Abstract: Embodiments of the present invention provide isolated proteins comprising antigen binding domains that bind kallikrein related peptidase 2 (hK2), including monospecific and bispecific antibodies. Additional embodiments of the invention provide polynucleotides encoding the hk2-specific proteins, vectors, host cells, and methods of making and using them.

Abstract: A portable electronic device includes a housing defining an internal volume and a circuit board assembly within the internal volume. The circuit board assembly includes a first circuit board, a wall structure soldered to the first circuit board, and a second circuit board soldered to the wall structure and supported above the first circuit board by the wall structure. The second circuit board defines an exterior top surface of the circuit board assembly. A processor is coupled to the first circuit board and positioned within an internal volume defined between the first circuit board and the second circuit board and at least partially surrounded by the wall structure. A memory module is coupled to the exterior top surface of the circuit board assembly.

Abstract: A mobile phone may include an enclosure defining an internal volume, the enclosure including a front cover formed from a transparent material and defining a front exterior surface, a rear cover formed from a glass material and defining a rear exterior surface, and a housing component defining a side exterior surface. The mobile phone may include a circuit board assembly within the internal volume. The circuit board assembly may include a circuit board, a circuit component coupled to an exterior surface of the circuit board, and a cowling coupled to the circuit board and covering the circuit component, the cowling having a thickness less than about 0.5 mm and including a base structure formed from an aluminum alloy having a thickness less than about 0.4 mm and a thermally conductive structure positioned over the base structure and configured to dissipate heat.

Abstract: Methods for the in vitro production of enucleated red blood cells and the enucleated red blood cells thus prepared are provided. Such enucleated red blood cells may express a sortaggable surface protein, which allows for surface modification in the presence of a sortase. Also described herein are surface modified enucleated red blood cells, e.g., conjugated with an agent of interest such as a peptide, a detectable label, or a chemotherapeutic agent, and uses thereof in delivering the agent to a subject.

Abstract: Embodiments describe a portable electronic device that includes a housing having an interface surface and an inductor coil disposed within the housing and comprising a conductive wire wound in a plurality of turns about a center point and in increasing radii such that the inductor coil is substantially planar. The portable electronic device further includes charging circuitry coupled to the inductor coil and configured to operate the inductor coil to wirelessly receive power and wirelessly transmit power, control circuitry coupled to the charging circuitry and configured to instruct the charging circuitry to operate the inductor coil to wirelessly receive power and to wirelessly transmit power, and a device detection coil coupled to the control circuitry and configured to detect the presence of an external device on the charging surface, the device detection coil is configured to operate at a different frequency from the inductor coil.

Abstract: An IC that includes a contiguous standard cell area with a 4x3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.

Abstract: An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.

Abstract: An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.

Abstract: An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.

Abstract: A portable electronic device includes a housing defining an internal volume and a circuit board assembly within the internal volume. The circuit board assembly includes a first circuit board, a wall structure soldered to the first circuit board, and a second circuit board soldered to the wall structure and supported above the first circuit board by the wall structure. The second circuit board defines an exterior top surface of the circuit board assembly. A processor is coupled to the first circuit board and positioned within an internal volume defined between the first circuit board and the second circuit board and at least partially surrounded by the wall structure. A memory module is coupled to the exterior top surface of the circuit board assembly.

Abstract: An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.

Abstract: An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.

Abstract: A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of at least one tip-to-side short or leakage, at least one corner short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective tip-to-side short, corner short, and via open test areas.

Abstract: An IC includes a contiguous standard cell area with first, second, and third TS-GATE-short-configured test area geometries disposed therein. In some embodiments, the contiguous standard cell area may further include: fourth and fifth TS-GATE-short-configured test area geometries, and/or other test area geometries, such as tip-to-tip-short, tip-to-side-short, diagonal-short, corner-short, interlayer-overlap-short, via-chamfer-short, merged-via-short, snake-open, stitch-open, via-open, or metal-island-open.

Abstract: Improved processes for manufacturing wafers, chips, or dies utilize in-line data obtained from non-contact electrical measurements (“NCEM”) of fill cells that contain structures configured target/expose a variety of open-circuit, short-circuit, leakage, or excessive resistance failure modes. Such processes may involve evaluating Designs of Experiments (“DOEs”), comprised of multiple NCEM-enabled fill cells, in at least two variants, all targeted to the same failure mode(s).

Abstract: Embodiments describe a portable electronic device that includes a housing having an interface surface and an inductor coil disposed within the housing and comprising a conductive wire wound in a plurality of turns about a center point and in increasing radii such that the inductor coil is substantially planar. The portable electronic device further includes charging circuitry coupled to the inductor coil and configured to operate the inductor coil to wirelessly receive power and wirelessly transmit power, control circuitry coupled to the charging circuitry and configured to instruct the charging circuitry to operate the inductor coil to wirelessly receive power and to wirelessly transmit power, and a device detection coil coupled to the control circuitry and configured to detect the presence of an external device on the charging surface, the device detection coil is configured to operate at a different frequency from the inductor coil.

Abstract: A consumer electronic product includes a switchable inductor array coupled to the RF antenna, the switchable inductor array comprising inductive elements and a switch circuit coupled to the inductor array to select at least one of the inductive elements and couple the selected inductive element with the RF antenna. The product can further include an assembly having a mesh that is strengthened by a stiffener. A multi-layer adhesive have a conductive layer that can be used to shield the RF antenna and adhesive layers that can provide adhesion between the stiffener and the housing of the product. The assembly can be covered by a cowling that is made of metal to provide further shielding. To reduce potential coupling between the RF antenna and the cowling, the cowling can have a portion that is formed of plastic to distance its metal portion from the antenna.

Abstract: A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective tip-to-tip short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with a moving stage and beam deflection to account for motion of the stage.