Abstract: Provided is a welding structure which enables external visual checks and has improved stability of bonding properties at a laser weld between a cover and a housing of this flow sensor. This flow sensor is provided with a housing, a cover, a circuit chamber sealed between these and housing electronic components or wiring, and a subpassage through which the fluid flows that is to be sensed, and is characterized in that at least the part near the gate section of the cover that transmits the laser is thinner than the other parts that transmit the laser.

Abstract: Provided are a laser-welded structure and a laser welding method for a cover and a housing ensuring high reliability and suppressing changes in characteristics due to burrs protruding into a subpassage of the flow sensor. To this end, this flow sensor is provided with a housing, a cover, a circuit chamber sealed between these and housing electronic components or wiring, and a subpassage through which the fluid flows that is to be sensed, and is characterized in that there are projections provided on both ends of the joining section of the cover where the housing and the cover are laser-welded, and the height of the projection on the subpassage side is greater than the height of the projection on the side opposite of the subpassage.

Abstract: Provided is a low-cost flow sensor which improves productivity while maintaining high quality and high reliability. This flow sensor is provided with a housing, a cover, a circuit chamber sealed between these and housing electronic components or wiring, and a subpassage through which the fluid flows that is to be detected, and is characterized in that the welding width of a first welded portion forming the circuit chamber is greater than the welding width of a part of the second welded portion forming the subpassage unit.

Abstract: A flow sensor includes an auxiliary channel having an opening into which a fluid to be measured is taken; a sensor element that measures the flow of the fluid to be measured; a housing that accommodates electronic parts; and a resin cover. The flow sensor is configured such that junctions of the housing and the cover are formed in locations where first target weld portions, which are formed so that the circuit chamber is surrounded, face each other and second target weld portions, which are disposed for additional reinforcement of the joints, face each other on a bonding face of the housing and a bonding face of the cover with a step being provided. The positioning of the housing and the cover is determined, and the first target weld portions are welded to each other and second target weld portions are welded to each other by way of laser radiation.

Abstract: A temporary part is fixed to a base by using an adhesive layer to which fillers are mixed at a predetermined density. When the temporary part is heated, heat is applied to the fillers and the adhesive layer. At a temperature equal to or higher than the glass-transition temperature of the adhesive agent, the heated adhesive layer is thermally contracted so as to release remaining stress, and on the other hand, the heated fillers are thermally expanded. In this manner, the peel-off strength between the adhesive layer and the base (or the temporary part) is reduced, and the disassembly is facilitated.

Abstract: To ensure required adhesion even when a pipe of a piping module collides with a temporary material during transport and achieve easier dismantling, the following measure is taken: the temporary material is fixed on a support rack to prevent the piping module placed on the support rack from largely displaced during conveyance and after the conveyance of the piping module, the temporary material is removed from the support rack. In this method, the following measures are taken: at the step of fixing the temporary material to the support rack, the temporary material is bonded to the support rack with the piping module set therein using adhesive; and at the step of removing the temporary material from the support rack after the conveyance of the piping module, the temporary material bonded to the support rack with the adhesive is peeled off from the support rack with heat applied thereto.

Abstract: A temporary part is fixed to a base by using an adhesive layer to which fillers are mixed at a predetermined density. When the temporary part is heated, heat is applied to the fillers and the adhesive layer. At a temperature equal to or higher than the glass-transition temperature of the adhesive agent, the heated adhesive layer is thermally contracted so as to release remaining stress, and on the other hand, the heated fillers are thermally expanded. In this manner, the peel-off strength between the adhesive layer and the base (or the temporary part) is reduced, and the disassembly is facilitated.

Abstract: A semiconductor device includes a semiconductor chip, a first substrate, and a second substrate. The first substrate includes a plurality of wires and a plurality of first electrodes, each first electrode being connected with each wire. The second substrate includes the semiconductor chip that is mounted thereon, and a plurality of second electrodes with, each second electrode being connected with the each first electrode of the first substrate. The widths of the wires of the first substrate are different depending on the lengths of the wires. By changing the widths of the wires depending on their lengths, it is possible to reduce variation in stiffness of the electrodes and vicinities of electrodes, whereby variation in ultrasonic bonding strength can be reduced.

Abstract: An ingot cutting apparatus having at least one coolant pocket storing the coolant to be supplied to the blade, wherein the blade-abrasive-grain portion is brought into contact with the coolant stored in the at least one coolant pocket by causing the blade-abrasive-grain portion of the blade to travel through a groove portion provided at an upper portion of the at least one coolant pocket while driving to rotate the blade so that the coolant is supplied to the blade.

Abstract: A semiconductor device includes a semiconductor chip, a first substrate, and a second substrate. The first substrate includes a plurality of wires and a plurality of first electrodes, each first electrode being connected with each wire. The second substrate includes the semiconductor chip that is mounted thereon, and a plurality of second electrodes with, each second electrode being connected with the each first electrode of the first substrate. The widths of the wires of the first substrate are different depending on the lengths of the wires. By changing the widths of the wires depending on their lengths, it is possible to reduce variation in stiffness of the electrodes and vicinities of electrodes, whereby variation in ultrasonic bonding strength can be reduced.

Abstract: A semiconductor device is provided with a film substrate that has through-vias that are formed by filling a conductive material in through-holes that pass through the front and rear of a film-shaped substrate body and wiring or terminals that connect to the through-vias, with a semiconductor element being mounted on the film-shaped substrate body by terminal members thereof being electrically connected to the wiring or terminals of the film substrate.

Abstract: The present invention aims to improve the durability of an RFID chip inlet. A module including an RFID chip amounted to an antenna is covered with polyimide film with an adhesive layer to make up an RFID inlet. The outer surface of the RFID inlet is then covered with the surface processed to increase surface lubricity of a base part. When the RFID inlet is for use in a rubber product, it is mounted to a rubber base of the rubber product, the exposed surface of the RFID inlet is covered with an unvulcanized rubber, and the unvulcanized rubber is then pressed and heated causing the RFID inlet to be embedded in the rubber base.

Abstract: A highly reliable inexpensive RFID medium (Radio-frequency Identification medium) and a method of manufacturing the same is provided, particularly for small, thin RFID mediums. A RFID medium includes a transmitting/receiving antenna 2 and an IC chip 3. A rectangular part of a base sheet 1, having a major surface on which transmitting/receiving antennas 2 are formed, is folded along one of the long sides thereof, and the other three sides are bonded to the base sheet 1 so as to cover the transmitting/receiving antenna 2 and the IC chip 3 connected to the transmitting/receiving antenna 2. The base sheet 1 has spacing parts of a predetermined shape for covering the transmitting/receiving antenna 2 and the IC chip 3 connected to the transmitting/receiving antenna 2. The transmitting/receiving antennas 2 and the spacing parts 22 are arranged alternately. The base sheet 1 is rolled in a roll.

Abstract: There is a method of manufacturing an RFID, in which a semiconductor chip with a memory is bonded to an antenna, so that the information recorded in the memory can be transmitted through the antenna. In the RFID, a PET film, a PEN film, or a sheet of paper is used as the base material of the antenna. The method includes: aligning the semiconductor chip with gold bumps relative to the antenna, in which a metal foil formed of an aluminum or an aluminum alloy is adhered to the base material, including a polyethylene terephthalate or a polyethylene naphthalate; pressing the semiconductor chip to the antenna; and applying ultrasonic waves under an ambient temperature lower than the glass transition temperature of the polyethylene terephthalate or the polyethylene naphthalate, to thereby bond the gold bumps and the metal foil. Thus, the method suppresses the deformation of the antenna.

Abstract: A semiconductor device which includes a semiconductor chip, an insulating film formed on the semiconductor chip, a plurality of projected stress relaxation materials formed on the insulating film, projected electrodes covering at least tops of the stress relaxation materials, and wiring lines for electrically connecting the projected electrodes and element electrodes of the semiconductor chip.

Abstract: A semiconductor apparatus in which flip chip bonding is enabled without any underfill, and which comprises a semiconductor device, an electrically insulating layer formed on the semiconductor device by mask-printing an electrically insulating material containing particles, and an external connection terminal formed on the electrically insulating layer and electrically connected with an electrode of the semiconductor device. The electrically insulating layer is formed with a thickness so as to provide ?-ray shielding of the semiconductor device.

Abstract: A semiconductor device is provided which enables a flip chip connection without use of underfill. The semiconductor device includes a semiconductor element having circuit electrodes and a circuit surface coated with a protecting film. A stress relaxation layer is provided by coating a cured thermoplastic resin onto the protecting film of the circuit surface in a manner which leaves the circuit electrodes exposed and curing it and having an inclination in the edge portion thereof. A wiring layer with wirings is connected to each of the circuit electrodes and disposed so as to make an electrical connection from the circuit electrodes, via the edge portion of the stress relaxation layer, and to a desired portion on the surface of the stress relaxation layer. A protecting film is provided thereon, and an external connection terminal is also provided.

Abstract: There is a method of manufacturing an RFID, in which a semiconductor chip with a memory is bonded to an antenna, so that the information recorded in the memory can be transmitted through the antenna. In the RFID, a PET film, a PEN film, or a sheet of paper is used as the base material of the antenna. The method includes: aligning the semiconductor chip with gold bumps relative to the antenna, in which a metal foil formed of an aluminum or an aluminum alloy is adhered to the base material, including a polyethylene terephthalate or a polyethylene naphthalate; pressing the semiconductor chip to the antenna; and applying ultrasonic waves under an ambient temperature lower than the glass transition temperature of the polyethylene terephthalate or the polyethylene naphthalate, to thereby bond the gold bumps and the metal foil. Thus, the method suppresses the deformation of the antenna.

Abstract: The present invention aims to improve the durability of an RFID chip inlet. A module including an RFID chip amounted to an antenna is covered with polyimide film with an adhesive layer to make up an RFID inlet. The outer surface of the RFID inlet is then covered with the surface processed to increase surface lubricity of a base part. When the RFID inlet is for use in a rubber product, it is mounted to a rubber base of the rubber product, the exposed surface of the RFID inlet is covered with an unvulcanized rubber, and the unvulcanized rubber is then pressed and heated causing the RFID inlet to be embedded in the rubber base.

Abstract: A highly reliable inexpensive RFID medium (Radio-frequency Identification medium) and a method of manufacturing the same is provided, particularly for small, thin RFID mediums. A RFID medium includes a transmitting/receiving antenna 2 and an IC chip 3. A rectangular part of a base sheet 1, having a major surface on which transmitting/receiving antennas 2 are formed, is folded along one of the long sides thereof, and the other three sides are bonded to the base sheet 1 so as to cover the transmitting/receiving antenna 2 and the IC chip 3 connected to the transmitting/receiving antenna 2. The base sheet 1 has spacing parts of a predetermined shape for covering the transmitting/receiving antenna 2 and the IC chip 3 connected to the transmitting/receiving antenna 2. The transmitting/receiving antennas 2 and the spacing parts 22 are arranged alternately. The base sheet 1 is rolled in a roll.