Abstract: In the power distributor using a semiconductor switching element, input terminals 10I and 10L, output terminals 12A-12J, connected to the element, and more preferably, the board terminals 30 and 32, are structured by a metallic plate, and arranged on the same plane perpendicular to the plate thickness. The metallic plate can be integrated by the resin mold, thereby the structure can be greatly simplified. The metallic plate can be produced by a greatly simple method by which, after the punching out of the metallic plate and the molding of the resin mold, a predetermined portion of the metallic plate is cut and the semiconductor switching element is mounted, and it can contribute to also the reduction of the cost.

Abstract: Instead of a relay block which is present in bus bar circuits in a conventional electric junction box, semiconductor switching devices 14 are provided, and a power distributing unit PD which is independent of a bus bar circuit unit JB is structured by concentrating these semiconductor switching devices 14, output terminals 12 of this power distributing unit PD being connected to appropriate bus bars 32 of the bus bar circuit unit JB. The power distributing unit PD and the bus bar circuit unit JB are incorporated in a common housing 40.

Abstract: A power distributor having: a bus bar aggregation B made out of a single plate material; semiconductor switching devices 14 mounted on the bus bar aggregation B; and a housing 22 made out of an electrical insulating material such as resin or the like and molded around the device-containing bus bar aggregation B. Amethod of manufacturing the power distributor is constituted by the steps of: forming the bus bar aggregation B; molding the housing 22 around the bus bar aggregation B after the semiconductor switching devices 14 are mounted on the bus bar aggregation B; and completing a power distribution circuit after cutting off suitable portions of the bus bar aggregation B after the molding.

Abstract: A power distributor having a power distribution circuit, and a housing 22 in which the power distribution circuit is housed, and a method of connecting a control circuit board 18 to the power distributor. A board support portion 32 for supporting the control circuit board 18 in an erect state is provided in the housing 22. The control circuit board 18 and the power distribution circuit are connected to each other through a wiring material 30 in the condition that the control circuit board 18 is supported by the board support portion 32. Then, the control circuit board 18 is toppled over to thereby be housed in the housing 22.

Abstract: A circuit-constituting unit forming a distribution circuit or the like in a vehicle. The circuit-constituting unit includes a plurality of bus bars for constituting a power circuit; a semiconductor switching device provided in the power circuit; and a control circuit board. The bus bars are bonded to a surface of the control circuit board such that the bus bars are arranged to be generally coplanar with each other. The semiconductor switching device is mounted on both of the corresponding bus bars and the control circuit board. An opening may be formed through the control circuit board. In this case, one of terminals of the semiconductor switching device may be connected to a surface of the control circuit board facing away from the surface to which the bus bars are bonded. The other terminals may be connected respectively to the bus bar through the opening.

Abstract: In a cooling structure for a vehicle control unit in which semiconductor elements are housed in a case 34 made of a resin, such as a power distributor, a heat sink member 56 which is connected to the semiconductor elements in a heat transferable manner is disposed on an outer face of the case 34. A plurality of fins 56f are formed on a face of the heat sink member which is exposed to the outside of the case. Ribs 34f are formed on the outer face of the case. The ribs 34f cover end portions of the fins 56f in positions where the ribs are joined to the end portions of the fins, respectively.

Abstract: Instead of a relay block which is present in bus bar circuits in a conventional electric junction box, semiconductor switching devices 14 are provided, and a power distributing unit PD which is independent of a bus bar circuit unit JB is structured by concentrating these semiconductor switching devices 14, output terminals 12 of this power distributing unit PD being connected to appropriate bus bars 32 of the bus bar circuit unit JB. The power distributing unit PD and the bus bar circuit unit JB are incorporated in a common housing 40.

Abstract: An electric power distributor mountable on a motor vehicle for distributing power from a power source installed in the motor vehicle to a plurality of electric load units equipped in the vehicle has a plurality of semiconductor operative elements which are incorporated in a power supply circuit from the power source to the electric load units; a control circuit board incorporated with a control circuit for controlling an operation of the semiconductor operative elements; a housing for encasing the semiconductor operative elements and the control circuit board therein; and a heat releasing member provided on an outer surface of the housing to release heat transferred from the semiconductor operative elements outside of the housing.

Abstract: A terminal is mounted on an electric wiring board that has both a wire circuit formed by a wire and a printed circuit formed by a printed conductor. The terminal includes a connecting portion capable of electrically connecting an internal circuit of the electric wiring board to an external circuit, a lead portion capable of being electrically connected to the printed circuit of the electric wiring board, and a press-fitting portion capable of being electrically connected to the wire circuit. The electric wiring board may be mounted in an electric junction box. A load supporting member may be provided which transfer a load acting on the terminal from a connector of the external circuit to the housing. The load supporting member may include an engaging portion provided at an end surface of a wiring circuit board, and a retaining portion provided on a side wall of the housing.

Abstract: A MOSFET 150 composed of a bare tip is surface mounted on a bus bar 141 disposed on the surface of an insulated plate 140, and the MOSFET 150 is circuit connected to a bus bar substrate 14 or to a printed circuit board 145 disposed integrally on the bus bar substrate 14 through a wire 151. In the bus bar 141, there is disposed a heat radiating member 155 which is used to radiate heat generated from the MOSFET 150 into an external space.

Abstract: An electric power distributor mountable on a motor vehicle for distributing power from a power source installed in the motor vehicle to a plurality of electric load units equipped in the vehicle has a plurality of semiconductor operative elements which are incorporated in a power supply circuit from the power source to the electric load units; a control circuit board incorporated with a control circuit for controlling an operation of the semiconductor operative elements; a housing for encasing the semiconductor operative elements and the control circuit board therein; and a heat releasing member provided on an outer surface of the housing to release heat transferred from the semiconductor operative elements outside of the housing.

Abstract: A common insulating plate 16 is prepared such that a plurality of paired upper and lower electric wire fitting grooves 16b and 16d are formed straight in the insulating plate 16 at a constant pitch P1 in the transverse direction, and such that a plurality of press-fitting slits 16e are formed in the individual electric wire fitting grooves 16a and 16c at a constant pitch P2 in the longitudinal direction; compression relay terminals 17 are press-fitted in suitable positions of the individual press-fitting slits 16e: and the electric wires 15 are individually fitted in the paired upper and lower electric wire fitting grooves 16b and 16d having the compression relay terminals 17 press-fitted therein, so that the upper and lower electric wires 15 are individually compressed and connected in the upper and lower compression blades 17a and 17b of the compression relay terminals 17 so that the upper and lower electric wires 15 of the insulating plate 16 can be electrically connected.

Abstract: A fuse main body made of a conductor in which connection terminals are provided at the opposite ends of a fusing portion is covered by an insulating covering member except part of the two connection terminals. The connection terminals are electrically connected with the fuse by being inserted into forked inserting portions of press-contact blades. The covering member is formed with slit-shaped notches which are shaped such that leading ends of the press-contact blades are insertable and adapted to partly expose the connection terminals. The height of the fuse can be shortened, which in turn contributes to a substantially smaller electrical connection box in which the fuse is to be mounted.

Abstract: A power distributor comprising a power distribution circuit, and a housing 22 in which the power distribution circuit is housed, and a method of connecting a control circuit board 18 to the power distributor. A board support portion 32 for supporting the control circuit board 18 in an erect state is provided in the housing 22. The control circuit board 18 and the power distribution circuit are connected to each other through a wiring material 30 in the condition that the control circuit board 18 is supported by the board support portion 32. Then, the control circuit board 18 is toppled over to thereby be housed in the housing 22.

Abstract: A power distributor having: a bus bar aggregation B made out of a single plate material; semiconductor switching devices 14 mounted on the bus bar aggregation B; and a housing 22 made out of an electrical insulating material such as resin or the like and molded around the device-containing bus bar aggregation B.

Abstract: In a cooling structure for a vehicle control unit in which semiconductor elements are housed in a case 34 made of a resin, such as a power distributor, a heat sink member 56 which is connected to the semiconductor elements in a heat transferable manner is disposed on an outer face of the case 34. A plurality of fins 56f are formed on a face of the heat sink member which is exposed to the outside of the case. Ribs 34f are formed on the outer face of the case. The ribs 34f cover end portions of the fins 56f in positions where the ribs are joined to the end portions of the fins, respectively.

Abstract: Instead of a relay block which is present in bus bar circuits in a conventional electric junction box, semiconductor switching devices 14 are provided, and a power distributing unit PD which is independent of a bus bar circuit unit JB is structured by concentrating these semiconductor switching devices 14, output terminals 12 of this power distributing unit PD being connected to appropriate bus bars 32 of the bus bar circuit unit JB. The power distributing unit PD and the bus bar circuit unit JB are incorporated in a common housing 40.

Abstract: In the power distributor using a semiconductor switching element, input terminals 10I and 10L, output terminals 12A-12J, connected to the element, and more preferably, the board terminals 30 and 32, are structured by a metallic plate, and arranged on the same plane perpendicular to the plate thickness. The metallic plate can be integrated by the resin mold, thereby the structure can be greatly simplified. The metallic plate can be produced by a greatly simple method by which, after the punching out of the metallic plate and the molding of the resin mold, a predetermined portion of the metallic plate is cut and the semiconductor switching element is mounted, and it can contribute to also the reduction of the cost.

Abstract: A MOSFET 150 composed of a bare tip is surface mounted on a bus bar 141 disposed on the surface of an insulated plate 140, and the MOSFET 150 is circuit connected to a bus bar substrate 14 or to a printed circuit board 145 disposed integrally on the bus bar substrate 14 through a wire 151. In the bus bar 141, there is disposed a heat radiating member 155 which is used to radiate heat generated from the MOSFET 150 into an external space.

Abstract: Bus bars 16(A to D) and 17(A to C) on the two faces of an insulating plate 15 can be electrically connected by arranging the longitudinal bus bars 17(A to C) on one face of the insulating plate 15 and the transverse bus bars 16(A to D) on the other face of the insulating plate 15, by fitting recesses 16a to 16d of the bus bars 16(A to D) of at least the one face at the suitable positions of the intersecting portions of the bus bars 16(A to D) and 17(A to C) of the two faces in through holes 15a of the insulating plate 15 to bring the recesses 16a to 16d into contact with the bus bars 17(A to C) of the face, as confronted thereby, and to weld them 16a to 16d to the same bus bars 17(A to C).