Patents by Inventor Shigeo Amagi

Shigeo Amagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8784715
    Abstract: A pre-molded part is formed by pre-molding an insert with a pre-molded member, and then the pre-molded part is inserted into an over-molded member composed of thermo plastic resin. After applying a heat treatment with a temperature lower than a crystalline melting point of the pre-molded part to the pre-molded part surrounding the insert, a firm contact between the insert and the resin surrounding the insert without a gap at the interface between those parts is obtained.
    Type: Grant
    Filed: November 12, 2009
    Date of Patent: July 22, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Katsuhide Oohashi, Shigeo Amagi, Osamu Miyo
  • Patent number: 8653652
    Abstract: A semiconductor device includes: a case with an opening formed thereat; a semiconductor element housed inside the case; a first conductor plate housed inside the case and positioned at one surface side of the semiconductor element; a second conductor plate housed inside the case and positioned at another surface side of the semiconductor element; a positive bus bar electrically connected to the first conductor plate, through which DC power is supplied; a negative bus bar electrically connected to the second conductor plate, through which DC power is supplied; a first resin member that closes off the opening at the case; and a second resin member that seals the semiconductor element, the first conductor plate and the second conductor plate and is constituted of a material other than a material constituting the first resin member.
    Type: Grant
    Filed: August 24, 2010
    Date of Patent: February 18, 2014
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito, Toshiya Satoh, Hideaki Ishikawa, Nobutake Tsuyuno, Shigeo Amagi
  • Publication number: 20120300522
    Abstract: A semiconductor device includes: a case with an opening formed thereat; a semiconductor element housed inside the case; a first conductor plate housed inside the case and positioned at one surface side of the semiconductor element; a second conductor plate housed inside the case and positioned at another surface side of the semiconductor element; a positive bus bar electrically connected to the first conductor plate, through which DC power is supplied; a negative bus bar electrically connected to the second conductor plate, through which DC power is supplied; a first resin member that closes off the opening at the case; and a second resin member that seals the semiconductor element, the first conductor plate and the second conductor plate and is constituted of a material other than a material constituting the first resin member.
    Type: Application
    Filed: August 24, 2010
    Publication date: November 29, 2012
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito, Toshiya Satoh, Hideaki Ishikawa, Nobutake Tsuyuno, Shigeo Amagi
  • Patent number: 7723619
    Abstract: Continuous annular resin bands surrounding electrical contact portions of respective terminals are disposed without gaps between the electrical contact portions of respective terminals and resin members that fixedly hold the terminals; there are formed gaps among the adjoining resin bands. Gaps are formed among a bundle of terminals having annular resin bands and resin members surrounding the bundle. A partial adhesion is formed at the interface between the terminals and the resin by a low cost manufacturing method, whereby a molding with high air-tightness between the interior and exterior thereof and high reliability is realized.
    Type: Grant
    Filed: March 19, 2004
    Date of Patent: May 25, 2010
    Assignee: Hitachi, Ltd.
    Inventors: Katsuhide Ohashi, Shigeo Amagi, Osamu Miyo, Sadayuki Aoki
  • Publication number: 20100052213
    Abstract: A pre-mold part is formed by pre-molding the insert with the pre-molded part, and then the pre-molded part is inserted into the over-molded part composed of thermo plastic resin. After applying a heat treatment with the temperature lower than a crystalline melting point of the pre-molded part to the pre-molded part surrounding the insert formed as the composite mold part surrounding the pre-mold part, a firm contact between the insert and the resin surrounding the insert part without no gap at the interface between those parts is obtained.
    Type: Application
    Filed: November 12, 2009
    Publication date: March 4, 2010
    Applicant: Hitachi, Ltd.
    Inventors: Katsuhide OOHASHI, Shigeo AMAGI, Osamu MIYO
  • Patent number: 7255610
    Abstract: An integrally multiple-molded part for electronic devices is provided capable of absorbing and relieving the internal stresses of a multiple-molded part, preventing the occurrence of clearances between the bonding side face of each electrical connection terminal and a resin, obtaining stable frictional force at the contact region between the bonding surface of the electrical connection terminal and an aluminum wire, obtaining the energy required for bonding, and achieving high bondability. The surface of the molded electrical connection terminal section formed as a primary-molded article becomes exposed after secondary molding, and a stress-absorbing structure is formed in the primary molding resin section of the primary-molded article that serves as a transmission path for stresses associated with the resin shrinkage occurring when the secondary molding resin is cured.
    Type: Grant
    Filed: December 30, 2005
    Date of Patent: August 14, 2007
    Assignee: Hitachi, Ltd.
    Inventors: Katsuhide Oohashi, Shigeo Amagi, Osamu Miyo
  • Publication number: 20070167047
    Abstract: Continuous annular resin bands surrounding electrical contact portions of respective terminals are disposed without gaps between the electrical contact portions of respective terminals and resin members that fixedly hold the terminals; there are formed gaps among the adjoining resin bands. Gaps are formed among a bundle of terminals having annular resin bands and resin members surrounding the bundle. A partial adhesion is formed at the interface between the terminals and the resin by a low cost manufacturing method, whereby a molding with high air-tightness between the interior and exterior thereof and high reliability is realized.
    Type: Application
    Filed: March 19, 2004
    Publication date: July 19, 2007
    Applicant: HITACHI, LTD.
    Inventors: Katsuhide Ohashi, Shigeo Amagi, Osamu Mito, Sadayuki Aoki
  • Patent number: 7147929
    Abstract: A highly reliable resin-molded stator not suffering insulation breakdown between the different phases of the stator coils even when the operation mode where the output of a rotary machine using a resin-molded stator in which a stator coil wound around a plurality of slots and a stator coil provided at the stator core end are resin-molded is to be increased from the level under a stopped status to the maximum achievable level within a short time is repeated. Also disclosed is a method of manufacturing such a stator, and a rotary machine using the same.
    Type: Grant
    Filed: September 2, 2005
    Date of Patent: December 12, 2006
    Assignee: Hitachi, Ltd.
    Inventors: Shigeo Amagi, Osamu Koizumi
  • Publication number: 20060186522
    Abstract: An integrally multiple-molded part for electronic devices is provided capable of absorbing and relieving the internal stresses of a multiple-molded part, preventing the occurrence of clearances between the bonding side face of each electrical connection terminal and a resin, obtaining stable frictional force at the contact region between the bonding surface of the electrical connection terminal and an aluminum wire, obtaining the energy required for bonding, and achieving high bondability. The surface of the molded electrical connection terminal section formed as a primary-molded article becomes exposed after secondary molding, and a stress-absorbing structure is formed in the primary molding resin section of the primary-molded article that serves as a transmission path for stresses associated with the resin shrinkage occurring when the secondary molding resin is cured.
    Type: Application
    Filed: December 30, 2005
    Publication date: August 24, 2006
    Applicant: HITACHI, LTD.
    Inventors: Katsuhide Oohashi, Shigeo Amagi, Osamu Miyo
  • Patent number: 7067943
    Abstract: A highly reliable resin-molded stator not suffering insulation breakdown between different phases of stator coils even when the operation mode is repeated where the output of a rotary machine using a resin-molded stator is to be increased from the level under a stopped status to the maximum achievable level within a short time. Also provided are methods of manufacturing such a stator, and a rotary machine using the same. The a resin-molded stator of the invention comprises a stator core, electrically insulated stator coils wound around the plurality of slots or protrusions provided in the axial direction of the stator core, and molding resin with which are molded the stator core and the stator coils located at the aforementioned slots or protrusions. At the stator core end, non-adhesive structure is established between the molding resin and at least one of the end faces of the stator core.
    Type: Grant
    Filed: March 19, 2003
    Date of Patent: June 27, 2006
    Assignee: Hitachi, Ltd.
    Inventors: Shigeo Amagi, Osamu Koizumi
  • Publication number: 20060001192
    Abstract: A pre-mold part is formed by pre-molding the insert part composed of composite materials composed of metal, ceramic, resin or any combination of those materials with the pre-mold part composed of thermo plastic resin having crystallinity, and then, the pre-mold part is inserted into the over-mold part composed of thermo plastic resin. After applying the heat treatment with the temperature lower than the crystalline melting point of the pre-mold part to the pre-mold part surrounding the insert part formed as the composite mold part surrounding the pre-mold part, the insert molding is completed finally. Mold parts having high-reliable insert parts enable to establish firm contact between the insert part and the resin surrounding the insert part without no gap at the interface between those parts can be obtained by a low-cost production method.
    Type: Application
    Filed: June 28, 2005
    Publication date: January 5, 2006
    Applicant: Hitachi, Ltd.
    Inventors: Katsuhide Oohashi, Shigeo Amagi, Osamu Miyo
  • Publication number: 20050285456
    Abstract: A highly reliable resin-molded stator not suffering insulation breakdown between the different phases of the stator coils even when the operation mode where the output of a rotary machine using a resin-molded stator in which a stator coil wound around a plurality of slots and a stator coil provided at the stator core end are resin-molded is to be increased from the level under a stopped status to the maximum achievable level within a short time is repeated. Also disclosed is a method of manufacturing such a stator, and a rotary machine using the same.
    Type: Application
    Filed: September 2, 2005
    Publication date: December 29, 2005
    Applicant: HITACHI, LTD.
    Inventors: Shigeo Amagi, Osamu Koizumi
  • Publication number: 20040226740
    Abstract: In order to provide an electric machine winding having an insulating layer excellent in electric characteristics and an insulating layer of an electric machine winding excellent in electric characteristics, a high-thermal-conductivity insulating layer 11 is formed around the peripheral portion of a winding conductor 10 by the use of a high-thermal-conductivity insulating tape 1 having a mica layer 3, a reinforcing material layer 5, and a high-thermal-conductivity filler layer 7, wherein the amount of resin of the mica layer 3 makes up 10 wt % to 25 wt % of the total weight of the insulating material and wherein the amount of resin of the high-thermal-conductivity filler layer 7 makes up 10 wt % to 25 wt % of the total weight of the insulating material.
    Type: Application
    Filed: March 9, 2004
    Publication date: November 18, 2004
    Applicant: Hitachi, Ltd.
    Inventors: Tomoya Tsunoda, Mitsuru Onoda, Shigeo Amagi, Tatsuo Honda
  • Publication number: 20040178691
    Abstract: To reduce the stator size and realize a compact, high-efficiency and high-output rotary electric machine.
    Type: Application
    Filed: August 15, 2003
    Publication date: September 16, 2004
    Applicant: HITACHI, LTD.
    Inventors: Kazuaki Sanada, Takashi Matsunobu, Shigeo Amagi, Mamoru Kimura
  • Patent number: 6746758
    Abstract: In order to provide an electric machine winding having an insulating layer excellent in electric characteristics and an insulating layer of an electric machine winding excellent in electric characteristics, a high-thermal-conductivity insulating layer 11 is formed around the peripheral portion of a winding conductor 10 by the use of a high-thermal-conductivity insulating tape 1 having a mica layer 3, a reinforcing material layer 5, and a high-thermal-conductivity filler layer 7, wherein the amount of resin of the mica layer 3 makes up 10 wt % to 25 wt % of the total weight of the insulating material and wherein the amount of resin of the high-thermal-conductivity filler layer 7 makes up 10 wt % to 25 wt % of the total weight of the insulating material.
    Type: Grant
    Filed: August 1, 2002
    Date of Patent: June 8, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Tomoya Tsunoda, Mitsuru Onoda, Shigeo Amagi, Tatsuo Honda
  • Publication number: 20040080676
    Abstract: A display device substrate which meets requirements for weight reduction, thickness reduction, high reliability, good heat resistance, and good impact resistance all at once. The display device substrate is composed of a pair of glass sheets facing each other and a layer of plastics material interposed between said paired glass sheets in such a way that said glass sheets have an internal compressive strain ascribed to the plastic sheet. Thus, the very thin glass sheets are hardly liable to breakage. This makes light weight and reduced thickness compatible with reliability.
    Type: Application
    Filed: October 21, 2003
    Publication date: April 29, 2004
    Inventors: Hitoshi Oaku, Yasuo Hanawa, Shigeo Amagi, Tomoji Oishi, Katsumi Kondou
  • Publication number: 20040061386
    Abstract: The object of the present invention is to provide not only a highly reliable resin-molded stator not suffering insulation breakdown between the different phases of the stator coils even when the operation mode where the output of a rotary machine using a resin-molded stator in which a stator coil wound around a plurality of slots and a stator coil provided at the stator core end are resin-molded is to be increased from the level under a stopped status to the maximum achievable level within a short time is repeated, but also a method of manufacturing such a stator, and a rotary machine using the same.
    Type: Application
    Filed: March 19, 2003
    Publication date: April 1, 2004
    Applicant: Hitachi, Ltd.
    Inventors: Shigeo Amagi, Osamu Koizumi
  • Patent number: 6660387
    Abstract: A display device substrate which meets requirements for weight reduction, thickness reduction, high reliability, good heat resistance, and good impact resistance all at once. The display device substrate is composed of a pair of glass sheets facing each other and a layer of plastics material interposed between said paired glass sheets in such a way that said glass sheets have an internal compressive strain ascribed to the plastic sheet. Thus, the very thin glass sheets are hardly liable to breakage. This makes light weight and reduced thickness compatible with reliability.
    Type: Grant
    Filed: March 20, 2002
    Date of Patent: December 9, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Hitoshi Oaku, Yasuo Hanawa, Shigeo Amagi, Tomoji Oishi, Katsumi Kondou
  • Publication number: 20030077453
    Abstract: A display device substrate which meets requirements for weight reduction, thickness reduction, high reliability, good heat resistance, and good impact resistance all at one once. The display device substrate is composed of a pair of glass sheets facing each other and a layer of plastics material interposed between said paired glass sheets in such a way that said glass sheets have an internal compressive strain ascribed to the plastic sheet. Thus, the very thin glass sheets are hardly liable to breakage. This makes light weight and reduced thickness compatible with reliability.
    Type: Application
    Filed: March 20, 2002
    Publication date: April 24, 2003
    Inventors: Hitoshi Oaku, Yasuo Hanawa, Shigeo Amagi, Tomoji Oishi, Katsumi Kondou
  • Publication number: 20030035960
    Abstract: In order to provide an electric machine winding having an insulating layer excellent in electric characteristics and an insulating layer of an electric machine winding excellent in electric characteristics, a high-thermal-conductivity insulating layer 11 is formed around the peripheral portion of a winding conductor 10 by the use of a high-thermal-conductivity insulating tape 1 having a mica layer 3, a reinforcing material layer 5, and a high-thermal-conductivity filler layer 7, wherein the amount of resin of the mica layer 3 makes up 10 wt % to 25 wt % of the total weight of the insulating material and wherein the amount of resin of the high-thermal-conductivity filler layer 7 makes up 10 wt % to 25 wt % of the total weight of the insulating material.
    Type: Application
    Filed: August 1, 2002
    Publication date: February 20, 2003
    Applicant: Hitachi, Ltd.
    Inventors: Tomoya Tsunoda, Mitsuru Onoda, Shigeo Amagi, Tatsuo Honda