Abstract: In order to provide windings for electrical rotating machines having an insulating film superior in electrical characteristics, a high heat conductive insulating film 11 is formed at outer periphery of wound conductor 10 using a high heat conductive insulating tape, which includes a mica layer 3, a reinforcement layer 5, and a high heat conductive filler layer 7, wherein the resin content in each layer of the mica layer 3 and the high heat conductive filler layer 7 is specified in the range of 10-25% by weight based on the whole weight of the material. 1-80% by weight of said filler is spherical.

Abstract: The thermal expansion coefficient of a composite insulator layer is adjusted in order to suppress warping deformation in a multilayer printed wiring board caused by temperature change. The thicknesses and the covering ratios on the both sides of the electric conductor layer composing the multilayer printed wiring board are asymmetric with respect to the central plane. A multilayer printed wiring board is formed by laminating composite insulation layers and laminated bodies, the composite insulation layer being made of a cloth a resin impregnated into the cloth, the laminated body being composed of electric conductor layers formed by coating on a surface of the composite insulation layer. The thermal expansion coefficient of the composite insulation layer having a conductor layer with a higher covering ratio is set to be smaller than the thermal expansion coefficient of the composite insulation layer having a conductor layer with a lower covering ratio.

Abstract: An electric rotating machine having a rotor, rotatably disposed in an inner radius side of a stator through a gap, including rotor windings contained in a plurality of slots formed in a rotor core, a slot insulation placed between the rotor winding and the slot, an insulation block placed between a wedge arranged at a peripheral side of the rotor core outward of the rotor winding of the slot and the rotor winding. At least one of the slot insulation and the insulation block is an insulation formed by filling or mixing granular and/or short-fiber insulating materials having a thermal conductivity higher than 5 W/m·K in a resin and a thermal conductivity in a thickness direction higher than 0.35 W/m·K.

Abstract: An electric rotating machine having a rotor, rotatably disposed in an inner radius side of a stator through a gap, including rotor windings contained in a plurality of slots formed in a rotor core, a slot insulation placed between the rotor winding and the slot, an insulation block placed between a wedge arranged at a peripheral side of the rotor core outward of the rotor winding of the slot and a retaining insulation placed between a retainer for fixing the rotor winding in both sides in a shaft direction of the rotor core and the rotor winding. At least one of the slot insulation, the insulation block and the retaining insulation is an insulation formed by filling or mixing granular and/or short-fiber insulating materials having a thermal conductivity higher than 5 W/m·K in a resin and a thermal conductivity in a thickness direction higher than 0.35 W/m·K.

Abstract: In order to provide windings for electrical rotating machines having an insulating film superior in electrical characteristics, a high heat conductive insulating film 11 is formed at outer periphery of wound conductor 10 using a high heat conductive insulating tape, which comprises a mica layer 3, a reinforcement layer 5, and a high heat conductive filler layer 7, wherein the resin content in each layer of the mica layer 3 and the high heat conductive filler layer 7 is specified in the range of 10-25% by weight based on the whole weight of the material. 1-80% by weight of said filler is spherical.

Abstract: In order to provide windings for electrical rotating machines having an insulating film superior in electrical characteristics, a high heat conductive insulating film 11 is formed at outer periphery of wound conductor 10 using a high heat conductive insulating tape, which includes a mica layer 3, a reinforcement layer 5, and a high heat conductive filler layer 7, wherein the resin content in each layer of the mica layer 3 and the high heat conductive filler layer 7 is specified in the range of 10-25% by weight based on the whole weight of the material. 1-80% by weight of said filler is spherical.

Abstract: An the electric rotating machine which is compact and of reduced cost by improving the thermal conductivity of the main insulation in the thickness direction while maintaining the insulation breakdown voltage of the main insulation high. The initial breakdown voltage V in the thickness direction of the main insulator 30 of the stator winding 3 is higher than 20 kV/mm, and the thermal conductivity &lgr; in the thickness direction is within a range of 0.35 to 1 W/m·K, and the product V&lgr; of the initial breakdown voltage V and the thermal conductivity &lgr; satisfies a relationship of 7≦V&lgr;≦20 (MWA/m2·K). The amount of resin is within a range of 20 to 50 weight % of the main insulation material.

Abstract: The high thermoconductive insulating film 11 was formed around the outer periphery of the wound conductors 10, using the high thermoconductive insulating tape 1 comprising the mica layer 3, the reinforcement layer 5, and the high thermoconductive filler layer 7, wherein the resin content in each layer of the mica layer 3 and the high thermoconductive filler layer 7 is specified to the range of 10-25% by weight of the total weight of the material.

Abstract: A multi-layer wiring structure for mounting electronic devices is provided to be used in an electronic computer, a work station or the like, and more particularly a multi-layer packaging board having microscopic wiring layers, which board has an excellent dimensional stability and a high reliability, and also a method of producing such a board are provided. The multi-layer wiring structure includes a complex of at least two sub-assemblies each having wiring layers formed respectively on opposite sides of a core material of a low thermal expansive metal through an insulation layer in such a manner that the wiring layers correspond in area ratio to each other. The sub-assemblies are connected to one another by conductors via through holes.

Abstract: A superconducting magnet coil, an insulating layer, and a superconducting magnet which do not generate quenching under cooled and operational conditions are provided by using a fixing resin capable of suppressing microcrack generation in a resin layer which causes quenching.A superconducting magnet coil manufactured by winding a superconducting wire and fixing the wire with resin and a method for manufacturing thereof, wherein said resin is a low cooling restricted thermal stress and high toughness fixing resin having a release rate of elastic energy G.sub.IC at 4.2 K. of at least 250 J.multidot.m.sup.-2, and/or a stress intensity factor K.sub.IC of at least 1.5 MPa.multidot..sqroot.m, and/or a stress safety factor at 4.2 K. of at least 3, and an allowable defect size at least of 0.3 mm.The superconducting magnet coil manufactured in accordance with the present invention does not cause quenching because microcracks are not generated in said resin when the coil is cooled to the liquid helium temperature, i.e.

Abstract: A thermoplastic resin composition for casting high-voltage coils containing two kinds of fillers (A) and (B), and products as molded coils and panels obtained by casting and curing the composition.The composition of the present invention contains 60%-85% by weight, based on the total weight of the composition, of a silica type filler which is an admixture (A) a spherical silica having an average particle diameter of 0.1-0.9 .mu.m and (B) a ground silica having an average particle diameter of 3-9 .mu., the ratio A/(A+B) being 1%-7% by weight.Products as molded coils and panels prepared by using the composition have good resistance to cracking and resistance to moisture.

Abstract: A circuit board, which comprises an insulating substrate, a copper wiring having a coarsely roughened surface provided on the insulating substrate, and a copper oxide-reduced layer provided on the coarsely roughened surface of the copper wiring and formed by reduction of copper oxide and electroless plating, the copper oxide-reduced layer having a finely roughed surface and having a deposited layer of at least one of nickel and cobalt, where the copper oxide-reduced layer having a deposited layer of at least one of nickel and cobalt on the surface is roughened in a range of 0.05 to 5 .mu.m in terms of a maximum vertical distance between the top of convex parts and the bottom of concave parts of the copper oxide-reduced layer per .mu.m of the longitudinal distance of the copper oxide-reduced layer, and at least one of nickel and cobalt is deposited in an amount of 5.times.10.sup.-7 to 1.times.10.sup.-4 g/cm.sup.2 on the copper oxide-reduced layer, has a high adhesiveness to an insulating resin.