Abstract: A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.

Abstract: A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.

Abstract: A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.

Abstract: A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.

Abstract: According to one embodiment, a lamp device includes a housing including a cap, a light-emitting module arranged in the housing and a lighting circuit. The light-emitting module includes a module board, and a semiconductor light-emitting element mounted on the module board. The lighting circuit includes a circuit board, plural circuit components mounted on the circuit board, and a first thermosensor and a second thermosensor arranged at different positions on the circuit board where a temperature difference occurs at time of lighting. The lighting circuit controls lighting of the semiconductor light-emitting element according to the temperature difference between the first thermosensor and the second thermosensor.

Abstract: According to one or more arrangements, a lighting device such as a lamp may include a substrate on which one or more lighting elements are mounted. One or more aspects of the lamp may further provide heat conductive/dissipating properties. Additionally or alternatively, the substrate may include a through hole through which at least one wire of the lighting device may extend. For example, the wire may extend through the at least one through-hole from a first side of the substrate to a second side of the substrate. The wire may be connected to a pattern layer of the substrate. According to other aspects, the lighting device may further include a supporting body for supporting the substrate. The supporting body may include another through-hole through which the at least one wire further extends.

Abstract: According to one or more arrangements, a lighting device such as a lamp may include a cover a device body. The device body may have a projection having a support surface at one end and an attachment portion to which the cover is configured to attach. In one or more examples, while the cover is configured to attach to the attachment portion, the cover may be configured to cover the supporting surface of the projection. The cover portion may include a translucent cover portion in some configurations. Additionally or alternatively, the supporting surface of the projection portion may be disposed closer to a center of the cover portion than the attachment portion. In one example, the projection portion may be disposed closer to the cover portion center by a distance equal to a height of the projection portion.

Abstract: According to one or more arrangements, a lamp may include a device body having heat conductive properties. The device body may include a light source support and a heat radiating surface forming at least a portion of an exterior surface of the lamp device. In some examples, the light source support may be integrally formed with the heat radiating surface. The light source support may further be thermally connected or fixed to a board in various manners (e.g., screw). The board may include a plurality of light-emitting elements mounted thereon. The lamp may further include a cover. In one example, the cover may be constructed of a translucent material.

Abstract: According to one or more arrangements, a lighting device may include a heat conductive device body or shell. The lighting device may further include a substrate with a thermal diffusion layer and/or a pattern layer supported thereon. For example, the pattern layer and/or the diffusion layer may be stacked on the substrate. In some arrangements, the thermal diffusion layer may be disposed between a supporting surface of the lighting device and the pattern layer. Additionally or alternatively, the pattern layer may be stacked on a first side of the substrate while the thermal diffusion layer is stacked on a second side of the substrate.

Abstract: The present invention provides a light-emitting element lamp 1 capable of preventing a temperature rise of a substrate 9, on which light-emitting elements 4 are mounted, by effectively utilizing a thermally conductive casing 2 and a thermally conductive cover 5. The light emitting element lamp 1 includes a thermally conductive casing 2, a light source part 3, a thermally conductive cover 5, and an insulative cover 6. The thermally conductive casing 2 includes an irradiation opening 2b, is formed so as to be widened toward the irradiation opening 2b, has its outer circumferential surface exposed outwardly, and has a substrate mounting part 2c secured on its inner circumferential surface. The light source part 3 has a substrate 9 having the light-emitting elements 4 mounted thereon and causes the substrate 9 to be thermally coupled to and attached to the substrate mounting part 2c of the thermally conductive casing 2.

Abstract: According to one embodiment, a lamp apparatus includes a light-emitting module, housing, and a lighting circuit. The light-emitting module includes a light-emitting element. The housing opens in the direction of irradiation of a light beam and having a cap on a side opposite from the direction of irradiation of the light beam. The cap is provided with a light-emitting module mounting portion projecting in the direction of irradiation of the light beam and the light-emitting module is mounted on the light-emitting module mounting portion. The lighting circuit is accommodated in the housing.

Abstract: According to one embodiment, a lamp device includes a light-emitting module including a semiconductor light-emitting element, a lighting circuit to light the semiconductor light-emitting element, and a housing to house the light-emitting module and the lighting circuit. The housing includes a case including a holder part to hold the light-emitting module, and a cap member fixed to the case by a fixing unit. The light-emitting module is sandwiched and fixed between the holder part and the cap member.

Abstract: According to one embodiment, a lamp unit includes a light-emitting module, a housing, a lighting circuit, and a heat conductive sheet. The light-emitting module includes a light emitting portion having a semiconductor light-emitting element formed thereon. The housing includes a case opening in the direction of irradiation of light, and a base on a side of the case opposite from the direction of irradiation of the light. The light-emitting module is mounted on a surface of the base on the case side. A base surface is formed on an outer surface of the base on the side opposite from the case side, and a depressed portion is formed on the base surface. The lighting circuit is accommodated in the housing. The heat conductive sheet allows resilient deformation, and is disposed in the depressed portion.

Abstract: According to one embodiment, a lamp unit includes a light-emitting module, a lighting circuit, and a housing. The light-emitting module includes a light emitting portion having a semiconductor light-emitting element. The lighting circuit lights the semiconductor light-emitting element. The housing includes a case opening in the direction of irradiation of light, and a base on a side of the case opposite from the direction of radiation of the light. The lighting circuit is accommodated in the case, and the light-emitting module is mounted on the base at a position closer to the base with respect to the position of the lighting circuit.

Abstract: There is provided a lighting fixture capable of efficiently radiating heat of a lamp device attached to a socket device. By attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with. a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.