure of a circuit fabricated on a substrate includes generating a pulsed laser output at a pre-determined wavelength less than an absorption edge of the substrate. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target structure to reduce the reflectivity of the target structure and efficiently couple the focused laser output into the target structure to remove the link without damaging the substrate.Type: GrantFiled: October 10, 2003Date of Patent: May 25, 2010Assignee: GSI Group CorporationInventors: Bo Gu, Donald V. Smart, James J. Cordingley, Joohan Lee, Donald J. Svetkoff, Shepard D. Johnson, Jonathan S. Ehrmann
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Patent number: 7666759Abstract: A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. The number of resistance measurements are limited by using non-measurement cuts, using non-sequential collinear cutting, using spot fan-out parallel cutting, and using a retrograde scanning technique for faster collinear cuts. Non-sequential cutting is also used to manage thermal effects and calibrated cuts are used for improved accuracy. Test voltage is controlled to avoid resistor damage.Type: GrantFiled: May 2, 2006Date of Patent: February 23, 2010Assignee: GSI Lumonics CorporationInventors: Bruce L. Couch, Jonathan S. Ehrmann, Joseph V. Lento, Shepard D. Johnson
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Publication number: 20090321396Abstract: A method, system and scan lens for use therein are provided for high-speed, laser-based, precise laser trimming at least one electrical element along a trim path. The method includes generating a pulsed laser output with a laser, the output having one or more laser pulses at a repetition rate. A fast rise/fall time, pulse-shaped q-switched laser or an ultra-fast laser may be used. Beam shaping optics may be used to generate a flat-top beam profile. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance, high absorption and reduced or eliminated heat-affected zone (HAZ) along the trim path, but not so short so as to cause microcracking. In this way, resistance drift after the trimming process is reduced.Type: ApplicationFiled: July 8, 2009Publication date: December 31, 2009Applicant: GSI GROUP CORPORATIONInventors: Bo Gu, Jonathan S. Ehrmann, Joseph V. Lento, Bruce L. Couch, Yun Fee Chu, Shepard D. Johnson