Patents by Inventor Shigetoshi Ipposhi

Shigetoshi Ipposhi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11448471
    Abstract: A heat storage unit includes: a heat storage material that contains water and high polymers that exhibit hydrophilicity or hydrophobicity depending on a temperature; a heat exchanger that causes heat exchange to be performed between a heating fluid and the heat storage material to heat the heat storage material and store heat in the heat storage material, and causes heat exchange to be performed between a heat utilization fluid and the heat storage material to receive heat from the heat storage material and cause heat to be transferred from the heat storage material; and a container that is filled with the heat storage material and houses the heat exchanger.
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: September 20, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yasumitsu Nomura, Shigetoshi Ipposhi, Shunkei Suzuki, Junichi Nakazono, Hideharu Nobutoki
  • Patent number: 11348850
    Abstract: A vehicle power conversion device includes: a housing configured to accommodate an electronic component therein and having an opening; and a cooling device. The cooling device includes a base being a plate-shaped member and heat sinks attached to the base. The base has a groove with refrigerant enclosed. The base has a first main surface to which the electronic component is to be attached, and covers the opening by the first main surface facing an interior of the housing. The heat sinks are joined, at intervals, onto the second main surface of the base.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: May 31, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hirokazu Takabayashi, Ryosuke Nakagawa, Shigetoshi Ipposhi, Masaru Shinozaki, Hiroyuki Ushifusa
  • Publication number: 20210215433
    Abstract: A cooling device includes (i) a heat receiving block that is a plate-like member to which an exothermic element is attached, and (ii) a cooling member that radiates, to surrounding cooling air, heat transmitted from the exothermic element via the heat receiving block. The cooling device includes (i) at least one header that extends in a Y-axis direction that is a direction in which the cooling air flows, the header being attached to a second main surface, and (ii) branch pipes that are attached to each of the at least one header, the branch pipes extending in a direction away from the second main surface. The branch pipes communicate with the header. A shape of each of the branch pipes in a Y-Z plane is a flat shape, and a longitudinal direction of the flat shape is parallel to the Y-axis direction.
    Type: Application
    Filed: May 30, 2018
    Publication date: July 15, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hirokazu TAKABAYASHI, Hiroyuki USHIFUSA, Shigetoshi IPPOSHI
  • Patent number: 11015820
    Abstract: An outdoor unit comprises a casing, a fan, a heat exchanger, an electrical component, a heat radiation member, and a duct. The casing is provided with an air outlet. The fan is disposed inside the casing and configured to blow air to the outside of the casing via the air outlet. The heat exchanger is disposed inside the casing at a position lower than the fan. The electrical component is disposed inside the casing at a position lower than the heat exchanger. The heat radiation member is connected to the electrical component inside the casing. The duct is configured to accommodate at least part of the heat radiation member inside the casing and extend in the vertical direction. An upper end of the duct is configured to protrude upward higher than a lower end of the heat exchanger.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: May 25, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Masaki Muramatsu, Keiji Harada, Shinji Murata, Shinsaku Kusube, Osamu Morimoto, Shigetoshi Ipposhi
  • Publication number: 20210108861
    Abstract: A heat storage unit includes: a heat storage material that contains water and high polymers that exhibit hydrophilicity or hydrophobicity depending on a temperature; a heat exchanger that causes heat exchange to be performed between a heating fluid and the heat storage material to heat the heat storage material and store heat in the heat storage material, and causes heat exchange to be performed between a heat utilization fluid and the heat storage material to receive heat from the heat storage material and cause heat to be transferred from the heat storage material; and a container that is filled with the heat storage material and houses the heat exchanger.
    Type: Application
    Filed: June 18, 2019
    Publication date: April 15, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yasumitsu NOMURA, Shigetoshi IPPOSHI, Shunkei SUZUKI, Junichi NAKAZONO, Hideharu NOBUTOKI
  • Publication number: 20210105912
    Abstract: A cooling device includes a base that is a plate-shaped member, heat pipes attached to the base, and a fin attached to the heat pipes. A groove, in which refrigerant is enclosed, is formed in the base. The heat pipes are attached to the base and an internal hollow of each of the heat pipes communicates with the groove. A portion of the groove or both the portion of the groove and a portion of the hollow communicating with the groove are filled with the refrigerant in a liquid state.
    Type: Application
    Filed: March 31, 2017
    Publication date: April 8, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hirokazu TAKABAYASHI, Ryosuke NAKAGAWA, Shigetoshi IPPOSHI, Masaru SHINOZAKI, Hiroyuki USHIFUSA
  • Publication number: 20210055007
    Abstract: Provided is a cooling structure, including: a heat sink to be mounted to a heat generator; and a duct, which is mounted to the heat sink, and is configured to guide an air flow flowing around the heat sink to the heat sink, wherein the heat sink has an air flow passage configured to allow the air flow to pass through the air flow passage, wherein one end side of the duct is to be mounted to an upstream side of the air flow passage, and wherein another end side of the duct is to be extended from an upstream end portion of the air flow passage to an upstream side of the air flow. With this, the flow rate of the air flow passing through the air flow passage of the heat sink can be increased, and the cooling efficiency of the heat sink can be improved.
    Type: Application
    Filed: March 19, 2018
    Publication date: February 25, 2021
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yoshikazu YAJI, Shigetoshi IPPOSHI, Naoki SUETOMI, Ryuji MOMOSE, Keisuke IWASAWA, Kentaro YONEHARA, Hayato KURINO
  • Patent number: 10890355
    Abstract: A heat pump apparatus includes a use-side heat exchanger that causes heat exchange to be performed between a heat medium flowing from a heat-storage heat exchanger and a heat usage medium, and a flow-passage switching device that switches a flow passage for the heat medium to a first flow passage that circulates through a heat-reception-side heat exchanger and the heat-storage heat exchanger without extends through the use-side heat exchanger or a second flow passage that circulates through the heat-reception-side heat exchanger and the heat-storage heat exchanger via the use-side heat exchanger. Even when the temperature of the heat storage medium rises, heat received from a heat source can be stored in the heat storage medium by a heat pump, while a decrease of the efficiency of the heat pump can be reduced.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: January 12, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yasumitsu Nomura, Shigetoshi Ipposhi
  • Publication number: 20200381317
    Abstract: A vehicle power conversion device includes: a housing configured to accommodate an electronic component therein and having an opening; and a cooling device. The cooling device includes a base being a plate-shaped member and heat sinks attached to the base. The base has a groove with refrigerant enclosed. The base has a first main surface to which the electronic component is to be attached, and covers the opening by the first main surface facing an interior of the housing. The heat sinks are joined, at intervals, onto the second main surface of the base.
    Type: Application
    Filed: March 27, 2017
    Publication date: December 3, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hirokazu TAKABAYASHI, Ryosuke NAKAGAWA, Shigetoshi IPPOSHI, Masaru SHINOZAKI, Hiroyuki USHIFUSA
  • Patent number: 10816273
    Abstract: A boiling cooling device and a boiling cooling system which can promote boiling and restrain the cooling capacity of the device from deteriorating. A boiling cooling device includes: a pump to circulate refrigerant; a microbubble generator to produce microbubbles and incorporate the microbubbles into the refrigerant discharged from the pump; a boiling cooler to which the refrigerant containing the microbubbles is supplied and which boils the refrigerant; a radiator to cool the refrigerant after the refrigerant is boiled and before the refrigerant is taken in by the pump 11; and a gas-liquid separator 15 to separate gas from the circulating refrigerant after the refrigerant is boiled and before the refrigerant is taken in by the pump.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: October 27, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shigetoshi Ipposhi, Masaru Shinozaki, Yugo Asai
  • Patent number: 10729040
    Abstract: A cooler configured to cool an electronic device includes: a refrigerant inlet portion configured to guide refrigerant from an outside of a casing to an inside of the casing; a refrigerant outlet portion configured to guide the refrigerant from the inside of the casing to the outside of the casing; and a metal member located inside the casing and configured to define a flow path region in which the refrigerant is caused to flow from the refrigerant inlet portion to the refrigerant outlet portion. The metal member includes: a plurality of opening portions configured to cause the refrigerant to pass therethrough; and a capture and reduction portion having such a shape as to capture air bubbles, which are generated through a connection surface between the casing and the electronic device. The air bubbles are reduced through cooling by the refrigerant when the electronic device is cooled.
    Type: Grant
    Filed: April 22, 2016
    Date of Patent: July 28, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yugo Asai, Shigetoshi Ipposhi, Masaru Shinozaki, Hiroyuki Higashino, Kazuki Sakata, Masakazu Tani
  • Patent number: 10584895
    Abstract: A heat utilizing apparatus includes a heat pump including a first heat exchanger and a second heat exchanger, a first heat storage unit storing heat exchanged in the first heat exchanger, a second heat storage unit storing heat exchanged in the second heat exchanger, a third heat exchanger exchanging heat with the first heat storage unit, a fourth heat exchanger exchanging heat with the second heat storage unit 8, a measurement unit measuring a heat storage amount of the first heat storage unit, a heat rejection unit reducing the heat storage amount of the first heat storage unit, a determination unit determining, in accordance with a measurement result of the measurement unit, whether to reduce the heat storage amount of the first heat storage unit and a heat storage amount of the second heat storage unit, and a control unit adjusting the amount of heat to be reduced through the heat rejection unit in accordance with a determination result of the determination unit.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: March 10, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shigetoshi Ipposhi, Yoshikazu Yaji, Shunkei Suzuki, Toshio Shinoki
  • Publication number: 20200049424
    Abstract: A regenerative heat exchange apparatus includes a heat storage tank, a heat storage material disposed inside the heat storage tank and having a heat storage capability and a heat rejection capability, a liquid passage covered by the heat storage material inside the heat storage tank, the liquid passage having a first straight pipe portion through which a liquid flows horizontally, a heat medium passage covered by the heat storage material inside the heat storage tank, the heat medium passage being adjacent to and in a set with the liquid passage, the heat medium passage having a second straight pipe portion through which a heat medium flows horizontally, the heat medium being at a temperature higher than the liquid. The first straight pipe portion is located vertically lower than the second straight pipe portion.
    Type: Application
    Filed: March 30, 2017
    Publication date: February 13, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Shunkei SUZUKI, Shigetoshi IPPOSHI, Yoshikazu YAJI, Yasumitsu NOMURA, Junichi NAKAZONO, Shinya TOKIZAKI
  • Publication number: 20200041218
    Abstract: A plate heat exchanger causes heat exchange to be performed using a plurality of heat transfer plates stacked. Each of the heat transfer plates includes a plate body, a first-medium inlet, a first-medium outlet, a second-medium inlet, a second-medium outlet, and a projection that provides a passage. At least one of the first-medium inlet and the first-medium outlet is located at one of two corners at one end of the plate body which the projection contacts. At least one of the second-medium inlet and the second-medium outlet is located at one of two corners at the other end of the plate body from which the projection is separated.
    Type: Application
    Filed: December 13, 2017
    Publication date: February 6, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Junichi NAKAZONO, Shigetoshi IPPOSHI, Masaru SHINOZAKI, Yugo ASAI, Yusuke KIMOTO, Yoshihiro MIYAMA, Yuichi USUDA, Yoshitaka EIJIMA, Seiji MARUYAMA
  • Publication number: 20200018554
    Abstract: A boiling cooling device and a boiling cooling system which can promote boiling and restrain the cooling capacity of the device from deteriorating. A boiling cooling device includes: a pump to circulate refrigerant; a microbubble generator to produce microbubbles and incorporate the microbubbles into the refrigerant discharged from the pump; a boiling cooler to which the refrigerant containing the microbubbles is supplied and which boils the refrigerant; a radiator to cool the refrigerant after the refrigerant is boiled and before the refrigerant is taken in by the pump 11; and a gas-liquid separator 15 to separate gas from the circulating refrigerant after the refrigerant is boiled and before the refrigerant is taken in by the pump.
    Type: Application
    Filed: January 8, 2016
    Publication date: January 16, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Shigetoshi IPPOSHI, Masaru SHINOZAKI, Yugo ASAI
  • Publication number: 20200011569
    Abstract: A heat pump apparatus includes a use-side heat exchanger that cause heat exchange to be performed between a heat medium flowing from a heat-storage heat exchanger and a heat usage medium, and a flow-passage switching device that switches a flow passage for the heat medium to a first flow passage that circulates through a heat-reception-side heat exchanger and the heat-storage heat exchanger without extends through the use-side heat exchanger or a second flow passage that circulates through the heat-reception-side heat exchanger and the heat-storage heat exchanger via the use-side heat exchanger. Even when the temperature of the heat storage medium rises, heat received from a heat source can be stored in the heat storage medium by a heat pump, while a decrease of the efficiency of the heat pump can be reduced.
    Type: Application
    Filed: November 22, 2017
    Publication date: January 9, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yasumitsu NOMURA, Shigetoshi IPPOSHI
  • Publication number: 20190360705
    Abstract: An outdoor unit comprises a casing, a fan, a heat exchanger, an electrical component, a heat radiation member, and a duct. The casing is provided with an air outlet. The fan is disposed inside the casing and configured to blow air to the outside of the casing via the air outlet. The heat exchanger is disposed inside the casing at a position lower than the fan. The electrical component is disposed inside the casing at a position lower than the heat exchanger. The heat radiation member is connected to the electrical component inside the casing. The duct is configured to accommodate at least part of the heat radiation member inside the casing and extend in the vertical direction. An upper end of the duct is configured to protrude upward higher than a lower end of the heat exchanger.
    Type: Application
    Filed: December 4, 2017
    Publication date: November 28, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Masaki MURAMATSU, Keiji HARADA, Shinji MURATA, Shinsaku KUSUBE, Osamu MORIMOTO, Shigetoshi IPPOSHI
  • Patent number: 10383262
    Abstract: The power conversion device of the invention includes: a cooling unit that is a prism, the interior of which is hollow, and that has a refrigerant inlet portion and a refrigerant outlet portion the cooling unit having in the interior thereof a refrigerant channel through which a refrigerant flows from the refrigerant inlet portion towards the refrigerant outlet portion; electronic devices that are respectively disposed on three or more surfaces on the outside of side surfaces of the cooling unit, excluding a refrigerant inlet surface, in which the refrigerant inlet portion is disposed, and a refrigerant outlet surface, in which the refrigerant outlet portion is disposed, the electronic devices being cooled by boiling of the refrigerant; and a hollow outer case 4 that covers the electronic devices.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: August 13, 2019
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Masaru Shinozaki, Shigetoshi Ipposhi, Hiroyuki Higashino, Yugo Asai, Hiroyuki Yano, Haruyuki Matsuo
  • Patent number: 10361603
    Abstract: In a mechanically and electrically integrated driving apparatus, a common coolant flow channel for cooling a motor unit and an inverter unit is disposed inside a wall portion of a frame unit. Power modules are placed in close contact with an inner wall surface of the frame unit. A bracket that is separate from the frame unit is fitted into the frame unit. A space inside the frame unit is divided by the bracket into: a space in which the motor unit is housed; and a space in which the inverter unit is housed.
    Type: Grant
    Filed: October 20, 2014
    Date of Patent: July 23, 2019
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Junichi Aizawa, Yoshihiro Miyama, Akihiro Daikoku, Norihiro Watanabe, Hideaki Arita, Shota Hanioka, Shigetoshi Ipposhi
  • Patent number: 10271458
    Abstract: Provided is a cooling device, a power conversion device, and a cooling system in which bubbles produced by boiling in the cooling device are inhibited from flowing out of the cooling device, and thus, vibration, noise, and damage to pipes and other components can be prevented. A cooling device according to the present invention includes a housing having a hollow interior, the housing having a refrigerant inlet from which refrigerant flows in and a refrigerant outlet from which the refrigerant flows out, and having, in the hollow interior, a refrigerant flow path through which the refrigerant flows, and an opening body provided in the housing, dividing the refrigerant flow path into a first area including a heating surface being at least one of a bottom surface and side surfaces of the housing and heating the refrigerant, and a second area including the refrigerant outlet, and having a plurality of openings.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: April 23, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yugo Asai, Shigetoshi Ipposhi, Masaru Shinozaki, Hiroyuki Higashino, Kazuki Sakata, Masakazu Tani