Patents by Inventor Shigeo Amagi
Shigeo Amagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8784715Abstract: A pre-molded part is formed by pre-molding an insert with a pre-molded member, and then the pre-molded part is inserted into an over-molded member composed of thermo plastic resin. After applying a heat treatment with a temperature lower than a crystalline melting point of the pre-molded part to the pre-molded part surrounding the insert, a firm contact between the insert and the resin surrounding the insert without a gap at the interface between those parts is obtained.Type: GrantFiled: November 12, 2009Date of Patent: July 22, 2014Assignee: Hitachi, Ltd.Inventors: Katsuhide Oohashi, Shigeo Amagi, Osamu Miyo
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Patent number: 8653652Abstract: A semiconductor device includes: a case with an opening formed thereat; a semiconductor element housed inside the case; a first conductor plate housed inside the case and positioned at one surface side of the semiconductor element; a second conductor plate housed inside the case and positioned at another surface side of the semiconductor element; a positive bus bar electrically connected to the first conductor plate, through which DC power is supplied; a negative bus bar electrically connected to the second conductor plate, through which DC power is supplied; a first resin member that closes off the opening at the case; and a second resin member that seals the semiconductor element, the first conductor plate and the second conductor plate and is constituted of a material other than a material constituting the first resin member.Type: GrantFiled: August 24, 2010Date of Patent: February 18, 2014Assignee: Hitachi Automotive Systems, Ltd.Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito, Toshiya Satoh, Hideaki Ishikawa, Nobutake Tsuyuno, Shigeo Amagi
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Publication number: 20120300522Abstract: A semiconductor device includes: a case with an opening formed thereat; a semiconductor element housed inside the case; a first conductor plate housed inside the case and positioned at one surface side of the semiconductor element; a second conductor plate housed inside the case and positioned at another surface side of the semiconductor element; a positive bus bar electrically connected to the first conductor plate, through which DC power is supplied; a negative bus bar electrically connected to the second conductor plate, through which DC power is supplied; a first resin member that closes off the opening at the case; and a second resin member that seals the semiconductor element, the first conductor plate and the second conductor plate and is constituted of a material other than a material constituting the first resin member.Type: ApplicationFiled: August 24, 2010Publication date: November 29, 2012Applicant: Hitachi Automotive Systems, Ltd.Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito, Toshiya Satoh, Hideaki Ishikawa, Nobutake Tsuyuno, Shigeo Amagi
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Patent number: 7723619Abstract: Continuous annular resin bands surrounding electrical contact portions of respective terminals are disposed without gaps between the electrical contact portions of respective terminals and resin members that fixedly hold the terminals; there are formed gaps among the adjoining resin bands. Gaps are formed among a bundle of terminals having annular resin bands and resin members surrounding the bundle. A partial adhesion is formed at the interface between the terminals and the resin by a low cost manufacturing method, whereby a molding with high air-tightness between the interior and exterior thereof and high reliability is realized.Type: GrantFiled: March 19, 2004Date of Patent: May 25, 2010Assignee: Hitachi, Ltd.Inventors: Katsuhide Ohashi, Shigeo Amagi, Osamu Miyo, Sadayuki Aoki
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Publication number: 20100052213Abstract: A pre-mold part is formed by pre-molding the insert with the pre-molded part, and then the pre-molded part is inserted into the over-molded part composed of thermo plastic resin. After applying a heat treatment with the temperature lower than a crystalline melting point of the pre-molded part to the pre-molded part surrounding the insert formed as the composite mold part surrounding the pre-mold part, a firm contact between the insert and the resin surrounding the insert part without no gap at the interface between those parts is obtained.Type: ApplicationFiled: November 12, 2009Publication date: March 4, 2010Applicant: Hitachi, Ltd.Inventors: Katsuhide OOHASHI, Shigeo AMAGI, Osamu MIYO
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Patent number: 7255610Abstract: An integrally multiple-molded part for electronic devices is provided capable of absorbing and relieving the internal stresses of a multiple-molded part, preventing the occurrence of clearances between the bonding side face of each electrical connection terminal and a resin, obtaining stable frictional force at the contact region between the bonding surface of the electrical connection terminal and an aluminum wire, obtaining the energy required for bonding, and achieving high bondability. The surface of the molded electrical connection terminal section formed as a primary-molded article becomes exposed after secondary molding, and a stress-absorbing structure is formed in the primary molding resin section of the primary-molded article that serves as a transmission path for stresses associated with the resin shrinkage occurring when the secondary molding resin is cured.Type: GrantFiled: December 30, 2005Date of Patent: August 14, 2007Assignee: Hitachi, Ltd.Inventors: Katsuhide Oohashi, Shigeo Amagi, Osamu Miyo
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Publication number: 20070167047Abstract: Continuous annular resin bands surrounding electrical contact portions of respective terminals are disposed without gaps between the electrical contact portions of respective terminals and resin members that fixedly hold the terminals; there are formed gaps among the adjoining resin bands. Gaps are formed among a bundle of terminals having annular resin bands and resin members surrounding the bundle. A partial adhesion is formed at the interface between the terminals and the resin by a low cost manufacturing method, whereby a molding with high air-tightness between the interior and exterior thereof and high reliability is realized.Type: ApplicationFiled: March 19, 2004Publication date: July 19, 2007Applicant: HITACHI, LTD.Inventors: Katsuhide Ohashi, Shigeo Amagi, Osamu Mito, Sadayuki Aoki
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Patent number: 7147929Abstract: A highly reliable resin-molded stator not suffering insulation breakdown between the different phases of the stator coils even when the operation mode where the output of a rotary machine using a resin-molded stator in which a stator coil wound around a plurality of slots and a stator coil provided at the stator core end are resin-molded is to be increased from the level under a stopped status to the maximum achievable level within a short time is repeated. Also disclosed is a method of manufacturing such a stator, and a rotary machine using the same.Type: GrantFiled: September 2, 2005Date of Patent: December 12, 2006Assignee: Hitachi, Ltd.Inventors: Shigeo Amagi, Osamu Koizumi
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Publication number: 20060186522Abstract: An integrally multiple-molded part for electronic devices is provided capable of absorbing and relieving the internal stresses of a multiple-molded part, preventing the occurrence of clearances between the bonding side face of each electrical connection terminal and a resin, obtaining stable frictional force at the contact region between the bonding surface of the electrical connection terminal and an aluminum wire, obtaining the energy required for bonding, and achieving high bondability. The surface of the molded electrical connection terminal section formed as a primary-molded article becomes exposed after secondary molding, and a stress-absorbing structure is formed in the primary molding resin section of the primary-molded article that serves as a transmission path for stresses associated with the resin shrinkage occurring when the secondary molding resin is cured.Type: ApplicationFiled: December 30, 2005Publication date: August 24, 2006Applicant: HITACHI, LTD.Inventors: Katsuhide Oohashi, Shigeo Amagi, Osamu Miyo
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Patent number: 7067943Abstract: A highly reliable resin-molded stator not suffering insulation breakdown between different phases of stator coils even when the operation mode is repeated where the output of a rotary machine using a resin-molded stator is to be increased from the level under a stopped status to the maximum achievable level within a short time. Also provided are methods of manufacturing such a stator, and a rotary machine using the same. The a resin-molded stator of the invention comprises a stator core, electrically insulated stator coils wound around the plurality of slots or protrusions provided in the axial direction of the stator core, and molding resin with which are molded the stator core and the stator coils located at the aforementioned slots or protrusions. At the stator core end, non-adhesive structure is established between the molding resin and at least one of the end faces of the stator core.Type: GrantFiled: March 19, 2003Date of Patent: June 27, 2006Assignee: Hitachi, Ltd.Inventors: Shigeo Amagi, Osamu Koizumi
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Publication number: 20060001192Abstract: A pre-mold part is formed by pre-molding the insert part composed of composite materials composed of metal, ceramic, resin or any combination of those materials with the pre-mold part composed of thermo plastic resin having crystallinity, and then, the pre-mold part is inserted into the over-mold part composed of thermo plastic resin. After applying the heat treatment with the temperature lower than the crystalline melting point of the pre-mold part to the pre-mold part surrounding the insert part formed as the composite mold part surrounding the pre-mold part, the insert molding is completed finally. Mold parts having high-reliable insert parts enable to establish firm contact between the insert part and the resin surrounding the insert part without no gap at the interface between those parts can be obtained by a low-cost production method.Type: ApplicationFiled: June 28, 2005Publication date: January 5, 2006Applicant: Hitachi, Ltd.Inventors: Katsuhide Oohashi, Shigeo Amagi, Osamu Miyo
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Publication number: 20050285456Abstract: A highly reliable resin-molded stator not suffering insulation breakdown between the different phases of the stator coils even when the operation mode where the output of a rotary machine using a resin-molded stator in which a stator coil wound around a plurality of slots and a stator coil provided at the stator core end are resin-molded is to be increased from the level under a stopped status to the maximum achievable level within a short time is repeated. Also disclosed is a method of manufacturing such a stator, and a rotary machine using the same.Type: ApplicationFiled: September 2, 2005Publication date: December 29, 2005Applicant: HITACHI, LTD.Inventors: Shigeo Amagi, Osamu Koizumi
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Publication number: 20040226740Abstract: In order to provide an electric machine winding having an insulating layer excellent in electric characteristics and an insulating layer of an electric machine winding excellent in electric characteristics, a high-thermal-conductivity insulating layer 11 is formed around the peripheral portion of a winding conductor 10 by the use of a high-thermal-conductivity insulating tape 1 having a mica layer 3, a reinforcing material layer 5, and a high-thermal-conductivity filler layer 7, wherein the amount of resin of the mica layer 3 makes up 10 wt % to 25 wt % of the total weight of the insulating material and wherein the amount of resin of the high-thermal-conductivity filler layer 7 makes up 10 wt % to 25 wt % of the total weight of the insulating material.Type: ApplicationFiled: March 9, 2004Publication date: November 18, 2004Applicant: Hitachi, Ltd.Inventors: Tomoya Tsunoda, Mitsuru Onoda, Shigeo Amagi, Tatsuo Honda
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Publication number: 20040178691Abstract: To reduce the stator size and realize a compact, high-efficiency and high-output rotary electric machine.Type: ApplicationFiled: August 15, 2003Publication date: September 16, 2004Applicant: HITACHI, LTD.Inventors: Kazuaki Sanada, Takashi Matsunobu, Shigeo Amagi, Mamoru Kimura
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Patent number: 6746758Abstract: In order to provide an electric machine winding having an insulating layer excellent in electric characteristics and an insulating layer of an electric machine winding excellent in electric characteristics, a high-thermal-conductivity insulating layer 11 is formed around the peripheral portion of a winding conductor 10 by the use of a high-thermal-conductivity insulating tape 1 having a mica layer 3, a reinforcing material layer 5, and a high-thermal-conductivity filler layer 7, wherein the amount of resin of the mica layer 3 makes up 10 wt % to 25 wt % of the total weight of the insulating material and wherein the amount of resin of the high-thermal-conductivity filler layer 7 makes up 10 wt % to 25 wt % of the total weight of the insulating material.Type: GrantFiled: August 1, 2002Date of Patent: June 8, 2004Assignee: Hitachi, Ltd.Inventors: Tomoya Tsunoda, Mitsuru Onoda, Shigeo Amagi, Tatsuo Honda
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Publication number: 20040080676Abstract: A display device substrate which meets requirements for weight reduction, thickness reduction, high reliability, good heat resistance, and good impact resistance all at once. The display device substrate is composed of a pair of glass sheets facing each other and a layer of plastics material interposed between said paired glass sheets in such a way that said glass sheets have an internal compressive strain ascribed to the plastic sheet. Thus, the very thin glass sheets are hardly liable to breakage. This makes light weight and reduced thickness compatible with reliability.Type: ApplicationFiled: October 21, 2003Publication date: April 29, 2004Inventors: Hitoshi Oaku, Yasuo Hanawa, Shigeo Amagi, Tomoji Oishi, Katsumi Kondou
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Publication number: 20040061386Abstract: The object of the present invention is to provide not only a highly reliable resin-molded stator not suffering insulation breakdown between the different phases of the stator coils even when the operation mode where the output of a rotary machine using a resin-molded stator in which a stator coil wound around a plurality of slots and a stator coil provided at the stator core end are resin-molded is to be increased from the level under a stopped status to the maximum achievable level within a short time is repeated, but also a method of manufacturing such a stator, and a rotary machine using the same.Type: ApplicationFiled: March 19, 2003Publication date: April 1, 2004Applicant: Hitachi, Ltd.Inventors: Shigeo Amagi, Osamu Koizumi
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Patent number: 6660387Abstract: A display device substrate which meets requirements for weight reduction, thickness reduction, high reliability, good heat resistance, and good impact resistance all at once. The display device substrate is composed of a pair of glass sheets facing each other and a layer of plastics material interposed between said paired glass sheets in such a way that said glass sheets have an internal compressive strain ascribed to the plastic sheet. Thus, the very thin glass sheets are hardly liable to breakage. This makes light weight and reduced thickness compatible with reliability.Type: GrantFiled: March 20, 2002Date of Patent: December 9, 2003Assignee: Hitachi, Ltd.Inventors: Hitoshi Oaku, Yasuo Hanawa, Shigeo Amagi, Tomoji Oishi, Katsumi Kondou
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Publication number: 20030077453Abstract: A display device substrate which meets requirements for weight reduction, thickness reduction, high reliability, good heat resistance, and good impact resistance all at one once. The display device substrate is composed of a pair of glass sheets facing each other and a layer of plastics material interposed between said paired glass sheets in such a way that said glass sheets have an internal compressive strain ascribed to the plastic sheet. Thus, the very thin glass sheets are hardly liable to breakage. This makes light weight and reduced thickness compatible with reliability.Type: ApplicationFiled: March 20, 2002Publication date: April 24, 2003Inventors: Hitoshi Oaku, Yasuo Hanawa, Shigeo Amagi, Tomoji Oishi, Katsumi Kondou
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Publication number: 20030035960Abstract: In order to provide an electric machine winding having an insulating layer excellent in electric characteristics and an insulating layer of an electric machine winding excellent in electric characteristics, a high-thermal-conductivity insulating layer 11 is formed around the peripheral portion of a winding conductor 10 by the use of a high-thermal-conductivity insulating tape 1 having a mica layer 3, a reinforcing material layer 5, and a high-thermal-conductivity filler layer 7, wherein the amount of resin of the mica layer 3 makes up 10 wt % to 25 wt % of the total weight of the insulating material and wherein the amount of resin of the high-thermal-conductivity filler layer 7 makes up 10 wt % to 25 wt % of the total weight of the insulating material.Type: ApplicationFiled: August 1, 2002Publication date: February 20, 2003Applicant: Hitachi, Ltd.Inventors: Tomoya Tsunoda, Mitsuru Onoda, Shigeo Amagi, Tatsuo Honda