Patents by Inventor Shigeharu Tsunoda

Shigeharu Tsunoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11634577
    Abstract: A resin powder material comprising copolymerized polybutylene terephthalate resin powder and an inorganic substance, for example, fumed silica, having an average primary particle diameter of 100 nm or less in an amount up to 1.0 wt %. The polybutylene terephthalate resin comprises from 5 mol % to 15 mol % of Isophthalic acid and has powder with average particles diameter of 79 ?m and a maximum particles diameter of 106 ?m. Powder is obtained by grinding pellets of the copolymerized polybutylene terephthalate resin having a viscosity of 0.85 to 1.0 dl/g. Powder composition used for production of molded articles by powder laminate molding process.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: April 25, 2023
    Assignee: HITACHI, LTD.
    Inventors: Satoshi Arai, Shigeharu Tsunoda
  • Patent number: 11279083
    Abstract: A powder layered modeling apparatus capable of modeling a three-dimensional object using a material powder contains at least a crystalline resin and filler particles. A modeling unit which partitions a modeling space for laying a material powder layer by the material powder to mold the three-dimensional object, a powder laying unit capable of laying the material powder layer in the modeling space by moving the material powder along a first direction with respect to the modeling space, a powder laying unit capable of laying the material powder layer in the modeling space by moving the material powder along a second direction not parallel to the first direction, and an energy supply unit which supplies energy for melting or sintering the material powder to a part constituting a cross-sectional layer to be molded of the three-dimensional object of the material powder layer laid in the modeling space.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: March 22, 2022
    Assignee: HITACHI, LTD.
    Inventors: Akihiro Yamaguchi, Satoshi Arai, Shigeharu Tsunoda
  • Patent number: 10751937
    Abstract: The present invention prevents warp deformation of a molded object formed by laser powder layer laminating molding. There is provided a powder layer laminating molding method including a first step of forming a powder layer which includes powder of a thermoplastic resin, and a second step of sintering the powder layer by irradiating the formed powder layer with a beam having a heating action, in which a molded object is obtained by repeatedly performing the forming and the sintering of the powder layer in the first step and the second step, and an irradiation surface which is irradiated with the beam is divided into a plurality of small regions.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: August 25, 2020
    Assignee: Hitachi, Ltd.
    Inventors: Akihiro Yamaguchi, Satoshi Arai, Shigeharu Tsunoda
  • Patent number: 10568226
    Abstract: It is provided an electronic control device including a resin molded body, a metal body, and an electronic component, wherein the resin molded body and a main surface of the metal body are bonded, and at least a part of a side surface continuous to the main surface of the metal body is in contact with a side contact portion provided in the resin molded body.
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: February 18, 2020
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Satoshi Arai, Yukio Sakigawa, Shigeharu Tsunoda, Masaru Kamoshida, Shirou Oouchi
  • Patent number: 10507617
    Abstract: A laser welded structure is formed by laser welding together a resin molded body formed from a thermoplastic polymer alloy containing a crystalline resin and an amorphous resin and a metal body made of a metal. A glass transition temperature of the amorphous resin is lower than a melting start temperature of the crystalline resin.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: December 17, 2019
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Satoshi Arai, Shigeharu Tsunoda, Wataru Sawada, Masaru Kamoshida, Toshikazu Shigyo
  • Publication number: 20190275736
    Abstract: A powder layered modeling apparatus capable of modeling a three-dimensional object using a material powder contains at least a crystalline resin and filler particles. A modeling unit which partitions a modeling space for laying a material powder layer by the material powder to mold the three-dimensional object, a powder laying unit capable of laying the material powder layer in the modeling space by moving the material powder along a first direction with respect to the modeling space, a powder laying unit capable of laying the material powder layer in the modeling space by moving the material powder along a second direction not parallel to the first direction, and an energy supply unit which supplies energy for melting or sintering the material powder to a part constituting a cross-sectional layer to be molded of the three-dimensional object of the material powder layer laid in the modeling space.
    Type: Application
    Filed: September 17, 2018
    Publication date: September 12, 2019
    Applicant: HITACHI, LTD.
    Inventors: Akihiro YAMAGUCHI, Satoshi ARAI, Shigeharu TSUNODA
  • Publication number: 20190111617
    Abstract: The invention is to provide a resin powder that is highly robust with regard to temperature control and is capable of improving heat resistance of a molded article. In order to solve the above problem, the resin powder according to the invention uses a mixed resin powder in which a thermoplastic base resin powder and a thermoplastic high-melting-point resin powder having a melting point higher than that of the base resin powder are mixed together. For example, isophthalic acid copolymerized PBT (polybutylene terephthalate) is used in the base resin powder, and homo-PBT is used in the high-melting-point resin powder. Alternatively, a polyamide 12 is used in the base resin powder, and MXD nylon is used in the high-melting-point resin powder.
    Type: Application
    Filed: April 13, 2016
    Publication date: April 18, 2019
    Applicant: HITACHI, LTD.
    Inventors: Satoshi ARAI, Shigeharu TSUNODA
  • Publication number: 20180352670
    Abstract: It is provided an electronic control device including a resin molded body, a metal body, and an electronic component, wherein the resin molded body and a main surface of the metal body are bonded, and at least a part of a side surface continuous to the main surface of the metal body is in contact with a side contact portion provided in the resin molded body.
    Type: Application
    Filed: October 7, 2016
    Publication date: December 6, 2018
    Inventors: Satoshi ARAI, Yukio SAKIGAWA, Shigeharu TSUNODA, Masaru KAMOSHIDA, Shirou OOUCHI
  • Publication number: 20180222113
    Abstract: To prevent warp deformation of a molded object which is formed by laser powder layer laminating molding. There is provided a powder layer laminating molding method including a first step of forming a powder layer which includes powder of a thermoplastic resin, and a second step of sintering the powder layer by irradiating the formed powder layer with a beam having a heating action, in which a molded object is obtained by repeatedly performing the forming and the sintering of the powder layer in the first step and the second step, and an irradiation surface which is irradiated with the beam is divided into a plurality of small regions.
    Type: Application
    Filed: January 26, 2018
    Publication date: August 9, 2018
    Inventors: Akihiro YAMAGUCHI, Satoshi ARAI, Shigeharu TSUNODA
  • Patent number: 9964424
    Abstract: Provided are a laser-welded structure and a laser welding method for a cover and a housing ensuring high reliability and suppressing changes in characteristics due to burrs protruding into a subpassage of the flow sensor. To this end, this flow sensor is provided with a housing, a cover, a circuit chamber sealed between these and housing electronic components or wiring, and a subpassage through which the fluid flows that is to be sensed, and is characterized in that there are projections provided on both ends of the joining section of the cover where the housing and the cover are laser-welded, and the height of the projection on the subpassage side is greater than the height of the projection on the side opposite of the subpassage.
    Type: Grant
    Filed: January 27, 2014
    Date of Patent: May 8, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Satoshi Arai, Shigeharu Tsunoda, Shinobu Tashiro, Takeshi Morino
  • Patent number: 9945707
    Abstract: The purpose of the present invention is to provide a flow sensor that makes it possible to detect temperature abnormalities that the flow sensor has been exposed to and the time history of the flow sensor in a high-temperature environment from an externally visible cover material and that uses a cover material for which the laser welding quality can be guaranteed through visual inspection when the sensor is delivered as a product and even if the sensor is used in an abnormal state. A flow sensor provided with a housing, a cover, a circuit chamber that houses a wiring portion sealed between the housing and the cover, and an auxiliary passage through which the liquid to be sensed flows, wherein: a joint portion formed on the housing and a joint portion formed on the inner surface of the cover are joined together through the laser welding; the main material of the cover is a crystalline resin; the cover includes an amorphous alloy; and the cover is made to have a natural color.
    Type: Grant
    Filed: February 7, 2014
    Date of Patent: April 17, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Satoshi Arai, Shigeharu Tsunoda, Shinobu Tashiro, Akira Uenodan, Shinya Igarashi
  • Patent number: 9880034
    Abstract: Provided is a low-cost flow sensor which improves productivity while maintaining high quality and high reliability. This flow sensor is provided with a housing, a cover, a circuit chamber sealed between these and housing electronic components or wiring, and a subpassage through which the fluid flows that is to be detected, and is characterized in that the welding width of a first welded portion forming the circuit chamber is greater than the welding width of a part of the second welded portion forming the subpassage unit.
    Type: Grant
    Filed: February 7, 2014
    Date of Patent: January 30, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Satoshi Arai, Shigeharu Tsunoda, Shinobu Tashiro, Takeshi Morino
  • Patent number: 9880040
    Abstract: Provided is a welding structure which enables external visual checks and has improved stability of bonding properties at a laser weld between a cover and a housing of this flow sensor. This flow sensor is provided with a housing, a cover, a circuit chamber sealed between these and housing electronic components or wiring, and a subpassage through which the fluid flows that is to be sensed, and is characterized in that at least the part near the gate section of the cover that transmits the laser is thinner than the other parts that transmit the laser.
    Type: Grant
    Filed: February 7, 2014
    Date of Patent: January 30, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Satoshi Arai, Shigeharu Tsunoda, Shinobu Tashiro, Takeshi Morino
  • Publication number: 20170326812
    Abstract: A laser welded structure is formed by laser welding together a resin molded body formed from a thermoplastic polymer alloy containing a crystalline resin and an amorphous resin and a metal body made of a metal. A glass transition temperature of the amorphous resin is lower than a melting start temperature of the crystalline resin.
    Type: Application
    Filed: September 29, 2015
    Publication date: November 16, 2017
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Satoshi ARAI, Shigeharu TSUNODA, Wataru SAWADA, Masaru KAMOSHIDA, Toshikazu SHIGYO
  • Patent number: 9778086
    Abstract: A flow sensor includes an auxiliary channel having an opening into which a fluid to be measured is taken; a sensor element that measures the flow of the fluid to be measured; a housing that accommodates electronic parts; and a resin cover. The flow sensor is configured such that junctions of the housing and the cover are formed in locations where first target weld portions, which are formed so that the circuit chamber is surrounded, face each other and second target weld portions, which are disposed for additional reinforcement of the joints, face each other on a bonding face of the housing and a bonding face of the cover with a step being provided. The positioning of the housing and the cover is determined, and the first target weld portions are welded to each other and second target weld portions are welded to each other by way of laser radiation.
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: October 3, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Satoshi Arai, Shigeharu Tsunoda, Keiji Hanzawa, Shinobu Tashiro
  • Patent number: 9778085
    Abstract: A flow rate sensor includes: a housing made from a resin material and having a bottom base portion and a side wall, at least one surface side of the housing being open; a cover made from a resin material, covering the one surface side of the housing, welded to an upper surface of the side wall of the housing, and defining, with the bottom base portion and the side wall of the housing, an auxiliary passage within which a gas to be measured flows that is taken in from a main passage; and a flow rate detection unit disposed within the auxiliary passage. A protruding portion for height control is provided to one of the housing and the cover at least in a vicinity of the side wall around the flow rate detection unit so as to suppress sinking in of the cover during welding.
    Type: Grant
    Filed: November 4, 2014
    Date of Patent: October 3, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Satoshi Arai, Shigeharu Tsunoda, Shinobu Tashiro, Akira Uenodan
  • Publication number: 20170190905
    Abstract: Molded bodies formed from PA-12 resin lose elasticity by absorbing water and lose strength as a result. Due to this, application to only some products used in low humidity environments is possible, which is a problem that needed to be addressed. This resin powder material, for use in powder laminate molding methods, is characterized in that the resin powder is a polybutylene terephthalate resin which has a crystallization temperature lower than that of homopolybutylene terephthalate resins.
    Type: Application
    Filed: January 28, 2015
    Publication date: July 6, 2017
    Inventors: Satoshi ARAI, Shigeharu TSUNODA
  • Publication number: 20160252379
    Abstract: A flow rate sensor includes: a housing made from a resin material and having a bottom base portion and a side wall, at least one surface side of the housing being open; a cover made from a resin material, covering the one surface side of the housing, welded to an upper surface of the side wall of the housing, and defining, with the bottom base portion and the side wall of the housing, an auxiliary passage within which a gas to be measured flows that is taken in from a main passage; and a flow rate detection unit disposed within the auxiliary passage. A protruding portion for height control is provided to one of the housing and the cover at least in a vicinity of the side wall around the flow rate detection unit so as to suppress sinking in of the cover during welding.
    Type: Application
    Filed: November 4, 2014
    Publication date: September 1, 2016
    Inventors: Satoshi ARAI, Shigeharu TSUNODA, Shinobu TASHIRO, Akira UENODAN
  • Patent number: 9314942
    Abstract: An ingot cutting apparatus having at least one coolant pocket storing the coolant to be supplied to the blade, wherein the blade-abrasive-grain portion is brought into contact with the coolant stored in the at least one coolant pocket by causing the blade-abrasive-grain portion of the blade to travel through a groove portion provided at an upper portion of the at least one coolant pocket while driving to rotate the blade so that the coolant is supplied to the blade.
    Type: Grant
    Filed: October 8, 2009
    Date of Patent: April 19, 2016
    Assignee: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Hidehiko Nishino, Yoshihiro Hirano, Shigeharu Tsunoda
  • Publication number: 20160061642
    Abstract: The purpose of the present invention is to provide a flow sensor that makes it possible to detect temperature abnormalities that the flow sensor has been exposed to and the time history of the flow sensor in a high-temperature environment from an externally visible cover material and that uses a cover material for which the laser welding quality can be guaranteed through visual inspection when the sensor is delivered as a product and even if the sensor is used in an abnormal state. A flow sensor provided with a housing, a cover, a circuit chamber that houses a wiring portion sealed between the housing and the cover, and an auxiliary passage through which the liquid to be sensed flows, wherein: a joint portion formed on the housing and a joint portion formed on the inner surface of the cover are joined together through the laser welding; the main material of the cover is a crystalline resin; the cover includes an amorphous alloy; and the cover is made to have a natural color.
    Type: Application
    Filed: February 7, 2014
    Publication date: March 3, 2016
    Inventors: Satoshi ARAI, Shigeharu TSUNODA, Shinobu TASHIRO, Akira UENODAN, Shinya IGARASHI