Patents by Inventor Shigeru Hasegawa

Shigeru Hasegawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6289922
    Abstract: A flow control valve having a seating surface formed on a valve element to contact a valve seat when the valve is closed has a shape of a part of a hypothetical spherical surface having a spherical center at a center of a supporting member. Therefore, the distance from the center of the supporting member to the seating surface is kept constant, and the valve element can be seated at a periphery of the valve seat without a gap, even if the shaft is inclined. Thus, the valve leakage is reduced. The supporting member supports a shaft connected to the valve element movable in an axial direction of the shaft. The center of the supporting member is aligned with a center of the valve seat. Movement of the supporting member in a radial direction of the supporting member is prohibited. Therefore, the center of the supporting member is not displaced from the center of the valve seat in the radial direction. Accordingly, the displacement of the shaft in the radial direction can be prevented.
    Type: Grant
    Filed: June 14, 2000
    Date of Patent: September 18, 2001
    Assignee: Denso Corporation
    Inventors: Yuji Nakano, Shigeru Hasegawa, Hiroshi Takeyama, Yasuyoshi Yamada
  • Patent number: 6147368
    Abstract: A voltage-driven power semiconductor device includes a voltage-driven IEGT chip, a collector electrode plate, an emitter electrode plate, and an inductance material. The collector electrode plate is connected to the collector of the IEGT chip, and press-contacts the IEGT chip from its collector side. The emitter electrode plate press-contacts the IEGT chip from its emitter side. The inductance material has an inductance component and connects the emitter of the IEGT chip and the emitter electrode plate. In the voltage-driven power semiconductor device having this arrangement, an induced electromotive force is generated in the inductance material arranged between the emitter of the IEGT chip and the emitter electrode plate. This induced electromotive force can suppress a steep current change (di/dt) upon an OFF operation, and can further suppress a steep voltage change (dv/dt) caused by the current change (di/dt).
    Type: Grant
    Filed: July 14, 1998
    Date of Patent: November 14, 2000
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hironobu Kon, Yoshinoro Iwano, Mitsuhiko Kitagawa, Shigeru Hasegawa, Michiaki Hiyoshi
  • Patent number: 6095490
    Abstract: A flow control valve having a seating surface formed on a valve element to contact a valve seat when the valve is closed has a shape of a part of a hypothetical spherical surface having a spherical center at a center of a supporting member. Therefore, the distance from the center of the supporting member to the seating surface is kept constant, and the valve element can be seated at a periphery of the valve seat without a gap, even if the shaft is inclined. Thus, the valve leakage is reduced. The supporting member supports a shaft connected to the valve element movable in an axial direction of the shaft. The center of the supporting member is aligned with a center of the valve seat. Movement of the supporting member in a radial direction of the supporting member is prohibited. Therefore, the center of the supporting member is not displaced from the center of the valve seat in the radial direction. Accordingly, the displacement of the shaft in the radial direction can be prevented.
    Type: Grant
    Filed: July 21, 1998
    Date of Patent: August 1, 2000
    Assignee: Denso Corporation
    Inventors: Yuji Nakano, Shigeru Hasegawa, Hiroshi Takeyama, Yasuyoshi Yamada
  • Patent number: 5960286
    Abstract: A method of manufacturing power semiconductor device, having an area of 3 cm.sup.2 or more, comprises the step of preparing a power semiconductor device divided into cell blocks and forming power semiconductor elements whose minimum linewidth is less than 10 .mu.m and having at least main electrodes completed in the cell blocks, the step of determining cell blocks having faulty portions, and the step of selectively electrically separating the main electrodes in the faulty cell blocks from the main electrodes in the good cell blocks.
    Type: Grant
    Filed: April 29, 1997
    Date of Patent: September 28, 1999
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshihiro Minami, Shigeru Hasegawa, Hiroshi Takenaka, Tsuneo Ogura, Shinji Sato
  • Patent number: D445791
    Type: Grant
    Filed: September 13, 2000
    Date of Patent: July 31, 2001
    Assignee: TEAC Corporation
    Inventors: Masafumi Ito, Shigeru Hasegawa, Hiroyuki Watanabe, Katsuhiro Takashima
  • Patent number: D448354
    Type: Grant
    Filed: March 22, 2001
    Date of Patent: September 25, 2001
    Assignee: Teac Corporation
    Inventors: Masafumi Ito, Shigeru Hasegawa, Tooru Katayama
  • Patent number: D450670
    Type: Grant
    Filed: March 22, 2001
    Date of Patent: November 20, 2001
    Assignee: Teac Corporation
    Inventors: Masafumi Ito, Shigeru Hasegawa, Tooru Katayama
  • Patent number: D401917
    Type: Grant
    Filed: November 13, 1997
    Date of Patent: December 1, 1998
    Assignee: Teac Corporation
    Inventors: Masafumi Ito, Shigeru Hasegawa, Yoshinori Fuse
  • Patent number: D405448
    Type: Grant
    Filed: October 8, 1997
    Date of Patent: February 9, 1999
    Assignee: Teac Corporation
    Inventors: Masafumi Ito, Shigeru Hasegawa
  • Patent number: D408407
    Type: Grant
    Filed: October 8, 1997
    Date of Patent: April 20, 1999
    Assignee: Teac Corporation
    Inventors: Masafumi Ito, Shigeru Hasegawa, Keiji Tsunoda
  • Patent number: D408408
    Type: Grant
    Filed: October 8, 1997
    Date of Patent: April 20, 1999
    Assignee: Teac Corporation
    Inventors: Masafumi Ito, Shigeru Hasegawa, Keiji Tsunoda
  • Patent number: D408409
    Type: Grant
    Filed: February 24, 1998
    Date of Patent: April 20, 1999
    Assignee: Teac Corporation
    Inventors: Masafumi Ito, Shigeru Hasegawa, Katsuhiro Takashima
  • Patent number: D414768
    Type: Grant
    Filed: August 5, 1998
    Date of Patent: October 5, 1999
    Assignee: Teac Corporation
    Inventors: Masafumi Ito, Shigeru Hasegawa
  • Patent number: D415738
    Type: Grant
    Filed: April 7, 1998
    Date of Patent: October 26, 1999
    Assignee: TEAC Corporation
    Inventors: Masafumi Ito, Shigeru Hasegawa, Katsuhiro Takashima
  • Patent number: D416018
    Type: Grant
    Filed: April 16, 1998
    Date of Patent: November 2, 1999
    Assignee: Teac Corporation
    Inventors: Masafumi Ito, Shigeru Hasegawa, Yoshinori Fuse
  • Patent number: D419971
    Type: Grant
    Filed: August 18, 1998
    Date of Patent: February 1, 2000
    Assignee: Teac Corporation
    Inventors: Masafumi Ito, Shigeru Hasegawa
  • Patent number: D421754
    Type: Grant
    Filed: June 1, 1999
    Date of Patent: March 21, 2000
    Assignee: Teac Corporation
    Inventors: Masafumi Ito, Shigeru Hasegawa
  • Patent number: D424053
    Type: Grant
    Filed: December 17, 1998
    Date of Patent: May 2, 2000
    Assignee: Teac Corporation
    Inventors: Masafumi Ito, Shigeru Hasegawa, Katsuhiro Takashima
  • Patent number: D429705
    Type: Grant
    Filed: July 28, 1999
    Date of Patent: August 22, 2000
    Assignee: TEAC Corporation
    Inventors: Masafumi Ito, Shigeru Hasegawa, Katsuhiro Takashima, Hitoshi Yoshida
  • Patent number: D432081
    Type: Grant
    Filed: March 10, 1999
    Date of Patent: October 17, 2000
    Assignee: TEAC Corporation
    Inventors: Masafumi Ito, Shigeru Hasegawa, Katsuhiro Takashima