Patents by Inventor Shi Bai

Shi Bai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136275
    Abstract: A semiconductor package structure includes a capacitor substrate and a first semiconductor die. The capacitor substrate has a first surface and a second surface opposite the first surface and includes a first redistribution structure, a second redistribution structure, a through via, and a first capacitor structure. The first redistribution structure is disposed on the first surface. The second redistribution structure is disposed on the second surface. The through via electrically couples the first redistribution structure to the second redistribution structure. The first capacitor structure is disposed between the first redistribution structure and the second redistribution structure and is electrically coupled to the second redistribution structure. The first semiconductor die is disposed over the capacitor substrate and is electrically coupled to the first capacitor structure through the second redistribution structure.
    Type: Application
    Filed: September 21, 2023
    Publication date: April 25, 2024
    Inventors: Shi-Bai CHEN, Wei-Chih CHEN
  • Patent number: 11949738
    Abstract: The migration method includes dividing each service system in a first cloud system into a plurality of modules; determining the relation between a module to be migrated among the plurality of modules and other modules; copying said module among the plurality of modules to a second cloud system, the type of the first cloud system being different from that of the second cloud system; and establishing a relation in the second cloud system to complete the migration of the first cloud system. The nature and gist of the present disclosure is that the migration of a module to be migrated in the first cloud system is completed by establishing the association relation of the module to be migrated in the second cloud system.
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: April 2, 2024
    Assignees: BEIJING JINGDONG SHANGKE INFORMATION TECHNOLOGY CO., LTD., BEIJING JINGDONG CENTURY TRADING CO., LTD.
    Inventor: Shi Bai
  • Publication number: 20240061701
    Abstract: A memory sharing method and device for virtual machines. The method includes: monitoring virtual machines in a virtual machine set, and determining homogeneous virtual machines in the virtual machine set, wherein the homogeneous virtual machines are used for representing virtual machines having the same memory pages; migrating virtual machines of which the number of the same memory pages exceeds a preset threshold among the homogeneous virtual machines to a target host machine; and performing memory compression on the homogeneous virtual machines on the target host machine to achieve memory sharing of the homogeneous virtual machines for the same memory pages.
    Type: Application
    Filed: January 5, 2022
    Publication date: February 22, 2024
    Inventor: Shi BAI
  • Publication number: 20240038648
    Abstract: A semiconductor package includes a partitioned package substrate that is composed of multiple discrete substrates arranged in a side-by-side manner. The discrete substrates include a central substrate and peripheral substrates surrounding the central substrate. At least one integrated circuit die is mounted on a first surface of the partitioned package substrate. A plurality of solder balls is mounted on a second surface of the partitioned package substrate opposite to the first surface.
    Type: Application
    Filed: June 29, 2023
    Publication date: February 1, 2024
    Applicant: MEDIATEK INC.
    Inventors: Wei-Chih Chen, Shi-Bai Chen
  • Publication number: 20240038647
    Abstract: A semiconductor package includes a partitioned package substrate composed of substrate parts arranged in a side-by-side manner; an integrated circuit die mounted on a first surface of the partitioned package substrate; and solder balls mounted on a second surface of the partitioned package substrate opposite to the first surface.
    Type: Application
    Filed: June 29, 2023
    Publication date: February 1, 2024
    Applicant: MEDIATEK INC.
    Inventors: Wei-Chih Chen, Shi-Bai Chen
  • Publication number: 20230420083
    Abstract: Provided is a method and an apparatus for acquiring a gene information of a proprietary cloud container cluster, the method includes: acquiring and analyzing a system hierarchical information, an association relationship information and a dependency relationship information of a module or a component of a proprietary cloud server cluster; generating a set of a gene information of a proprietary cloud container cluster through the acquired system hierarchical information, the association relationship information and the dependency relationship information of the module or the component, and performing an integrity verification on the set of the gene information of the proprietary cloud container cluster; and storing the set of the gene information of the proprietary cloud container cluster and determining a version information of a gene of the proprietary cloud container cluster, in response to the integrity verification passing.
    Type: Application
    Filed: October 12, 2021
    Publication date: December 28, 2023
    Inventors: Bowei SHEN, Dayong WANG, Shi BAI
  • Publication number: 20230393836
    Abstract: A method and an apparatus for updating a cloud platform are provided. The method may include: in response to receiving a cloud platform update request, acquiring to-be-used updating cluster gene information corresponding to the cloud platform update request, wherein the to-be-used updating cluster gene information is structured information that completely represents information of components in a cloud platform container cluster; updating a standard cloud platform gene library according to a comparison result between the to-be-used updating cluster gene information and cluster gene information of a current standard cloud platform, wherein the standard cloud platform is a unified cloud platform on which a customer-specific cloud platform is deployed; and determining, according to an updated standard cloud platform gene library, a hardware resource of a final standard cloud platform and a software resource of the final standard cloud platform.
    Type: Application
    Filed: August 13, 2021
    Publication date: December 7, 2023
    Applicants: Beijing Jingdong Shangke Information Technology Co., Ltd., Beijing Jingdong Century Trading Co., Ltd.
    Inventors: Shi Bai, Chen Liu, Dayong Wang, Zhipeng Han, Zhifan Wang
  • Publication number: 20230367577
    Abstract: A method and an apparatus for updating a cloud platform are provided. The method may include: in response to receiving an update request, acquiring cluster gene information of a to-be-updated cloud platform corresponding to the update request, the cluster gene information being structured information that entirely represents information of each component in a cloud platform container cluster; determining, on the basis of the cluster gene information, each target component of the to-be-updated cloud platform corresponding to the cluster gene information and a level to which each target component belongs; updating each target component, on the basis of the level to which each target component belongs and the cluster gene information of the corresponding target component; and determining a hardware resource of the to-be-updated cloud platform and a software resource of the to-be-updated cloud platform, based on all of the updated target components.
    Type: Application
    Filed: May 11, 2021
    Publication date: November 16, 2023
    Applicants: Beijing Jingdong Shangke Information Technology Co., Ltd., Beijing Jingdong Century Trading Co., Ltd.
    Inventor: Shi Bai
  • Publication number: 20230367651
    Abstract: A method of reconstructing and verifying a proprietary cloud based on state transition is provided, including: obtaining information of an underlying infrastructure platform of a proprietary cloud server cluster to be constructed; if the underlying infrastructure platform meets the deployment requirement, obtaining cluster gene information of a standard proprietary cloud platform, and performing refactoring of an underlying system component, refactoring of an underlying dependency component and refactoring of a product line of a proprietary cloud platform according to the cluster gene information and a state of the proprietary cloud server cluster to be constructed; obtaining user demand information, configuring the cluster gene information according to the user demand information, and selecting a product line component of the standard proprietary cloud platform for deployment, so as to obtain a reconstructed proprietary cloud platform; and verifying a correctness and an effectiveness of a component of the re
    Type: Application
    Filed: October 12, 2021
    Publication date: November 16, 2023
    Inventors: Wenqiao LI, Dayong WANG, Shi BAI
  • Publication number: 20230315531
    Abstract: A method and an apparatus of creating a container, an electronic device, and a storage medium. The method includes: acquiring an available rack list and an available network address list, the available rack list including a plurality of available racks of different available zones, each available rack including at least one server node, the available network address list including at least one available network address; locating a spare server node in the available racks in the available rack list; creating, on the spare server node, a current container corresponding to the available network address; updating the available network address list; re-ordering the available racks in the available rack list according to resource occupation information of the available racks in the available rack list; and creating another container according to a spare server node in the re-ordered available racks in the available rack list and the updated available network address list.
    Type: Application
    Filed: August 30, 2021
    Publication date: October 5, 2023
    Inventors: Bowei SHEN, Shi BAI
  • Publication number: 20230236129
    Abstract: The Raman scattering spectroscopic method according to the present invention include: preparing a chip having a channel in which a nanostructure is formed; introducing an analyte solution into a part of the channel in the chip; irradiating an interface of the analyte solution with a laser beam; and measuring Raman scattering light induced by the irradiation of the laser beam. The measurement may be performed, with a fixed laser beam irradiation position, both in a state where the interface of the analyte solution is included in the laser-beam-irradiation area and in a state where the interface of the analyte solution is not included in the laser-beam-irradiation area, or may be performed keeping the state where the interface of the analyte solution is maintained in the laser-beam-irradiation area by controlling the laser-beam-irradiation area according to the movement of the interface due to evaporation of the analyte solution.
    Type: Application
    Filed: June 7, 2021
    Publication date: July 27, 2023
    Applicant: RIKEN
    Inventors: Koji SUGIOKA, Shi BAI
  • Publication number: 20230043613
    Abstract: The present disclosure relates to the technical field of cloud computing, and to a cloud system migration method and device, and a hybrid cloud system. The method includes: dividing each service system in a first cloud system into a plurality of modules; determining the relation between a module to be migrated among the plurality of modules and other modules; copying said module among the plurality of modules to a second cloud system, the type of the first cloud system being different from that of the second cloud system; and establishing a relation in the second cloud system to complete the migration of the first cloud system.
    Type: Application
    Filed: December 29, 2020
    Publication date: February 9, 2023
    Inventor: Shi BAI
  • Patent number: 11567504
    Abstract: A robot that is able to move about an environment determines a wait location in the environment to wait at when not otherwise in use. The wait location may be selected based on various factors including position of objects, next scheduled use, previous usage of the robot, availability of wireless connectivity, user traffic patterns, user presence, visibility of the surrounding environment, and so forth. The robot moves to that location and maintains a pose at that location, such as orienting itself to allow onboard sensors a greatest possible view of the environment. If a wait location is occupied, the robot may move to another wait location.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: January 31, 2023
    Assignee: AMAZON TECHNOLOGIES, INC.
    Inventors: Shi Bai, Amin Hani Atrash, Saurabh Gupta
  • Publication number: 20230004439
    Abstract: This disclosure relates to a control method and apparatus of cluster resources, and a cloud computing system, and relates to the field of computer technologies. The method includes: in the case where a to-be-controlled resource is a to-be-expanded resource, determining a binding relationship between the to-be-expanded resource and an application; adding the to-be-expanded resource that is initialized into a resource pool of a corresponding application having the binding relationship with the to-be-expanded resource; generating a to-be-executed data packet of a to-be-processed application according to a deployment type of the to-be-processed application; and deploying the to-be-executed data packet on the to-be-expanded resource in the resource pool of the to-be-processed application for execution.
    Type: Application
    Filed: September 24, 2020
    Publication date: January 5, 2023
    Inventors: Bowei SHEN, Haifeng DU, Wenqiao LI, Jun WANG, Shi BAI, Chuyi HAN
  • Publication number: 20230004436
    Abstract: A container scheduling method and apparatus, and a computer-readable storage medium, which relate to the technical field of computers. The method includes: according to a resource usage amount of a container set copy which has run, determining a predicted resource usage amount of a container set copy to be scheduled, wherein the type of container set copy which has run is the same as the type of container set copy to be scheduled; according to the predicted resource usage amount and a resource supply amount supported by each candidate node, determining a candidate node matching the container set copy which has run; and scheduling the container set copy which has run to the matched candidate node for running.
    Type: Application
    Filed: September 23, 2020
    Publication date: January 5, 2023
    Inventors: Shi BAI, Zhanlong CONG, Guoqiang YANG
  • Patent number: 11256261
    Abstract: A system determines one or more constraint locations that are present in an environment. A constraint location is a location in the environment through which a user, pet, or moving device is deemed likely to pass due to one or more physical constraints such as walls, furniture, and so forth. For example, a constraint location may be located at a midpoint of a doorway, or where a corridor narrows. Movement of an autonomous mobile device in an environment takes these constraint locations into consideration. In one implementation the autonomous mobile device is prevented from stopping within a threshold distance of a constraint location to avoid blocking movement of others.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: February 22, 2022
    Assignee: AMAZON TECHNOLOGIES, INC.
    Inventors: Shi Bai, Saurabh Gupta
  • Patent number: 10910320
    Abstract: A shielded metal-oxide-metal (MOM) capacitor includes a substrate, a lower shielding plate disposed on the substrate and in parallel with a major surface of the substrate, an upper shielding plate situated above the lower shielding plate and in parallel with the lower shielding plate, and a middle plate sandwiched between the lower shielding plate and the upper shielding plate. The middle plate includes two parallel first connecting bars extending along a first direction, a plurality of first fingers extending between the two parallel first connecting bars along a second direction, and an electrode strip spaced apart from and surrounded by the two parallel first connecting bars and the first fingers.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: February 2, 2021
    Assignee: MEDIATEK INC.
    Inventor: Shi-Bai Chen
  • Publication number: 20190164903
    Abstract: A shielded metal-oxide-metal (MOM) capacitor includes a substrate, a lower shielding plate disposed on the substrate and in parallel with a major surface of the substrate, an upper shielding plate situated above the lower shielding plate and in parallel with the lower shielding plate, and a middle plate sandwiched between the lower shielding plate and the upper shielding plate. The middle plate includes two parallel first connecting bars extending along a first direction, a plurality of first fingers extending between the two parallel first connecting bars along a second direction, and an electrode strip spaced apart from and surrounded by the two parallel first connecting bars and the first fingers.
    Type: Application
    Filed: September 12, 2018
    Publication date: May 30, 2019
    Inventor: Shi-Bai Chen
  • Publication number: 20160027772
    Abstract: An integrated capacitor includes a semiconductor substrate comprising a trench isolation area; a first interlayer dielectric (ILD) layer covering the trench isolation area; a first electrode plate comprising at least a first contact layer in the first ILD layer, wherein the contact layer is disposed directly on the trench isolation area; a second electrode plate in the first ILD layer; and a capacitor dielectric structure between the first electrode plate and the second electrode plate.
    Type: Application
    Filed: July 22, 2014
    Publication date: January 28, 2016
    Inventors: Shi-Bai Chen, Tung-Hsing Lee
  • Patent number: 9099467
    Abstract: An electrical fuse and a method of forming the same are presented. A first-layer conductive line is formed over a base material. A via is formed over the first-layer conductive line. The via preferably comprises a barrier layer and a conductive material. A second-layer conductive line is formed over the via. A first external pad is formed coupling to the first-layer conductive line. A second external pad is formed coupling to the second-layer conductive line. The via, the first conductive line and the second conductive line are adapted to be an electrical fuse. The electrical fuse can be burned out by applying a current. The vertical structure of the preferred embodiment is suitable to be formed in any layer.
    Type: Grant
    Filed: December 16, 2013
    Date of Patent: August 4, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kong-Beng Thei, Chung Long Cheng, Chung-Shi Liu, Harry-Hak-Lay Chuang, Shien-Yang Wu, Shi-Bai Chen