Abstract: A lamp includes an outer shell having heat conductivity, a base provided in the outer shell, and a cover provided in the outer shell. The outer shell has a light source support, and a heat radiating surface exposed to the outside of the outer shell. The light source support is formed integral with the heat radiating surface. A light source is supported on the light source support. The light source is heated during lighting, and thermally connected to the light source support. The light source is covered with the cover.

Abstract: A lamp includes an outer shell having heat conductivity, a base provided in the outer shell, and a cover provided in the outer shell. The outer shell has a light source support, and a heat radiating surface exposed to the outside of the outer shell. The light source support is formed integral with the heat radiating surface. A light source is supported on the light source support. The light source is heated during lighting, and thermally connected to the light source support. The light source is covered with the cover.

Abstract: According to one embodiment, a lamp unit includes a light-emitting module, a lighting circuit, and a housing. The light-emitting module includes a light emitting portion having a semiconductor light-emitting element. The lighting circuit lights the semiconductor light-emitting element. The housing includes a case opening in the direction of irradiation of light, and a base on a side of the case opposite from the direction of radiation of the light. The lighting circuit is accommodated in the case, and the light-emitting module is mounted on the base at a position closer to the base with respect to the position of the lighting circuit.

Abstract: There is provided a lighting fixture 11 capable of efficiently radiating heat of a lamp device 14 attached to a socket device 13. By attaching the lamp device 14 to the socket device 13, a cap portion 38 of the lamp device is brought into contact with a fixture body 12, and pressed against and brought into contact with the fixture body 12 by an elastic body 30. Heat generated by lighting of LEDs 35 of the lamp device 14 is conducted from the cap portion 38 to the fixture body 12 and efficiently radiated.

Abstract: A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.

Abstract: A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.

Abstract: A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.

Abstract: Provided are a cap, a socket device, and a luminaire which reduce the influence of noise. A lamp with the cap includes a lamp main body having engaging means mounted so as to be attachable to and detachable from a socket device; a light emitting-portion; a control device that controls the light-emitting portion; a cap member for a power source situated adjacent to one side with the engaging means interposed therebetween is disposed in a circular track of the lamp main body and connected to the control device; a cap member for signaling situated adjacent to the other side with the engaging means interposed therebetween is disposed in the circular track of the lamp main body and connected to the control device; and a thermal conductor that comes into contact with a thermal radiator when mounted on the socket device.

Abstract: A lamp device 14 includes a light-emitting portion 34 in which a semiconductor light-emitting element is used. The light-emitting portion 34 is arranged on the side of one of surfaces of the housing 16. Provided on the side of the other surface of the housing 16 is a metallic cap portion 44 and a lamp pin 46 projecting from the other surface side of the housing 16. The lighting circuit 21 is stored in the housing 16. Then, the lamp device 14 includes lamp pin mounting portions 73 where the lamp pins are to be mounted and the insulating member 47 having an insulating portion 75 interposed between the inner surface of the cap portion 44 and the lighting circuit 21.

Abstract: A luminaire 1 of an embodiment has a radiator 3 which comes into surface-contact with a cap abutment surface 6C of a lamp unit 6 and conducts and radiates heat generated by the lamp unit 6, and a terminal board 7 which is attached to the upper side of the radiator 3 on the lateral outside of the cap abutment surface 6C.

Abstract: An object of the present invention is to provide an LED bulb in which temperature of a lighting circuit is suppressed from rising during lighting of an LED so that life time of the lighting circuit is maintained without increasing manufacturing cost of components. According to the invention, an LED module 11 having multiple LEDs surface-mounted thereon is mounted in a heat dissipating unit 12. Heat generated by the LEDs is dissipated through multiple heat dissipating fins 18 of the heat dissipating unit 12. A glove 14, covering the LED module 11, radiates outward radiant light from the LEDs. A lighting circuit 17 for lighting the LEDs is incorporated in an inner hollow portion 23 of a cap 16 arranged on a side opposite to the glove 14 of the heat dissipating unit 12. Accordingly, the heat generated by the LEDs of the LED module 11 is mostly dissipated by the heat dissipating unit 12, thereby suppressing the temperature of the lighting circuit from rising.

Abstract: A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.

Abstract: There is provided a lighting fixture capable of efficiently radiating heat of a lamp device attached to a socket device. By attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.

Abstract: A luminaire capable of contacting a lamp device to a luminaire main body is provided.

Abstract: According to one embodiment, the device main body includes a main body portion, a protruding portion, and a heat conducting portion. The main body portion has an opening on one end side and has a wall portion on the other end side that is opposite to the opening side. The protruding portion protrudes from the wall portion and an inside thereof continues into the main body portion. The heat conducting portion has one end side thereof protruding from the wall portion toward the opening and has the other end side thereof connected to the protruding portion in a way that enables heat conduction. The light emitting unit is connected to the one end side of the heat conducting portion in a way that enables heat conduction. The lighting unit is housed inside the device main body and a portion of the lighting circuit component is arranged inside the protruding portion.

Abstract: A lamp includes an outer shell having heat conductivity, a base provided in the outer shell, and a cover provided in the outer shell. The outer shell has a light source support, and a heat radiating surface exposed to the outside of the outer shell. The light source support is formed integral with the heat radiating surface. A light source is supported on the light source support. The light source is heated during lighting, and thermally connected to the light source support. The light source is covered with the cover.

Abstract: A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.

Abstract: An object of the present invention is to provide a light emitting element lamp and a lighting equipment effectively suppressing a temperature rising of a substrate on which a light emitting element is mounted by using a reflector.

Abstract: A light-emitting module includes a module substrate, semiconductor light-emitting elements and a connection substrate. On one face of the module substrate, a conductive layer is formed. The semiconductor light-emitting elements and the connection substrate are mounted on the conductive layer of the module substrate. Electric wires, which extend from a lighting circuit, are connected to the connection substrate. Power is supplied to the semiconductor light-emitting elements through the connection substrate and the conductive layer of the module substrate.