Abstract: To solve the problem, when the inside of an exposure apparatus is placed under vacuum, of a gas being emitted from a resin tube provided in the exposure apparatus, and a component of the gas adhering to and being deposited on the surface of an optical element, so that the optical performances of the optical element and the exposure apparatus are deteriorated, the exposure apparatus is provided with means for controlling the surface temperature of the resin tube in the exposure apparatus up to a predetermined temperature.

Abstract: An exposure apparatus for exposing a substrate to exposure light via a pattern of a mask. The apparatus includes a stage configured to hold one of the substrate and the mask, and to move, a projection optical system configured to project the pattern onto the substrate, a defining member facing the stage and configured to define a space, between the stage and the projection optical system, through which the exposure light passes and which is to be filled with fluid, a first stream mechanism having a first supply port in the defining member and configured to stream the fluid through the space from the first supply port, an exhaust mechanism having an exhaust port in the defining member and configured to exhaust fluid in the space from the exhaust port, and a second stream mechanism having a second supply port different from the first supply port.

Abstract: An exposure apparatus which projects and transfers a pattern formed on a mask to a substrate using exposure light includes a stage, an optical system, and a gas stream forming mechanism which forms a stream of inert gas in an optical path space including a space which is located between the stage and the optical system and through which the exposure light passes. In addition, a member forms a predetermined space between the optical path space and a peripheral space outside the optical path space in the exposure apparatus, and a gas supply mechanism supplies the inert gas into the predetermined space.

Abstract: An exposure apparatus for exposing an object put on a first stage by irradiating light from a light source onto the object through an exposure optical system includes a partition for isolating a first space where the first stage is arranged and isolating a second space where the exposure optical system is arranged, a first management part that manages a degree of vacuum of the first space, and a second management part that manages a degree of vacuum of the second space.

Abstract: An exposure apparatus includes an optical system for guiding light from a light source to an object, a holding member for holding the object, and a measuring device for measuring position of the holding member by using a reference surface provided in the holding member, wherein the reference surface is located in an area corresponding to the object which is held by the holding member.

Abstract: A processing apparatus includes a sealed vacuum chamber which contains a processing portion; a pressure controlling system which keeps the internal pressure of the sealed vacuum chamber constant at a predetermined level by exhausting the ambient gas in the sealed vacuum chamber; and an ambient gas recirculating system which recirculates the ambient gas exhausted from the sealed vacuum chamber back into the sealed vacuum chamber; wherein the ambient as recirculated by the ambient gas recirculating system is blown into the sealed vacuum chamber so that a gas flow is generated in a predetermined direction along the processing portion.

Abstract: A processing apparatus includes a sealed vacuum chamber which contains a processing portion; a pressure controlling system which keeps the internal pressure of the sealed vacuum chamber constant at a predetermined level by exhausting the ambient gas in the sealed vacuum chamber; and an ambient gas recirculating system which recirculates the ambient gas exhausted from the sealed vacuum chamber back into the sealed vacuum chamber; wherein the ambient as recirculated by the ambient gas recirculating system is blown into the sealed vacuum chamber so that a gas flow is generated in a predetermined direction along the processing portion.

Abstract: An exposure apparatus which projects a pattern formed on a mask onto a substrate by using exposure light. The apparatus includes a shielding member which surrounds a light path space through which exposure light passes and has a passage which makes the light path space communicate with an ambient space, and a gas supply system which supplies inert gas to the light path space surrounded by the shielding member. A direction of the passage coincides with a flow direction of an ambient atmosphere which flows through the ambient space, and the passage includes a first passage and a second passage. The first passage is located at a position upstream, with respect to the flow direction, relative to the second passage, and the first passage is smaller in section than the second passage.

Abstract: An exposure apparatus which projects and transfers a pattern formed on a mask to a substrate using exposure light includes a stage, an optical system, and a gas stream forming mechanism which forms a stream of inert gas in an optical path space including a space which is located between the stage and the optical system and through which the exposure light passes. In addition, a member forms a predetermined space between the optical path space and a peripheral space outside the optical path space in the exposure apparatus, and a gas supply mechanism supplies the inert gas into the predetermined space.

Abstract: An exposure apparatus which projects and transfers a pattern formed on a mask to a substrate using exposure light includes a stage, an optical system, and a gas stream forming mechanism which forms a stream of inert gas in an optical path space including a space which is located between the stage and the optical system and through which the exposure light passes. In addition, a member forms a predetermined space between the optical path space and a peripheral space outside the optical path space in the exposure apparatus, and a gas supply mechanism supplies the inert gas into the predetermined space.

Abstract: An exposure apparatus for exposing an object put on a first stage by irradiating light from a light source onto the object through an exposure optical system includes a partition for isolating a first space where the first stage is arranged and isolating a second space where the exposure optical system is arranged, a first management part that manages a degree of vacuum of the first space, and a second management part that manages a degree of vacuum of the second space.

Abstract: A load-lock chamber has a substrate transfer path between a first gas atmosphere and a second gas atmosphere. The load-lock chamber includes a first gate valve through which a substrate is transferred between the first gas atmosphere and the load-lock chamber, a second gate valve through which a substrate is transferred between the second gas atmosphere and the load-lock chamber and a gas supply mechanism which supplies the first gas and the second gas to the load-lock chamber. The gas supply mechanism is arranged to supply the second gas to the load-lock chamber when the first gate valve is closed and the second gate valve is opened during the substrate being transferred between the second atmosphere and the load-lock chamber.

Abstract: An exposure apparatus includes an optical system for guiding light from a light source to an object, a holding member for holding the object, and a measuring device for measuring position of the holding member by using a reference surface provided in the holding member, wherein the reference surface is located in an area corresponding to the object which is held by the holding member.

Abstract: To solve the problem, when the inside of an exposure apparatus is placed under vacuum, of a gas being emitted from a resin tube provided in the exposure apparatus, and a component of the gas adhering to and being deposited on the surface of an optical element, so that the optical performances of the optical element and the exposure apparatus are deteriorated, the exposure apparatus is provided with means for controlling the surface temperature of the resin tube in the exposure apparatus up to a predetermined temperature.

Abstract: A substrate processing system has a first processing device which processes a substrate with a first process in a first gas atmosphere within a process chamber and a transfer device that transfers a substrate in a second gas atmosphere within a clean booth, the transfer device transferring a substrate which has been processed with a second process by a second processing device or a substrate which is to be processed by that second processing device. A load-lock chamber has a substrate transfer path between the first processing device and the transfer device and there is a gas supply device which supplies the first gas from the process chamber to the load-lock chamber when the substrate is transferred between the load-lock chamber and a first processing device, and supplies the second gas from the clean booth to the load-lock chamber when the substrate is transferred between the load-lock chamber and the transfer device.

Abstract: This invention shortens a time required to purge, with inert gas, gas in a space (optical path space) through which exposure light passes, such as a space between a projection optical system and a substrate. The exposure apparatus includes a wafer stage (102), a projection optical system (101), and an air supply portion (112) which supplies inert gas at a nonuniform flow velocity to an optical path space (113) through which exposure light passes between the wafer stage (102) and the projection optical system (101). A downward flow of inert gas is formed.

Abstract: An exposure apparatus includes an illumination optical system which illuminates a pattern formed on a mask with light from a light source, a movable mask stage for holding the mask, a projection optical system which guides light from a pattern of the mask to a wafer, a movable wafer stage for holding the wafer, a shielding member which forms an optical path space including an optical path of exposure light and a space surrounding the optical path space at, of a space through which the exposure light passes, at least one portion between the illumination optical system and the mask stage, between the mask stage and the projection optical system, or between the protection optical system and the wafer stage, a first gas supply device for supplying an inert gas to the optical path space, a chamber surrounding the wafer stage, the projection optical system and the shielding member, and a reduction device for reducing a change in total light quantity of the exposure light reaching the wafer that is caused by movemen

Abstract: A processing apparatus includes a sealed vacuum chamber which contains a processing portion; a pressure controlling system which keeps the internal pressure of the sealed vacuum chamber constant at a predetermined level by exhausting the ambient gas in the sealed vacuum chamber; and an ambient gas recirculating system which recirculates the ambient gas exhausted from the sealed vacuum chamber back into the sealed vacuum chamber; wherein the ambient as recirculated by the ambient gas recirculating system is blown into the sealed vacuum chamber so that a gas flow is generated in a predetermined direction along the processing portion.

Abstract: An exposure apparatus which projects and transfers a pattern formed on a mask to a substrate using exposure light includes a stage, an optical system, a gas stream forming mechanism which forms a stream of an inert gas in an optical path space including a space which is located between the stage and the optical system and through which the exposure light passes, a member which forms a predetermined space between the optical path space and a peripheral space outside the optical path space in the exposure apparatus, and a gas supply mechanism which supplies the inert gas into the predetermined space.

Abstract: A processing apparatus includes a sealed vacuum chamber which contains a processing portion; a pressure controlling system which keeps the internal pressure of the sealed vacuum chamber constant at a predetermined level by exhausting the ambient gas in the sealed vacuum chamber; and an ambient gas recirculating system which recirculates the ambient gas exhausted from the sealed vacuum chamber back into the sealed vacuum chamber; wherein the ambient gas recirculated by the ambient gas recirculating system is blown into the sealed vacuum chamber so that a gas flow is generated in a predetermined direction along the processing portion.