Patents by Inventor Shigeo Iriguchi
Shigeo Iriguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20100200643Abstract: A method for producing an electronic part unit, the method includes: mounting a first electronic part on a first surface of a first substrate by reflow soldering; mounting a second electronic part on a second surface of a second substrate by reflow soldering; adhering a second surface of the first substrate to a first surface of a third substrate; and adhering a second surface of the second substrate to a second surface of the third substrate.Type: ApplicationFiled: January 29, 2010Publication date: August 12, 2010Applicant: FUJITSU LIMITEDInventors: Nobuo Taketomi, Shigeo Iriguchi, Kazuhisa Tsunoi, Kiyoyuki Hatanaka
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Patent number: 7659937Abstract: A camera module includes a module structure constituted by a lens unit to which an image pickup lens is attached and a package to which an imaging element is attached so as to be opposite to the image pickup lens. An optical filter is arranged between the imaging element and the image pickup lens. A portion of a flat surface of the optical filter is fixed to a filter fixing portion via an adhesive. The optical filter is adhered to the filter fixing portion in a state in which an end portion formed by a side surface of the optical filter and the flat surface is in noncontact with the filter fixing portion or the adhesive. Minute particles generated from a cut surface of the optical filter fall outside the filter fixing portion.Type: GrantFiled: March 29, 2006Date of Patent: February 9, 2010Assignee: Fujitsu Microelectronics LimitedInventors: Masanori Onodera, Susumu Moriya, Izumi Kobayashi, Hiroshi Aoki, Koji Sawahata, Shigeo Iriguchi, Toshiyuki Honda, Katsuro Hiraiwa
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Patent number: 7564111Abstract: In an imaging apparatus constituted of a case body for mounting an imaging device and a flexible substrate bonding to an external connection terminal provided on the case body, the flexible substrate is bent along each face of case body 41 so as to surround case body 41. By bending the flexible substrate, a load applied to the flexible substrate is received at the bent portion of the flexible substrate, there is formed a structure hard to transmit the load to the bonding portion to the external connection terminal. Further, by fixing the case body to a portion of the flexible substrate with an adhesive agent, etc., there is formed a structure not to transmit a stress to the direction of peeling the flexible substrate from the external connection terminal. Also, the case body is covered with the flexible substrate equipped with an electromagnetic wave shield material.Type: GrantFiled: January 25, 2007Date of Patent: July 21, 2009Assignee: Fujitsu Microelectronics LimitedInventors: Koji Sawahata, Susumu Moriya, Hiroshi Aoki, Izumi Kobayashi, Toshiyuki Honda, Shigeo Iriguchi, Masashi Takenaka
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Publication number: 20090175010Abstract: A repair system which prevents heating of weakly heat resistant devices together and causing deterioration of the quality when preheating a first surface of the circuit board, wherein an electromagnetic induction material is buried in advance inside the circuit board near a specific electronic device envisioned as needed repair when becoming a defective electronic device in a production process and an electromagnetic coil emitting electromagnetic waves to an electromagnetic induction member in the vicinity of the repair device is provided and the heat generated by the electromagnetic induction member due to the electromagnetic waves enables the repair device to be heated and detached from the circuit board.Type: ApplicationFiled: October 9, 2008Publication date: July 9, 2009Applicant: Fujitsu LimitedInventors: Shigeo Iriguchi, Kiyoyuki Hatanaka, Satoshi Watanabe, Nobuo Taketomi, Keiichi Yamamoto, Masaru Sugie
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Publication number: 20070120050Abstract: In an imaging apparatus constituted of a case body for mounting an imaging device and a flexible substrate bonding to an external connection terminal provided on the case body, the flexible substrate is bent along each face of case body 41 so as to surround case body 41. By bending the flexible substrate, a load applied to the flexible substrate is received at the bent portion of the flexible substrate, there is formed a structure hard to transmit the load to the bonding portion to the external connection terminal. Further, by fixing the case body to a portion of the flexible substrate with an adhesive agent, etc., there is formed a structure not to transmit a stress to the direction of peeling the flexible substrate from the external connection terminal. Also, the case body is covered with the flexible substrate equipped with an electromagnetic wave shield material.Type: ApplicationFiled: January 25, 2007Publication date: May 31, 2007Inventors: Koji Sawahata, Susumu Moriya, Hiroshi Aoki, Izumi Kobayashi, Toshiyuki Honda, Shigeo Iriguchi, Masashi Takenaka
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Publication number: 20060243884Abstract: A camera module includes a module structure constituted by a lens unit to which an image pickup lens is attached and a package to which an imaging element is attached so as to be opposite to the image pickup lens. An optical filter is arranged between the imaging element and the image pickup lens. A portion of a flat surface of the optical filter is fixed to a filter fixing portion via an adhesive. The optical filter is adhered to the filter fixing portion in a state in which an end portion formed by a side surface of the optical filter and the flat surface is in noncontact with the filter fixing portion or the adhesive. Minute particles generated from a cut surface of the optical filter fall outside the filer fixing portion.Type: ApplicationFiled: March 29, 2006Publication date: November 2, 2006Applicant: FUJITSU LIMITEDInventors: Masanori Onodera, Susumu Moriya, Izumi Kobayashi, Hiroshi Aoki, Koji Sawahata, Shigeo Iriguchi, Toshiyuki Honda, Katsuro Hiraiwa
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Patent number: 7101205Abstract: A flexible printed circuit board that electrically connects a main body and a rotary body to each other is twisted in advance through an angle that is a half of an angle of rotation through which the rotary body is rotated. One end of the flexible printed circuit board is fixed to the main body, and the other end thereof is fixed to the rotary body. The rotary body is rotated in a direction causing the twist of the flexible printed circuit board to diminish.Type: GrantFiled: January 12, 2005Date of Patent: September 5, 2006Assignee: Fujitsu LimitedInventors: Kiyoyuki Hatanaka, Satoshi Watanabe, Shigeo Iriguchi, Nobuo Taketomi, Yoshitaka Muraoka
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Publication number: 20060073711Abstract: A flexible printed circuit board that electrically connects a main body and a rotary body to each other is twisted in advance through an angle that is a half of an angle of rotation through which the rotary body is rotated. One end of the flexible printed circuit board is fixed to the main body, and the other end thereof is fixed to the rotary body. The rotary body is rotated in a direction causing the twist of the flexible printed circuit board to diminish.Type: ApplicationFiled: January 12, 2005Publication date: April 6, 2006Applicant: FUJITSU LIMITEDInventors: Kiyoyuki Hatanaka, Satoshi Watanabe, Shigeo Iriguchi, Nobuo Taketomi, Yoshitaka Muraoka
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Publication number: 20030236102Abstract: A portable electronic apparatus includes a display part that displays information, and an approximately pipe-shaped protective part, provided around and thicker than the display part, which protects the display part by positioning the display part at a depressed portion from the protective part.Type: ApplicationFiled: June 4, 2003Publication date: December 25, 2003Applicant: FUJITSU LIMITEDInventors: Osamu Kawai, Satoshi Watanabe, Shigeo Iriguchi, Takeshi Okazaki, Masayuki Ozawa, Akio Munakata
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Patent number: 6538382Abstract: A plasma display apparatus has an electronic circuit module including a rigid substrate attached to a chassis thereof and a flexible substrate partially overlapped with the rigid substrate. The rigid substrate has chips and the flexible substrate has a first portion with apertures for exposing the chips and bonding pads and a second portion positioned on the outside of the rigid substrate. Bonding wires connect terminals of the chips with the bonding pads of the flexible substrate. A reinforcing pattern or a dummy pattern is provided in at least the first portion of the flexible substrate. The reinforcing pattern provides for rigidity for the first portion of the flexible substrate for accurate positioning of the bonding pads relative to the chips.Type: GrantFiled: October 5, 2001Date of Patent: March 25, 2003Assignees: Fujitsu Limited, Fujitsu Hitachi Plasma Display LimitedInventors: Kenji Kimura, Takeshi Kawahara, Taizo Ohno, Satoshi Watanabe, Shigeo Iriguchi, Takayoshi Nakamura
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Patent number: 6444923Abstract: At one end of a printed wiring board, there is formed a narrow-pitched electrode pattern and engagement patterns made of the same material as that of the electrode pattern. At one end of an FPC which is to be connected with the printed circuit board, there is formed a narrow-pitched electrode pattern and engagement patterns made of the same material as that of the electrode pattern. The engagement patterns in the printed wiring board being engageable with the engagement patterns in the FPC. When the two engagement patterns are engaged with each other, the electrode pattern of the printed wiring board is electrically connected with the electrode pattern of the FPC.Type: GrantFiled: June 2, 2000Date of Patent: September 3, 2002Assignee: Fujitsu LimitedInventors: Shigeo Iriguchi, Satoshi Watanabe, Yoshitaka Muraoka
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Publication number: 20020050788Abstract: A plasma display apparatus has an electronic circuit module including a rigid substrate attached to a chassis thereof and a flexible substrate partially overlapped with the rigid substrate. The rigid substrate has chips and the flexible substrate has a first portion with apertures for exposing the chips and bonding pads and a second portion positioned on the outside of the rigid substrate. Bonding wires connect terminals of the chips with the bonding pads of the flexible substrate. A reinforcing pattern or a dummy pattern is provided in at least the first portion of the flexible substrate. The reinforcing pattern provides for rigidity for the first portion of the flexible substrate for accurate positioning of the bonding pads relative to the chips.Type: ApplicationFiled: October 5, 2001Publication date: May 2, 2002Applicant: FUJITSU LIMITEDInventors: Kenji Kimura, Takeshi Kuwahara, Taizo Ohno, Satoshi Watanabe, Shigeo Iriguchi, Takayoshi Nakamura