Abstract: An endoscope distal end structure includes: an imaging unit; a signal cable; and a distal end frame including a housing portion, and a cable connection portion configured to connect the signal cable. The housing portion is a recess formed on a distal end side of the distal end frame. The housing portion includes a side surface and a bottom surface provided with a connection terminal. At least a part of the cable connection portion is provided with a cable connection electrode that connects a core wire of the signal cable on a distal end side from a bottom surface of the housing portion with reference to the optical axis direction of the imaging unit. The connection terminal and the cable connection electrode are connected by a wiring pattern formed in the housing portion, an outer periphery of the distal end frame, and the cable connection portion.

Abstract: An endoscope includes an imager unit loading region provided at a distal end portion of an insertion portion, a cable connection surface, a wall provided to connect an opening of the imager unit loading region and an opening of the cable connection surface to each other, a contact pattern formed on a wall surface of the imager unit loading region, a wiring pattern formed on a front surface of the cable connection surface from the wall, a connection pattern formed on the cable connection surface, and a through-electrode formed in the wall so that the imager unit loading region and the cable connection surface communicate with each other, configured to cause the contact pattern and the wiring pattern to electrically continue to each other, and formed at a predetermined angle with respect to a center axis of the distal end barrel member.

Abstract: An electronic component holding member includes a first base material including an electronic component, a first resin molded product, and first metal patterns in which a signal pattern and a grounding pattern are formed on a non-planar surface, a second base material including a second resin molded product, and a second metal pattern formed on a non-planar surface so as to overlap at least part of the first metal patterns, and grounding wiring configured to connect the grounding pattern and the second metal pattern.

Abstract: An electronic module includes a first structure including a flat mounting surface on which an integrated circuit is mounted and a wiring surface including a surface including a portion that changes in a direction perpendicular to the mounting surface, a wire connected to the integrated circuit being extended on the wiring surface, a second structure disposed with a dielectric region interposed with respect to the wiring surface of the first structure, a metal pattern being provided on the second structure, and at least one spacer member that equalizes thickness of the dielectric region between the wire and the metal pattern in an entire range between the mounting surface and the wiring surface including the surface including the portion that changes in the direction perpendicular to the mounting surface.

Abstract: An endoscope includes an imager unit loading region provided at a distal end portion of an insertion portion, a cable connection surface, a wall provided to connect an opening of the imager unit loading region and an opening of the cable connection surface to each other, a contact pattern formed on a wall surface of the imager unit loading region, a wiring pattern formed on a front surface of the cable connection surface from the wall, a connection pattern formed on the cable connection surface, and a through-electrode formed in the wall so that the imager unit loading region and the cable connection surface communicate with each other, configured to cause the contact pattern and the wiring pattern to electrically continue to each other, and formed at a predetermined angle with respect to a center axis of the distal end barrel member.

Abstract: An endoscope includes an imager unit loading region formed in a distal end barrel member formed of a resin material, a cable connection surface provided on a proximal end side, a wall provided to connect an opening of the imager unit loading region and an opening of the cable connection surface, a plurality of contact patterns formed on a wall surface of the imager unit loading region, and configured to be electrically connected to electric contacts of an imager unit, a plurality of wiring patterns formed on a front surface of the cable connection surface from the wall, and configured to electrically continue to the plurality of contact patterns, and a plurality of connection patterns formed on the cable connection surface with larger intervals than intervals of the plurality of wiring patterns formed on the wall, with core wires of cables being electrically connected to the plurality of connection patterns.

Abstract: Image capturing module with imager module including lens and image sensing circuitry is fixed within a recess of a frame by resin between the imager module and surface(s) of the recess. The top surface of the lens has a surface feature(s), structural feature(s) or surface modification(s) that, during a process of disposing the resin, prevents the resin from covering a central region of the top surface of the lens. Surface features (e.g., a groove), structural features (e.g., a groove or a protrusion or a strip of material), and surface modifications (e.g., change in wettability or difference in surface chemistry with respect to the resin) are suitably located on top surface of lens to maintain an area not covered by resin that allows sufficient light propagation through lens for operability of Image capturing module. Methods of manufacture of such image capturing modules are also disclosed.

Abstract: A holding frame for an imaging unit arranged at a distal end of an endoscope includes a cylindrical three-dimensional molded interconnect device; a housing configured to house the imaging unit, the housing being formed of a notch; at least one cut face formed on the side face of the holding frame and obtained by cutting a support portion which is a gate portion into which a resin is injected when the holding frame is resin-molded; a connection terminal formed on a bottom face of the housing portion and configured to be connected to the imaging unit; a cable connection electrode arranged on a face where a proximal end side of the holding frame is notched; and a wiring pattern formed on a surface area of the holding frame excluding the cut face and configured to electrically connect the connection terminal and the cable connection electrode.

Abstract: An endoscope distal end structure includes: an imaging unit; a signal cable; and a distal end frame including a housing portion, and a cable connection portion configured to connect the signal cable. The housing portion is a recess formed on a distal end side of the distal end frame. The housing portion includes a side surface and a bottom surface provided with a connection terminal. At least a part of the cable connection portion is provided with a cable connection electrode that connects a core wire of the signal cable on a distal end side from a bottom surface of the housing portion with reference to the optical axis direction of the imaging unit. The connection terminal and the cable connection electrode are connected by a wiring pattern formed in the housing portion, an outer periphery of the distal end frame, and the cable connection portion.

Abstract: An endoscope distal end structure includes: an imager, a distal end frame that is a three-dimensional molded interconnect device including a housing portion and a cable connecting portion, the cable connecting portion including a cable connection electrode, the housing portion being formed by cutting out at least a part of an outer peripheral portion of the distal end frame, the housing portion having a bottom surface on which connection terminals are formed, and a first side surface and a second side surface which are continuous to each other and on which a ground pattern is formed, a through hole having electrical conductivity, the through hole penetrating from the bottom surface to the cable connecting portion, and an electrical conductive pattern connecting a cable connection electrode and the ground pattern, the electrical conductive pattern being arranged on a side surface of the distal end frame.

Abstract: A medical system includes an image pickup device configured to output, as image information, an electric signal after photoelectric conversion from a plurality of pixels, and a processing device that is connected to the image pickup device to allow bi-directional communication. The image pickup device includes a signal processing unit configured to perform a process of converting the electric signal into the image information, and to generate heat accompanying the process, a temperature detector that is provided in vicinity to the signal processing unit, and is configured to detect temperature of the signal processing unit, and an output unit configured to output temperature information on the temperature detected by the temperature detector, together with the image information. The processing device includes a controller configured to control the image pickup device based on the temperature information input from the output unit.

Abstract: A pixel portion of an image pick-up device having a pixel portion of pixels arranged in matrix converting a subject image to an electric signal, and a scanning unit of sub-scanning circuits outputting a video signal, a first scanning circuit selecting a pixel position in a first matrix direction and a second scanning circuit selecting a pixel position in a second direction intersecting the first direction. One of the first and second scanning circuits shares the signal lines. The image pick-up device includes a scanning control circuit controlling the first and second scanning circuits. The pixel area structures of the pickup device are uniform, the wirings are uniform, and the vertical and horizontal driving systems and an output system are uniform. Thus, pixel signals outputted from two output systems have no property differences and image quality is improved.

Abstract: An image pick-up apparatus includes an image pick-up device and a filter circuit. The image pick-up device includes a pixel portion for converting a subject image into an electric signal, a scanning circuit for dividing the pixel portion into a plurality of areas, for non-linearly dividing the boundary of the areas of at least one side of the adjacent areas based on the unit of pixel, and a plurality of output circuits for individually outputting video signals. The filter circuit performs filter processing of the video signals outputted from the plurality of output circuits for the pixels near the boundary of the areas. Thus, the image quality can be improved in the multi-channel output system.

Abstract: A image pick-up device includes a pseudo signal generating circuit which generates a pseudo video signal, a pseudo signal reading circuit which reads and outputs the pseudo signal from the pseudo signal generating circuit, and a level control circuit which controls the level of a signal outputted by the pseudo signal generating circuit or read into a pseudo signal reader. The image pick-up device can detect the property difference in signal lines.

Abstract: Disclosed herein is a package of solid-state imaging device for enclosing the solid-state imaging device having a plurality of signal output pads for outputting image signals, provided correspondingly to each of a plurality of image outputs, including: a plurality of inner leads for effecting electrical connection with each of the plurality of signal output pads of the solid-state imaging device; a plurality of lead frames each having a same configuration with another, formed correspondingly to each of the plurality of inner leads as continuation therefrom; and a plurality of electrical connection means formed as continuously connected to each of the plurality of lead frames.

Abstract: A solid-state image pickup apparatus having over solid-state image pickup device chip a hermetic seal portion comprising a flat-plate portion of a transparent member and a frame portion formed on a side portion of a lower surface of the flat-plate portion, said frame portion including a metal wiring, a bump formed on said solid-state image pickup device chip and electrically connected to the metal wiring, and a sealing region for sealing the periphery of the bump by a sealing material, thereby achieving the solid-state image pickup apparatus capable of being packaged in a relatively small size and capable of improving throughput and at the same time having a hermetic seal portion which can be readily electrically connected to an external terminal.

Abstract: A solid-state image pickup apparatus comprises a solid-state image sensor chip contained in a package. The solid-state image sensor chip has a first pad electrode arranged on one side edge and a second pad electrode arranged on another side edge, the first pad electrode and the second pad electrode being connected by interconnections in the package. By using the package interconnections, the interconnections in the chip can be simplified and the chip size can be reduced.

Abstract: Disclosed herein is a package of solid-state imaging device for enclosing the solid-state imaging device having a plurality of signal output pads for outputting image signals, provided correspondingly to each of a plurality of image outputs, including: a plurality of inner leads for effecting electrical connection with each of the plurality of signal output pads of the solid-state imaging device; a plurality of lead frames each having a same configuration with another, formed correspondingly to each of the plurality of inner leads as continuation therefrom; and a plurality of electrical connection means formed as continuously connected to each of the plurality of lead frames.

Abstract: An image pick-up device includes a pixel portion having the matrix arrangement of pixels for converting a subject image to an electric signal, and a scanning unit having a plurality of sub-scanning circuits for outputting a video signal, including a first scanning circuit for selecting a pixel position in a first direction of the matrix in the pixel portion and a second scanning circuit for selecting a pixel position in a second direction intersecting at the first direction. At least one of the first scanning circuit and the second scanning circuit shares the respective signal lines. Further, the image pick-up device includes a scanning control circuit for controlling the first scanning circuit and the second scanning circuit. The structures of pixel areas are uniform, the structures of wirings are uniform, and the structures of vertical and horizontal driving systems and an output system are uniform.

Abstract: A image pick-up device includes a pseudo signal generating circuit which generates a pseudo video signal, a pseudo signal reading circuit which reads and outputs the pseudo signal from the pseudo signal generating circuit, and a level control circuit which controls the level of a signal outputted by the pseudo signal generating circuit. The image pick-up device can detect the property difference in signal lines.