Patents by Inventor Shi Qi

Shi Qi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12061815
    Abstract: A method for locating a hard disk applied in a server which governs many hard disks including some making use of one HD slot by an expander customizes the SCSI Enclosure Services (SES) custom page of an expander of a JBOD device, and obtains and stores information of the JBOD device through the expander. The server further obtains information of a hard disk to be located, and obtains information of the JBOD device hosting the hard disk to be located according to the information of the hard disk to be located.
    Type: Grant
    Filed: November 10, 2022
    Date of Patent: August 13, 2024
    Assignee: Fulian Precision Electronics (Tianjin) Co., LTD.
    Inventors: Jie Yuan, Shi-Qi Chen
  • Patent number: 12051859
    Abstract: In certain embodiments, a system includes an optical switch matrix, an optical lens coupled to the switch matrix, and a wireless transmitter coupled to the lens. The switch matrix is configured to switch first optical signals from input ports to output ports of the switch matrix, and output second optical signals that are based at least partially on the first optical signals. The lens is configured to transform wave formats of the second optical signals based on the output ports over which the second optical signals are received. The transmitter includes an antenna array and circuitry coupled to the array. The circuitry is configured to receive the second optical signals from the lens, convert the second optical signals into beamformed wireless signals in accordance with the transformed formats, and transmit the beamformed wireless signals, which signals have spatial characteristics in accordance with the transformed formats, over the array.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: July 30, 2024
    Assignees: FUTUREWEI TECHNOLOGIES, INC., PHASE SENSITIVE INNOVATIONS, INC.
    Inventors: Stefano Galli, Munawar Kermalli, Xiao-Feng Qi, Shouyuan Shi, Dennis Prather, Janusz Murakowski, Garrett Schneider
  • Publication number: 20240020044
    Abstract: A method for locating a hard disk applied in a server which governs many hard disks including some making use of one HD slot by an expander customizes the SCSI Enclosure Services (SES) custom page of an expander of a JBOD device, and obtains and stores 5 information of the JBOD device through the expander. The server further obtains information of a hard disk to be located, and obtains information of the JBOD device hosting the hard disk to be located according to the information of the hard disk to be located.
    Type: Application
    Filed: November 10, 2022
    Publication date: January 18, 2024
    Inventors: JIE YUAN, SHI-QI CHEN
  • Publication number: 20240011124
    Abstract: The present invention relates to a method and device for preparing an ultrathin metal lithium foil. With regard to the problems of lithium preparation processes in the prior art having a high lithium preparation reaction temperature, a low lithium recovery rate, low purity in collected lithium foils, a complicated process operation, etc., the present invention provides a method for preparing an ultrathin metal lithium foil, wherein firstly, a complex lithium salt is prepared, the complex lithium salt and a reducing agent are then subjected to a vacuum thermal reduction reaction so as to generate a metal vapor, the metal vapor is then subjected to vacuum distillation, and finally, vacuum evaporation is used to prepare the ultrathin metal lithium foil of the present invention.
    Type: Application
    Filed: November 1, 2021
    Publication date: January 11, 2024
    Applicant: SHENZHEN YANYI NEW MATERIALS CO., LTD.
    Inventors: Kai YANG, Shi-Qi ZHANG, Wei-Jing FENG, Xiao-Fei ZHANG, Chao QIAN, Min YUE, Bo LIU
  • Patent number: 11868758
    Abstract: A method to improve the updating of firmware in a firmware updating system, uses serially-sent data packets containing the update and data. The firmware updating system includes storage, including an expander/switch, a baseboard manager controller (BMC), and a storage interface. A universal asynchronous receiver/transmitter (UART) for serial communication in the expander/switch is initialized and firmware updating instruction is sent to the expander/switch by the BMC. The firmware data packets are sent to the expander/switch by the BMC. A serial instruction to reset is sent to the expander/switch by the BMC and the BMC ends a communication with the UART serial. A firmware updating system applying the method is also provided.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: January 9, 2024
    Assignee: Fulian Precision Electronics (Tianjin) Co., LTD.
    Inventors: Jie Yuan, Shi-Qi Chen
  • Patent number: 11829616
    Abstract: A method for identifying a connection slot used by a hard disk includes determining the name of a program or system kernel connected to a hard disk; determining slot information corresponding to the kernel name; generating a soft link relating the kernel name to the slot information. The soft link has a relationship with and coexists with the kernel name. A terminal device and a non-volatile storage medium therein, for performing the above-described method, are also disclosed.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: November 28, 2023
    Assignee: Fulian Precision Electronics (Tianjin) Co., LTD.
    Inventors: Jie Yuan, Shi-Qi Chen
  • Publication number: 20230312644
    Abstract: The present invention relates to a compound simultaneously having triple activities of thrombolysis, antithrombosis and free radical scavenging, as well as the preparation method, composition, and applications thereof. The compound is represented by the formula I shown below: wherein the definitions of T, Q, R1 and R2 are described herein. The compound of the present invention simultaneously has triple functions of thrombolysis, free radical scavenging and thrombus-targeting/antithrombosis. The present invention also relates to a pharmaceutical composition comprising the compound, and a preparation method and a nanostructure of the compound.
    Type: Application
    Filed: March 9, 2023
    Publication date: October 5, 2023
    Inventors: Shi-Qi Peng, Ming Zhao, Jian-Hui Wu, Yu-Ji Wang, Qi-Qi Feng
  • Patent number: 11740790
    Abstract: A method for monitoring hard disks, implemented in an electronic device, includes sequentially detecting a number of hard disk codes of hard disks recorded by a host bus adapter, and determining whether each hard disk code has a drive letter assigned; if one hard disk code is determined to not have a drive letter assigned, writing a first mark corresponding to the hard disk code in a register of the host bus adapter. When detection of all hard disk codes is completed, transmitting the first marks written in the register to a CPLD interface and detecting whether each hard disk corresponding to the first mark is in place. If one hard disk corresponding to the first mark is found to be in place, controlling the hard disk to output an alarm based on the first mark.
    Type: Grant
    Filed: January 2, 2022
    Date of Patent: August 29, 2023
    Assignee: Fulian Precision Electronics (Tianjin) Co., LTD.
    Inventors: Jie Yuan, Shi-Qi Chen
  • Publication number: 20230185464
    Abstract: A method for identifying a connection slot used by a hard disk includes determining the name of a program or system kernel connected to a hard disk; determining slot information corresponding to the kernel name; generating a soft link relating the kernel name to the slot information. The soft link has a relationship with and coexists with the kernel name. A terminal device and a non-volatile storage medium therein, for performing the above-described method, are also disclosed.
    Type: Application
    Filed: March 28, 2022
    Publication date: June 15, 2023
    Inventors: JIE YUAN, SHI-QI CHEN
  • Publication number: 20230116294
    Abstract: A method to improve the updating of firmware in a firmware updating system, uses serially-sent data packets containing the update and data. The firmware updating system includes storage, including an expander/switch, a baseboard manager controller (BMC), and a storage interface. A universal asynchronous receiver/transmitter (UART) for serial communication in the expander/switch is initialized and firmware updating instruction is sent to the expander/switch by the BMC. The firmware data packets are sent to the expander/switch by the BMC. A serial instruction to reset is sent to the expander/switch by the BMC and the BMC ends a communication with the UART serial. A firmware updating system applying the method is also provided.
    Type: Application
    Filed: November 12, 2021
    Publication date: April 13, 2023
    Inventors: JIE YUAN, SHI-QI CHEN
  • Publication number: 20230101977
    Abstract: A method for monitoring hard disks, implemented in an electronic device, includes sequentially detecting a number of hard disk codes of hard disks recorded by a host bus adapter, and determining whether each hard disk code has a drive letter assigned; if one hard disk code is determined to not have a drive letter assigned, writing a first mark corresponding to the hard disk code in a register of the host bus adapter. When detection of all hard disk codes is completed, transmitting the first marks written in the register to a CPLD interface and detecting whether each hard disk corresponding to the first mark is in place. If one hard disk corresponding to the first mark is found to be in place, controlling the hard disk to output an alarm based on the first mark.
    Type: Application
    Filed: January 2, 2022
    Publication date: March 30, 2023
    Inventors: JIE YUAN, SHI-QI CHEN
  • Patent number: 11462503
    Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a method for forming a semiconductor device is disclosed. A first interconnect layer including first interconnects is formed above a first substrate. A first bonding layer including first bonding contacts is formed above the first interconnect layer, such that each first interconnect is in contact with a respective first bonding contact. A second interconnect layer including second interconnects is formed above a second substrate. A second bonding layer including second bonding contacts is formed above the second interconnect layer, such that at least one second bonding contact is in contact with a respective second interconnect, and at least another second bonding contact is separated from the second interconnects. The first and second substrates are bonded in a face-to-face manner, such that each first bonding contact is in contact with one second bonding contact at a bonding interface.
    Type: Grant
    Filed: October 6, 2020
    Date of Patent: October 4, 2022
    Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Tao Wang, Si Ping Hu, Jia Wen Wang, Shi Qi Huang, Jifeng Zhu, Jun Chen, Zi Qun Hua
  • Patent number: 11348936
    Abstract: A method for forming a gate structure of a 3D memory device is provided. The method comprises forming an array wafer including a periphery region and a staircase and array region. A process of forming the array wafer comprises forming an etch stop layer on a first substrate in the periphery region, forming an array device on the first substrate in the staircase and array region, and forming at least one first vertical through in the periphery region and in contact with the etch stop layer. The method further comprises forming a CMOS wafer, and bonding the array wafer and the CMOS wafer. The method further comprises forming at least one through substrate contact penetrating the first substrate and the etch stop layer, and in contact with the at least one first vertical through contact.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: May 31, 2022
    Assignee: Yangtze Memory Technologies Co., Ltd.
    Inventors: Liang Chen, Lei Xue, Wei Liu, Shi Qi Huang
  • Patent number: 11342352
    Abstract: A method for forming a gate structure of a 3D memory device is provided. The method comprises forming an array wafer including a periphery region and a staircase and array region. A process of forming the array wafer comprises forming an array well structure in a first substrate in the periphery region, forming an array device on the first substrate in the staircase and array region, and forming at least one vertical through contact in the periphery region and in contact with the array well structure. The method further comprises forming a CMOS wafer, and bonding the array wafer and the CMOS wafer. The method further comprises forming at least one through substrate contact penetrating the first substrate and the array well structure, and in contact with the at least one vertical through contact.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: May 24, 2022
    Assignee: Yangtze Memory Technologies Co., Ltd.
    Inventors: Liang Chen, Lei Xue, Wei Liu, Shi Qi Huang
  • Patent number: 11270770
    Abstract: Local word line driver device, memory device, and fabrication method are provided. A local word line driver device includes a substrate and an array of transistor structures formed on the substrate. The transistor structures are configured in rows and columns. The substrate includes a plurality of first field regions each between adjacent rows of the transistor structures, and a plurality of second field regions each between adjacent columns of the transistor structures. A deep trench isolation structure is formed in at least one field region of: the plurality of first field regions or the plurality of second field regions, of the substrate.
    Type: Grant
    Filed: June 1, 2020
    Date of Patent: March 8, 2022
    Assignee: Yangtze Memory Technologies Co., Ltd.
    Inventors: Cheng Gan, Wei Liu, Shi Qi Huang, Shunfu Chen
  • Patent number: 11205619
    Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a semiconductor device includes a first and a second semiconductor structures. The first semiconductor structure includes a first interconnect layer including first interconnects. At least one first interconnect is a first dummy interconnect. The first semiconductor structure further includes a first bonding layer including first bonding contacts. Each first interconnect is in contact with a respective first bonding contact. The second semiconductor structure includes a second interconnect layer including second interconnects. At least one second interconnect is a second dummy interconnect. The second semiconductor structure further includes a second bonding layer including second bonding contacts. Each second interconnect is in contact with a respective second bonding contact. The semiconductor device further includes a bonding interface between the first and second bonding layers.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: December 21, 2021
    Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Tao Wang, Si Ping Hu, Jia Wen Wang, Shi Qi Huang, Jifeng Zhu, Jun Chen, Zi Qun Hua
  • Publication number: 20210355163
    Abstract: The present invention relates to a compound simultaneously having triple activities of thrombolysis, antithrombosis and free radical scavenging, as well as the preparation method, composition, and applications thereof. The compound is represented by the formula I shown below: wherein the definitions of T, Q, R1 and R2 are described herein. The compound of the present invention simultaneously has triple functions of thrombolysis, free radical scavenging and thrombus-targeting/antithrombosis. The present invention also relates to a pharmaceutical composition comprising the compound, and a preparation method and a nanostructure of the compound.
    Type: Application
    Filed: April 8, 2021
    Publication date: November 18, 2021
    Inventors: Shi-Qi PENG, Ming ZHAO, Jian-Hui WU, Yu-Ji WANG, Qi-Qi FENG
  • Publication number: 20210343742
    Abstract: A method for forming a gate structure of a 3D memory device is provided. The method comprises forming an etch stop structure in a first wafer, forming a first through contact in contact with the etch stop structure, bonding the first wafer to a second wafer to electrically connect the first through contact to a CMOS device of the second wafer, and forming a through substrate contact penetrating a first substrate of the first wafer and the etch stop structure, and in electrically contact with the CMOS device through the first through contact.
    Type: Application
    Filed: July 14, 2021
    Publication date: November 4, 2021
    Applicant: Yangtze Memory Technologies Co., Ltd.
    Inventors: Liang CHEN, Lei XUE, Wei LIU, Shi Qi HUANG
  • Patent number: 11094714
    Abstract: A method for forming a gate structure of a 3D memory device is provided. The method comprises forming an array wafer including a periphery region and a staircase and array region. A process of forming an array wafer comprises forming an alternating dielectric etch stop structure on a first substrate in the periphery region, forming an array device on the first substrate in the staircase and array region, and forming at least one first vertical through contact in the periphery region and in contact with the alternating dielectric etch stop structure. The method further comprises forming a CMOS wafer and bonding the array wafer and the CMOS wafer. The method further comprises forming at least one through substrate contact penetrating the first substrate and the alternating dielectric etch stop structure, and in contact with the at least one first vertical through contact.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: August 17, 2021
    Assignee: Yangtze Memory Technologies Co., Ltd.
    Inventors: Liang Chen, Lei Xue, Wei Liu, Shi Qi Huang
  • Patent number: D1049755
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: November 5, 2024
    Assignee: Lagom Kitchen Co.
    Inventors: Allison Leigh Cummings, Benjamin Andrew Bangser, David Shark Tong, Shi Qi