Abstract: An electrical fuse and a method of forming the same are presented. A first-layer conductive line is formed over a base material. A via is formed over the first-layer conductive line. The via preferably comprises a barrier layer and a conductive material. A second-layer conductive line is formed over the via. A first external pad is formed coupling to the first-layer conductive line. A second external pad is formed coupling to the second-layer conductive line. The via, the first conductive line and the second conductive line are adapted to be an electrical fuse. The electrical fuse can be burned out by applying a current. The vertical structure of the preferred embodiment is suitable to be formed in any layer.

Abstract: An electrical fuse and a method of forming the same are presented. A first-layer conductive line is formed over a base material. A via is formed over the first-layer conductive line. The via preferably comprises a barrier layer and a conductive material. A second-layer conductive line is formed over the via. A first external pad is formed coupling to the first-layer conductive line. A second external pad is formed coupling to the second-layer conductive line. The via, the first conductive line and the second conductive line are adapted to be an electrical fuse. The electrical fuse can be burned out by applying a current. The vertical structure of the preferred embodiment is suitable to be formed in any layer.

Abstract: A method for controlling synchronization of a 3D shutter glasses adapted to a system for controlling synchronization of the 3D shutter glasses is provided. The method includes the following steps. A plurality of synchronous images of a 3D image projected on a screen are sensed by an image sensor of the shutter glasses. The 3D image includes a plurality of left images and right images and the synchronous images. The left images and the right images are respectively synchronized with a left-eye liquid crystal shutter and a right-eye liquid crystal shutter of the 3D shutter glasses based on the sensing result when the left-eye liquid crystal shutter and the right-eye liquid crystal shutter are respectively turned on. Furthermore, a system for controlling synchronization of the 3D shutter glasses using this method is also provided.

Abstract: A current-type driver of light emitting devices is provided. The current-type driver includes a power conversion circuit, a feedback module, and a control module. The power conversion circuit modulates and generates an output voltage according to a feedback signal so as to sequentially drive a plurality of light emitting devices. The feedback module generates the feedback signal for the power conversion circuit according to the output voltage and an adjusting signal during a first period, wherein none of the light emitting devices is driven during the first period. The control module outputs the adjusting signal to the feedback module during the first period so as to allow the power conversion circuit to adjust the output voltage to a pre-drive voltage corresponding to the light emitting device which is to be driven next among the light emitting devices.

Abstract: A semiconductor device assembly includes a first semiconductor die, a second semiconductor die, at least one semiconductor package component or another semiconductor die, a first conductive element and a second conductive element. The first semiconductor die includes at least one bonding pad. The second semiconductor die includes a bonding pad module. The first conductive element is coupled between the bonding pad module of the second semiconductor die and the bonding pad of the first semiconductor die, and the second conductive element is coupled between the bonding pad module of the second semiconductor die and the semiconductor package component or the another semiconductor die, wherein the first semiconductor die is coupled to the semiconductor package component or the another semiconductor die via the bonding pad and the bonding pad module and the first and second conductive elements.

Abstract: An integrated circuit chip includes an analog and/or RF circuit block and a seal ring structure surrounding the analog and/or RF circuit block. The seal ring structure comprises a continuous outer seal ring and an inner seal ring, wherein the inner seal ring comprises a gap that is situated in front of the analog and/or RF circuit block.

Abstract: An electrical fuse and a method of forming the same are presented. A first-layer conductive line is formed over a base material. A via is formed over the first-layer conductive line. The via preferably comprises a barrier layer and a conductive material. A second-layer conductive line is formed over the via. A first external pad is formed coupling to the first-layer conductive line. A second external pad is formed coupling to the second-layer conductive line. The via, the first conductive line and the second conductive line are adapted to be an electrical fuse. The electrical fuse can be burned out by applying a current. The vertical structure of the preferred embodiment is suitable to be formed in any layer.

Abstract: An electrical fuse structure includes a first metal strip having a first width W1 and a first length L1; a second metal strip having a second width W2 and a second length L2; and at least one via element having a via width W0, the via element being electrically connecting one end of the first metal strip to one end of the second metal strip, wherein W1<5W0.

Abstract: An electrical fuse and a method of forming the same are presented. A first-layer conductive line is formed over a base material. A via is formed over the first-layer conductive line. The via preferably comprises a barrier layer and a conductive material. A second-layer conductive line is formed over the via. A first external pad is formed coupling to the first-layer conductive line. A second external pad is formed coupling to the second-layer conductive line. The via, the first conductive line and the second conductive line are adapted to be an electrical fuse. The electrical fuse can be burned out by applying a current. The vertical structure of the preferred embodiment is suitable to be formed in any layer.

Abstract: An LCD (liquid crystal display) power supply includes an AC to DC converter circuit, a transformer, a DC to AC converter, and a feedback circuit. The AC to DC converter circuit couples an AC power supply to generate a DC signal. The DC to AC converter couples the DC signal to a primary side of the transformer and alternates polarities thereof so that an AC signal is generated on a secondary side of the transformer to supply for a load. The feedback circuit receives a first feedback signal indicative of power being supplied to the load and modulates the DC signal generated by the AC to DC converter circuit according to the first feedback signal.

Abstract: The present invention is directed to an apparatus that drives a lighting system with multiple lamps. A phase shift mechanism is produced either by a digital method, an analog method, or a mixture of the two methods. In a digital method, phase shifts are generated by digital circuits comprising counters, a divider, an adder, and a comparator. The digital circuits analyze the signal and use the necessary information to form a series of phased driving signals. In an analog method, phase shifts are generated by analog circuits comprising ramp waveform generators, comparators, and at least one shot generator. Also, an apparatus for driving a lighting system with multiple lamps can be realized by mixing the two methods mentioned above.

Abstract: A semiconductor device assembly includes a first semiconductor die, a second semiconductor die, at least one semiconductor package component or another semiconductor die, a first conductive element and a second conductive element. The first semiconductor die includes at least one bonding pad. The second semiconductor die includes a bonding pad module. The first conductive element is coupled between the bonding pad module of the second semiconductor die and the bonding pad of the first semiconductor die, and the second conductive element is coupled between the bonding pad module of the second semiconductor die and the semiconductor package component or the another semiconductor die, wherein the first semiconductor die is coupled to the semiconductor package component or the another semiconductor die via the bonding pad and the bonding pad module and the first and second conductive elements.

Abstract: A semiconductor device assembly includes a first semiconductor die, a second semiconductor die, at least one semiconductor package component or another semiconductor die, a first conductive element and a second conductive element. The first semiconductor die includes at least one bonding pad. The second semiconductor die includes a bonding pad module. The first conductive element is coupled between the bonding pad module of the second semiconductor die and the bonding pad of the first semiconductor die, and the second conductive element is coupled between the bonding pad module of the second semiconductor die and the semiconductor package component or the another semiconductor die, wherein the first semiconductor die is coupled to the semiconductor package component or the another semiconductor die via the bonding pad and the bonding pad module and the first and second conductive elements.

Abstract: An inverter circuit for driving a lamp and a backlight module using the same are provided. The inverter circuit includes a signal generation module, a switching unit, a first capacitor, a transformer and a first detecting module. The signal generation module generates a pulse width modulation (PWM) signal, wherein the duty cycle of the PWM signal is controlled by a feedback signal and a sensed signal. The switching unit has a control terminal receiving the PWM signal, and has a first current terminal and a second current terminal respectively coupled to a first terminal and a second terminal of the first capacitor. The transformer generates an AC driving signal to the lamp according to a signal variation of the primary winding coupled the first current terminal of the first transistor. The first detecting module generates the sensed signal according to the flowing current of the switching unit.

Abstract: A packaged integrated circuit is provided comprising a first semiconductor die, a second semiconductor die, and a bonding wire. The first semiconductor die has a first internal bonding pad electrically connected to the package. The second semiconductor die has a second internal bonding pad located in an internal portion of the second semiconductor die. The second internal bonding pad is electrically connected to the first internal bonding pad through the first bonding wire.

Abstract: A current-type driver of light emitting devices is provided. The current-type driver includes a power conversion circuit, a feedback module, and a control module. The power conversion circuit modulates and generates an output voltage according to a feedback signal so as to sequentially drive a plurality of light emitting devices. The feedback module generates the feedback signal for the power conversion circuit according to the output voltage and an adjusting signal during a first period, wherein none of the light emitting devices is driven during the first period. The control module outputs the adjusting signal to the feedback module during the first period so as to allow the power conversion circuit to adjust the output voltage to a pre-drive voltage corresponding to the light emitting device which is to be driven next among the light emitting devices.

Abstract: System and method for providing an electrical fuse having a p-n junction diode. A preferred embodiment comprises a cathode, an anode, and one or more links formed between the cathode and the anode. The cathode and the portion of the cathode adjoining the link are doped with a first impurity, preferably a p-type impurity. The anode and the portion of the link adjoining the anode are doped with a second impurity, preferably an n-type impurity. The junction of the first impurity and the second impurity in the link forms a p-n junction diode. A conductive layer, such as a silicide layer, is formed over the p-n junction diodes. In an alternative embodiment, a plurality of p-n junction diodes may be formed in each link. One or more contacts may be formed to provide electrical contact to the cathode and the anode.

Abstract: The invention is a driving apparatus and circuit for efficiently converting a direct current (DC) signal into an alternating current (AC) signal to drive a fluorescent lamp. A semi class E configuration which utilizes only one transistor is employed in the invention. The invention comprises a power transistor, a transformer wherein a primary winding is used as a load for the power transistor and a secondary winding is used to transfer energy to the load for the driving apparatus, i.e. the CCFL tube, and control means which extracts the frequency and current of the power transistor and corrects the deviation between the frequency of the power transistor and that of the control means.

Abstract: A driving system, includes: a power supply unit for providing a first current and a second current; a first transformer having a primary side coupled to the power supply unit and a secondary side coupled to a first current balancing circuit for driving a plurality of first lamps; a second transformer having a primary side coupled to the power supply unit and a secondary side coupled to a second current balancing circuit for driving a plurality of second lamps; a balancing control circuit coupled to the power supply unit for balancing the first and the second current so that the first current and the second current are substantially equal.

Abstract: A backlight module and a current providing circuit thereof are provided. The current providing circuit includes a signal generating unit, a switching unit, a first capacitor, a transformer and an output node. The signal generating unit generates a PWM signal according to a level of a power source. The switching unit determines whether a first signal end and a second signal end of the switching unit are conducted according to the PWM signal received by a control end of the switching unit. Following a switch performed by the switching unit, the first capacitor charges and discharges through a current path provided by a primary coil of the transformer. Thereby, a secondary coil of the transformer generates a corresponding AC voltage by sensing a current change in the primary coil and outputs the AC voltage through the output node.