Abstract: A semiconductor chip package may include a lead frame having a first surface and a second surface opposite to each other. A groove may be provided on the first surface of the lead frame and filled with an adhesive. A width of the groove is not greater than a width of the semiconductor chip. A semiconductor chip may be disposed over the groove and affixed to the lead frame through the adhesive in the groove. A carrier may be disposed on the second surface of the lead frame. A method for manufacturing the semiconductor chip package is also provided.

Abstract: The present invention relates to an electronic component package and a manufacturing method therefor. In an embodiment, the electronic component package comprises: a first metal layer, a high-voltage transistor semiconductor die, a first molding compound layer, a second metal layer, a first vertical connection structure, a second vertical connection structure, a control circuit bare chip, and a second molding compound layer. In the electronic component package of the present invention, a lead frame and electrical leads are replaced with the metal layers and the vertical connection structures, so that the position of the electrical connection of the chip is more flexible and the heat dissipation effect is better. Compared with the lead frames and the electrical leads, the electronic component package of the present disclosure is more suitable for packaging high-voltage or high-current chips.

Abstract: Provided is a filter, including a substrate layer and a near-infrared absorption layer on the substrate layer, wherein the near-infrared absorption layer includes a copper complex formed from a copper compound for supplying copper ion, phosphonric acid represented by formula 1 herein, and at least one phosphorus-containing compound represented by formulas 2 to 4 herein, wherein the OD value of the filter for the incident light wavelength from 930-950 nm is greater than 4. In the present disclosure, by setting a specific near-infrared absorption layer on the filter, the filter is able to efficiently absorb near-infrared and exhibit excellent visible light transmittance, and the burden of film post-processing can be reduced.

Abstract: Provided is an ultraviolet-absorbing resin composition, including 35 to 45 wt % of a fluorocarbon resin, 5 to 25 wt % of an isocyanate curing agent, 1 to 5 wt % of an ultraviolet absorbent, and a residual solvent accounting for the balance, based on the total weight of the ultraviolet-absorbing resin composition. Provided is also an ultraviolet-absorbing resin, an ultraviolet-absorbing structure including the same, and the method for preparing the same. The present disclosure obtains an ultraviolet-absorbing resin with a specific composition from a specific resin composition formula, and the ultraviolet-absorbing resin efficiently absorbs ultraviolet and has excellent visible light transmittance, as well as high stability.

Abstract: Provided are a composite photosensitive element and a method for preparing a composite photosensitive element, and the composite photosensitive element includes a photosensitive element and a near-infrared absorption layer pasted on the photosensitive element, wherein the near-infrared absorption layer includes a copper complex, and the copper complex is formed from a copper compound providing copper ions, phosphoric acid represented by formula 1 herein, and at least one phosphorus-containing compound represented by formulas 2 to 4 herein, wherein the OD value of the near-infrared absorption layer for the incident light wavelength from 930-950 nm is greater than 4. The present disclosure forms a filtering film directly on the photosensitive element instead of using a traditional filter assembly to reduce the size of the assembled product. The filtering film can be further processed and shaped to have functions of micro-lens.

Abstract: Provided is a filter lens and a method for preparing the filter lens. The filter lens includes a copper complex, wherein the copper complex is formed from a copper compound providing copper ions, phosphoric acid represented by formula 1 herein, and at least one phosphorus-containing compound represented by formulas 2 to 4 herein, wherein the OD value of the filter lens for the incident light wavelength of 930 nm to 950 nm is greater than 4. The present disclosure enables a filter lens to have the function of filtering out near-infrared instead of using a traditional filter component and thus the size of the assembled optical lens module is reduced. The filter lens can further filter out light having other specific wavelengths, and thereby the number of lenses in the assembled optical lens module is reduced.

Abstract: Provided is a lens module with an integrated structure, including a first lens and a second lens, a first substrate and a second substrate, an optical bonding layer, a first absorption layer and a second absorption layer, wherein the first absorption layer includes a copper complex, which is formed from a copper compound, a phosphonic acid represented by formula 1 herein, and at least one phosphorus-containing compound represented by formulas 2 to 4 herein. Due to the integrated structure, the lens module can be reduced in size. The manufacturing process is simplified because no assembly process is required. The lens module of the present disclosure exhibits high transmittance for visible light and low transmittance for near-infrared, showing an excellent near-infrared cut-off effect. In addition, while the incident light irradiates the lens module at different angles, the transmittance curve only is slightly shifted.

Abstract: The present invention relates to an electronic component package and a manufacturing method therefor. In an embodiment, the electronic component package comprises: a first metal layer, a high-voltage transistor semiconductor die, a first molding compound layer, a second metal layer, a first vertical connection structure, a second vertical connection structure, a control circuit bare chip, and a second molding compound layer. In the electronic component package of the present invention, a lead frame and electrical leads are replaced with the metal layers and the vertical connection structures, so that the position of the electrical connection of the chip is more flexible and the heat dissipation effect is better. Compared with the lead frames and the electrical leads, the electronic component package of the present disclosure is more suitable for packaging high-voltage or high-current chips.

Abstract: A technology to optimize power consumption by reducing the transmission number of SR/PUSCH is provided. The controlling method for the user equipment includes the following steps: determining whether the user equipment receives a scheduling request (SR) configuration from a network; reducing SR transmission number by selecting a plurality of SR occasions; and transmitting a SR signal according to selected SR occasions.

Abstract: An UL HARQ operation enhancement for power enhancement/saving is provided. A controlling method for the user equipment includes the following steps. A waiting section for receiving a retransmission (RETX) grant signal or a Negative Acknowledgement (NACK) signal is set. Whether the user equipment receives a Acknowledge (ACK) signal is determined. After the ACK signal is received, time or count is counted. Whether the waiting section is reached is determined. After the waiting section is reached, monitoring Physical Downlink Control Channel (PDCCH) and/or Physical Hybrid ARQ Indicator Channel (PHICH) is stopped.

Abstract: A semiconductor chip package may include a lead frame having a first surface and a second surface opposite to each other. A groove may be provided on the first surface of the lead frame and filled with an adhesive. A semiconductor chip may be disposed over the first groove and affixed on the first surface of the lead frame through the adhesive in the first groove. A carrier may be disposed on the second surface of the lead frame. A method for manufacturing the semiconductor chip package is also provided.

Abstract: A CNS millbase dispersion, comprises a solvent and up to 0.5 wt % of at least one CNS-derived material dispersed in the millbase dispersion and selected from the group consisting of: carbon nanostructures, fragments of carbon nanostructures, fractured carbon nanotubes, and any combination thereof. The carbon nanostructures or fragments of carbon nanostructures include a plurality of multiwall carbon nanotubes that are crosslinked in a polymeric structure by being branched, interdigitated, entangled and/or sharing common walls, and the fractured carbon nanotubes are derived from the carbon nanostructures and are branched and share common walls with one another. A Brookfield viscosity of the dispersion measured at room temperature at 10 rpm is less than 3000 cP.

Abstract: A CNS millbase dispersion, comprises a solvent and up to 0.5 wt % of at least one CNS-derived material dispersed in the millbase dispersion and selected from the group consisting of: carbon nanostructures, fragments of carbon nanostructures, fractured carbon nanotubes, and any combination thereof. The carbon nanostructures or fragments of carbon nanostructures include a plurality of multiwall carbon nanotubes that are crosslinked in a polymeric structure by being branched, interdigitated, entangled and/or sharing common walls, and the fractured carbon nanotubes are derived from the carbon nanostructures and are branched and share common walls with one another. A Brookfield viscosity of the dispersion measured at room temperature at 10 rpm is less than 3000 cP.

Abstract: A display device includes a thin film transistor (TFT) array substrate, an isolation structure, and a front panel laminate (FPL) structure. The TFT array substrate has pixel electrodes. The isolation structure is between the pixel electrodes to form a first resistance between adjacent pixel electrodes. The front panel laminate structure is located on the isolation structure and the pixel electrodes adhesive layer, and has a display medium layer therein.

Abstract: A composition used for combating metabolic diseases and uses of (or a method for) the composition. The pharmaceutical composition comprises therapeutic agent A or a pharmaceutically acceptable salt thereof; therapeutic agent B or a pharmaceutically acceptable salt thereof; and at least one pharmaceutically acceptable excipient, where therapeutic agent A is a non-steroidal anti-inflammatory medicament, and therapeutic agent B is a fatty acid oxidation inhibitor. The pharmaceutical composition effectively treats or prevents obesity, non-alcoholic fatty liver, polycystic ovary syndrome, type 2 diabetes, and metabolic syndrome diseases caused by insulin resistance.

Abstract: An epoxy composition containing CNS-derived fragments provides conductivity and surface hardness. In one illustration, the epoxy composition includes carbon nanostructures, fragments of carbon nanostructures, fractured carbon nanotubes, elongated carbon strands, and/or dispersed carbon nanostructures dispersed in an epoxy resin. The epoxy composition may also include additional fillers or other additives.

Abstract: A communications apparatus includes a receiver and a processor. The receiver is configured to receive wireless signals. The wireless signals include a plurality of packets. The processor is coupled to the receiver and includes a first logic configured to perform operations of a first protocol layer and a second logic configured to perform operations of a second protocol layer higher than the first protocol layer. The operations of the first protocol layer includes: starting a timer in response to receiving a first packet with a first count value that is different from a deliver count value; and delivering a second packet with a second count value that is different from the deliver count value to the second logic before the timer expires.

Abstract: A display device includes a thin film transistor (TFT) array substrate, an isolation structure, and a front panel laminate (FPL) structure. The TFT array substrate has pixel electrodes. The isolation structure is between the pixel electrodes to form a first resistance between adjacent pixel electrodes. The front panel laminate structure is located on the isolation structure and the pixel electrodes adhesive layer, and has a display medium layer therein.

Abstract: A display device includes a thin film transistor (TFT) array substrate, an isolation structure, and a front panel laminate (FPL) structure. The TFT array substrate has pixel electrodes. The isolation structure is between the pixel electrodes to form a first resistance between adjacent pixel electrodes. The front panel laminate structure is located on the isolation structure and the pixel electrodes adhesive layer, and has a display medium layer therein.

Abstract: Determining the position of a pop-up on a touch screen. Locations of user interactions on a touch screen are determined. Times are also determined for each of the user interactions. A hot spot on the touch screen is defined on the touch screen based on a number of user interactions occurring in proximity of one another during a particular period of time. In one or more embodiments, the particular time period corresponds with a most recent period of time. At least a portion of a pop-up is then displayed within the hot spot on the touch screen for user interaction.