Patents by Inventor Shigeru Tago
Shigeru Tago has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150015345Abstract: A dielectric element assembly includes a plurality of dielectric layers stacked on each other in a direction of lamination and extends in an x-axis direction. A signal line is provided in the dielectric element assembly and extends in the x-axis direction. A reference ground conductor is provided on a positive side in a z-axis direction relative to the signal line. An auxiliary ground conductor is provided on a negative side in the z-axis direction relative to the signal line. Via-hole conductors connect the reference ground conductor and the auxiliary ground conductor and are provided in the dielectric element assembly on the negative side relative to the center in a y-axis direction. A portion of the signal line in a section which includes the via-hole conductors is positioned on the positive side in the y-axis direction relative to another portion of the signal line in a section which does not include the via-hole conductors.Type: ApplicationFiled: October 1, 2014Publication date: January 15, 2015Inventors: Satoshi SASAKI, Nobuo IKEMOTO, Shigeru TAGO
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Publication number: 20140233190Abstract: An electronic module includes a substrate, a built-in electronic component and a surface mount electronic component. A suckable region is provided on a front surface of the substrate. When viewed in a see-through manner in a direction perpendicular or substantially perpendicular to the front surface of the substrate, the suckable region is inside of a region in which one built-in electronic component is built in and a center of gravity of the electronic module is located inside of the suckable region. A protective layer is not provided on the front surface of the substrate on which the surface mount electronic component is mounted.Type: ApplicationFiled: February 21, 2013Publication date: August 21, 2014Applicant: MURATA MANUFACTURING CO., LTD.Inventor: Shigeru TAGO
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Publication number: 20140203454Abstract: A semiconductor device includes an analog integrated circuit and a digital integrated circuit provided on a major surface of a substrate. An analog ground terminal is provided for the analog integrated circuit, and digital ground terminals are provided for the digital integrated circuit. An analog ground layer is stacked on the substrate so as to face the analog integrated circuit, and digital ground layers are stacked on the substrate so as to face the digital integrated circuit. The analog ground terminal is connected to the analog ground layer, and the digital ground terminals are connected to the digital ground layers, respectively.Type: ApplicationFiled: March 25, 2014Publication date: July 24, 2014Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Shigeru TAGO, Noboru KATO
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Publication number: 20140184362Abstract: A high-frequency signal line includes an element assembly including a plurality of flexible insulator layers. a linear signal line provided in or on the element assembly, a first ground conductor provided in or on the element assembly and extending along the signal line, a plurality of second ground conductors provided in or on the element assembly and arranged at predetermined intervals in a direction in which the signal line extends, on a first side in a direction of lamination relative to the signal line, the second ground conductors being opposite to the signal line with at least one of the insulator layers positioned therebetween, and a plurality of first via-hole conductors extending through at least one of the insulator layers so as to connect the first and second ground conductors.Type: ApplicationFiled: March 4, 2014Publication date: July 3, 2014Applicant: Murata Manufacturing Co., Ltd.Inventors: Shigeru TAGO, Noboru KATO
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Publication number: 20140176264Abstract: A high-frequency signal line includes a dielectric element body including regions and a plurality of flexible dielectric sheets. A signal conductive layer is provided in or on the dielectric element body. Ground conductive layers are provided in or on the dielectric element body and face the signal conductive layer. A distance between the ground conductive layer and the signal conductive layer in the region is smaller than a distance between the ground conductive layer and the signal conductive layer in the regions. The dielectric element body is bent in the region.Type: ApplicationFiled: February 27, 2014Publication date: June 26, 2014Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Shigeru TAGO, Satoshi SASAKI, Noboru KATO
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Publication number: 20140176254Abstract: A high-frequency signal transmission line includes a dielectric body including a plurality of dielectric sheets. A signal line is provided in the dielectric body. A connector is mounted on a first main surface of the dielectric body and electrically connected to the signal line. A ground conductor is provided on a second main surface side of the dielectric body, compared with the signal line, and faces the signal line across the dielectric sheet. In the ground conductor, conductor-missing portions are provided in which no conductors are provided in at least portions of regions overlapping with the signal line in planar in connection portions. Adjustment conductors are provided in the second main surface of the dielectric body, and overlap with at least portions of the conductor-missing portions in the planar view.Type: ApplicationFiled: February 27, 2014Publication date: June 26, 2014Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Kanto IIDA, Shigeru TAGO
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Publication number: 20140176266Abstract: A high-frequency signal line includes an element assembly including a plurality of flexible insulator layers, a linear signal line provided in or on the element assembly, a first ground conductor arranged in or on the element assembly so as to be opposed to the signal line not in a first section including a portion of the signal line but in a second section adjacent to the first section, and a second ground conductor provided along the signal line in the first section on the insulator layer on which the signal line is provided. The second ground conductor is not opposed at least in part to the first ground conductor in the first section.Type: ApplicationFiled: February 28, 2014Publication date: June 26, 2014Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Noboru KATO, Shigeru TAGO
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Publication number: 20140125426Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.Type: ApplicationFiled: January 10, 2014Publication date: May 8, 2014Applicant: Murata Manufacturing Co., Ltd.Inventors: Noboru KATO, Shigeru TAGO, Jun SASAKI, Junichi KURITA, Satoshi SASAKI
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Publication number: 20140125434Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.Type: ApplicationFiled: January 10, 2014Publication date: May 8, 2014Applicant: Murata Manufacturing Co., Ltd.Inventors: Noboru KATO, Shigeru TAGO, Jun SASAKI, Junichi KURITA, Satoshi SASAKI
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Publication number: 20140097916Abstract: Unwanted radiation is reduced in a high-frequency signal transmission line that includes a ground conductor provided with an opening that overlaps a signal line. A dielectric element assembly has a relative dielectric constant ?1 and has a first principal surface and a second principal surface. A signal line is provided in the dielectric element assembly. A ground conductor is provided in the dielectric element assembly and on the first principal surface side with respect to the signal line, faces the signal line, and is provided with an opening that overlaps the signal line. A high dielectric constant layer has a relative dielectric constant ?2 higher than the relative dielectric constant ?1 and is provided on the first principal surface so as to overlap the opening.Type: ApplicationFiled: December 12, 2013Publication date: April 10, 2014Applicant: Murata Manufacturing Co., Ltd.Inventors: Noboru KATO, Shigeru TAGO, Jun SASAKI, Satoshi SASAKI
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Patent number: 8659370Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.Type: GrantFiled: July 19, 2013Date of Patent: February 25, 2014Assignee: Murata Manufacturing Co., Ltd.Inventors: Noboru Kato, Shigeru Tago, Jun Sasaki, Junichi Kurita, Satoshi Sasaki
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Patent number: 8653910Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.Type: GrantFiled: July 19, 2013Date of Patent: February 18, 2014Assignee: Murata Manufacturing Co., Ltd.Inventors: Noboru Kato, Shigeru Tago, Jun Sasaki, Junichi Kurita, Satoshi Sasaki
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Patent number: 8624692Abstract: Unwanted radiation is reduced in a high-frequency signal transmission line that includes a ground conductor provided with an opening that overlaps a signal line. A dielectric element assembly has a relative dielectric constant ?1 and has a first principal surface and a second principal surface. A signal line is provided in the dielectric element assembly. A ground conductor is provided in the dielectric element assembly and on the first principal surface side with respect to the signal line, faces the signal line, and is provided with an opening that overlaps the signal line. A high dielectric constant layer has a relative dielectric constant ?2 higher than the relative dielectric constant ?1 and is provided on the first principal surface so as to overlap the opening.Type: GrantFiled: January 11, 2013Date of Patent: January 7, 2014Assignee: Murata Manufacturing Co., Ltd.Inventors: Noboru Kato, Shigeru Tago, Jun Sasaki, Satoshi Sasaki
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Publication number: 20130300516Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.Type: ApplicationFiled: July 19, 2013Publication date: November 14, 2013Inventors: Noboru KATO, Shigeru TAGO, Jun SASAKI, Junichi KURITA, Satoshi SASAKI
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Publication number: 20130300515Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.Type: ApplicationFiled: July 19, 2013Publication date: November 14, 2013Inventors: Noboru KATO, Shigeru TAGO, Jun SASAKI, Junichi KURITA, Satoshi SASAKI
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Patent number: 8525613Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.Type: GrantFiled: February 1, 2013Date of Patent: September 3, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Noboru Kato, Shigeru Tago, Jun Sasaki, Junishi Kurita, Satoshi Sasaki
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Patent number: 7421424Abstract: The invention provides information concerning records that cannot be retrieved on a search path among databases when the retrieval of search keys for other related databases and records is carried out in a plurality of databases in a chain-reactive manner. In the course of retrieving search keys and records in a chain-reactive manner up to a terminal database, information for identifying a group of search keys and a group of records retrieved through a series of retrieval processing is outputted in one line or one column of a table. When the record retrieved from a certain database in the chain-reactive search procedure does not contain a search key to be entered into a subsequent database, information for identifying a record that does not contain the search key and information for identifying a database having the record is outputted.Type: GrantFiled: February 9, 2004Date of Patent: September 2, 2008Assignee: Hitachi Software Engineering Co., Ltd.Inventors: Shigeru Tago, Junji Yoshii, Tadashi Mizunuma, Katsunori Masaki
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Patent number: 7191173Abstract: A plurality of database search path candidates are automatically determined and provided. Databases containing information with similar characteristics are divided into groups (hereafter referred to as a “category group”), and a correlation diagram is created based on links between those category groups. In the diagram, high priority is given to links between category groups constituting a path that has to be passed through due to relevance between the characteristic of databases, and normal priority is given to other links. When a path search is carried out in this diagram, an important path is selected regardless of attributes such as distance between databases or time by carrying out a first path search along the high priority path between category groups.Type: GrantFiled: March 22, 2004Date of Patent: March 13, 2007Assignee: Hitachi Software Engineering Co., Ltd.Inventors: Tadashi Mizunuma, Shigeru Tago, Junji Yoshii
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Publication number: 20040193590Abstract: A plurality of database search path candidates are automatically determined and provided. Databases containing information with similar characteristics are divided into groups (hereafter referred to as a “category group”), and a correlation diagram is created based on links between those category groups. In the diagram, high priority is given to links between category groups constituting a path that has to be passed through due to relevance between the characteristic of databases, and normal priority is given to other links. When a path search is carried out in this diagram, an important path is selected regardless of attributes such as distance between databases or time by carrying out a first path search along the high priority path between category groups.Type: ApplicationFiled: March 22, 2004Publication date: September 30, 2004Applicant: Hitachi Software Engineering Co., Ltd.Inventors: Tadashi Mizunuma, Shigeru Tago, Junji Yoshii
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Publication number: 20040193585Abstract: A search path can be easily designated between a plurality of databases for retrieving search keys and records from related databases in a chain-reactive manner. Databases that are potential search targets are displayed on a two-dimensional screen in the form of figures. Individual figures are designated using a pointing device and then key database A and terminal database D are designated out of databases A to F corresponding to the designated figures. Search keys and records are retrieved in a chain-reactive manner by following designated one or more of possible paths 302a and 302b that pass through the databases that exist between key database A and terminal database D designated on the screen.Type: ApplicationFiled: January 20, 2004Publication date: September 30, 2004Applicant: Hitachi. Software Engineering Co., Ltd.Inventor: Shigeru Tago