Abstract: A method, computer system, and a computer program product for storage management for deployment of a virtual machine is provided. The present invention may include receiving a request to deploy a virtual machine based on a master VM image. The present invention may also include determining a free disk space for the virtual machine. The present invention may then include determining a disk storage space storing the master VM image. The present invention may further include mapping the disk storage space and the free disk space into a single virtual storage. The present invention may include designating the single virtual storage to be a virtual storage of the virtual machine.

Abstract: A waterproof display apparatus includes a bottom waterproof structure, a plurality of driving substrates, a panel laminate (FPL) and a top waterproof structure. The bottom waterproof structure has a first edge. The driving substrates are disposed on the bottom waterproof structure and defining a gap between adjacent driving substrates. The gap has opposite top and bottom portions. The FPL covers the driving substrates and includes a display medium layer therein. The top waterproof structure covers the FPL and has a second edge. The first and second edges are joined in a waterproof manner. The bottom portion of the gap is sealed by the bottom waterproof structure, and the top portion of the gap is sealed by the FPL or the top waterproof structure such that the gap is empty.

Abstract: Various solutions for maintaining a radio resource control (RRC) connection with respect to user equipment and network apparatus in mobile communications are described. An apparatus may establish an RRC connection with a network node. The apparatus may transmit a layer 2 packet to maintain the RRC connection after a period of time without data transmission. The apparatus may transmit uplink data via the RRC connection without re-establishing the RRC connection.

Abstract: A package structure includes a substrate, a first capacitor, a System on Chip unit and a wiring layer. The first capacitor is provided on the substrate. The System on Chip unit is bonded with the first capacitor in a first dielectric layer. The wiring layer is configured to electrically couple the first capacitor and the System on Chip unit. The wiring layer is provided on the first dielectric layer through a second dielectric layer.

Abstract: Methods of encapsulating an environmentally sensitive device. The methods involve temporarily laminating a flexible substrate to a rigid support using a reversible adhesive for processing, reversing the reversible adhesive, and removing the device from the rigid support.

Abstract: A communications apparatus includes a receiver and a processor. The receiver is configured to receive wireless signals. The wireless signals include a plurality of packets. The processor is coupled to the receiver and includes a first logic configured to perform operations of a first protocol layer and a second logic configured to perform operations of a second protocol layer higher than the first protocol layer. The operations of the first protocol layer includes: starting a timer in response to receiving a first packet with a first count value that is different from a deliver count value; and delivering a second packet with a second count value that is different from the deliver count value to the second logic before the timer expires.

Abstract: A display device includes a thin film transistor (TFT) array substrate, an isolation structure, and a front panel laminate (FPL) structure. The TFT array substrate has pixel electrodes. The isolation structure is between the pixel electrodes to form a first resistance between adjacent pixel electrodes. The front panel laminate structure is located on the isolation structure and the pixel electrodes adhesive layer, and has a display medium layer therein.

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate; an active layer disposed on the substrate; a via through the active layer; and a plurality of electrodes disposed on the active layer and into the via. Additionally, a package structure that includes the semiconductor device is also provided. The electrode is electrically connected to the substrate through the via.

Abstract: A package structure includes a substrate, a first capacitor, a System on Chip unit and a wiring layer. The first capacitor is provided on the substrate. The System on Chip unit is bonded with the first capacitor in a first dielectric layer. The wiring layer is configured to electrically couple the first capacitor and the System on Chip unit. The wiring layer is provided on the first dielectric layer through a second dielectric layer.

Abstract: Determining the position of a pop-up on a touch screen. Locations of user interactions on a touch screen are determined. Times are also determined for each of the user interactions. A hot spot on the touch screen is defined on the touch screen based on a number of user interactions occurring in proximity of one another during a particular period of time. In one or more embodiments, the particular time period corresponds with a most recent period of time. At least a portion of a pop-up is then displayed within the hot spot on the touch screen for user interaction.

Abstract: Methods of encapsulating an environmentally sensitive device. The methods involve temporarily laminating a flexible substrate to a rigid support using a reversible adhesive for processing, reversing the reversible adhesive, and removing the device from the rigid support.

Abstract: A method, computer system, and a computer program product for storage management for deployment of a virtual machine is provided. The present invention may include receiving a request to deploy a virtual machine based on a master VM image. The present invention may also include determining a free disk space for the virtual machine. The present invention may then include determining a disk storage space storing the master VM image. The present invention may further include mapping the disk storage space and the free disk space into a single virtual storage. The present invention may include designating the single virtual storage to be a virtual storage of the virtual machine.

Abstract: A package structure includes a metal carrier, a conductive adhesive layer disposed on the metal carrier, a conductive post disposed on the conductive adhesive layer, a semiconductor chip disposed on the conductive adhesive layer and laterally spaced from the conductive post, and a redistribution layer disposed on the conductive post and the semiconductor chip. The semiconductor chip includes a first terminal at an upper surface of the semiconductor chip. The first terminal of the semiconductor chip is electrically connected to the bottom surface of the semiconductor chip through the redistribution layer, the conductive post and the conductive adhesive layer.

Abstract: A package structure includes a metal carrier, a conductive adhesive layer disposed on the metal carrier, a conductive post disposed on the conductive adhesive layer, a semiconductor chip disposed on the conductive adhesive layer and laterally spaced from the conductive post, and a redistribution layer disposed on the conductive post and the semiconductor chip. The semiconductor chip includes a first terminal at an upper surface of the semiconductor chip. The first terminal of the semiconductor chip is electrically connected to the bottom surface of the semiconductor chip through the redistribution layer, the conductive post and the conductive adhesive layer.

Abstract: Various solutions for maintaining a radio resource control (RRC) connection with respect to user equipment and network apparatus in mobile communications are described. An apparatus may establish an RRC connection with a network node. The apparatus may transmit a layer 2 packet to maintain the RRC connection after a period of time without data transmission. The apparatus may transmit uplink data via the RRC connection without re-establishing the RRC connection.

Abstract: A writeable display medium incorporating various sensing elements into the backplane of the writeable display medium so that the sensing elements can cause the associated pixels to update immediately in contrast to state-of-the art writeable displays that rely on a feedback loop between a digitizing layer and a display driver that controls the output of a display. As a stylus is moved over the display, a signal emitted from the stylus (e.g., an electromagnetic field) will change the state of a transistor associated with a pixel, resulting in a nearly instantaneous state change in the display (i.e., white to black).

Abstract: A waterproof display apparatus includes an envelope, a display panel and an adhesive structure. The envelope includes an inner enclosing surface. The inner enclosing surface defines an accommodating space. The display panel is at least partially accommodated in the accommodating space of the envelope. The envelope includes a light permeable portion that allows light from the display panel to travel out of the envelope. The adhesive structure is located in the accommodating space. The adhesive structure is adhered between the inner enclosing surface of the envelope and the display panel.

Abstract: A writeable display medium incorporating various sensing elements into the backplane of the writeable display medium so that the sensing elements can cause the associated pixels to update immediately in contrast to state-of-the art writeable displays that rely on a feedback loop between a digitizing layer and a display driver that controls the output of a display. As a stylus is moved over the display, a signal emitted from the stylus (e.g., an electromagnetic field) will change the state of a transistor associated with a pixel, resulting in a nearly instantaneous state change in the display (i.e., white to black).

Abstract: A packaging structure is provided, including a substrate, a first chip, a second chip, and a conductive unit. The substrate includes a metal carrier, a patterned insulation layer disposed on the metal carrier and partially covering the metal carrier, and a patterned conductive layer disposed on the patterned insulation layer. The first chip is disposed on the metal carrier not covered by the patterned insulation layer. The second chip is disposed on the patterned conductive layer and electrically connected to the first chip by the conductive unit.

Abstract: A wireless communication method and device are provided. The wireless communication method includes the steps of activating a power-saving mechanism by user equipment (UE) to stop monitoring a Physical Downlink Control Channel (PDCCH) when a network does not enable a Discontinuous Reception (DRX) mechanism to configure the UE to switch to a DRX mode or when the network disables the DRX mechanism.