Abstract: A solar cell module includes a plurality of solar cells 1 connected to each other in a way that bus bar electrode 21 formed on surfaces of adjacent solar cells 1 are connected to each other with wiring members 41,42. The bus bar electrode 21 is embedded in the wiring member 41, and the solar cell 1 and the wiring member 41 are bonded together with a resin.

Abstract: In a solar cell module, a plurality of solar cells are provided between a front surface protection member and a back surface protection member and bus bar electrodes 20 of the plurality of solar cells are electrically connected to each other by wiring members. The solar cell module includes an adhesive layer made of a resin 60 containing a plurality of conductive particles 70, the adhesive layer provided between each of the bus bar electrodes 20 and the wiring member 40. Each of the bus bar electrodes 20 and the corresponding wiring member 40 are electrically connected by the plurality of conductive particles 70. The resin 60 covers side surface of each of the bus bar electrodes 20 and configured to bond the wiring member 40 with the surface of a photoelectric conversion body 10.

Abstract: A solar battery module is provided with a plurality of solar battery cells which are connected to each other by connecting bus bar electrodes (21) formed on the surfaces of the adjacent solar battery cells with wiring material (41a, 41b). The bus bar electrode (21) is embedded in the wiring material (41b), and the solar battery cell (1) and the wiring material (41b) are bonded with a resin.

Abstract: A solar cell module includes a plurality of solar cells 1 connected to each other in a way that bus bar electrode 21 formed on surfaces of adjacent solar cells 1 are connected to each other with wiring members 41,42. The bus bar electrode 21 is embedded in the wiring member 41, and the solar cell 1 and the wiring member 41 are bonded together with a resin.

Abstract: A felt that further equalizes a pressure state under pressurization by a press so as to smooth the surface of a wet paper web without causing marking on the surface thereof and allow water to be uniformly squeezed out from the wet paper web without crushing the wet paper web is provided by a papermaking press felt wherein a difference between a maximum value and a minimum value of an interval between an upper knuckle portion and an upper knuckle portion, an interval between upper and lower knuckle portions, or an interval between a lower knuckle portion and a lower knuckle portion is arranged to be a value corresponding to 1.0 piece or less of an upper warp yarn in a base fabric.

Abstract: A felt that further equalizes a pressure state under pressurization by a press so as to smooth the surface of a wet paper web without causing marking on the surface thereof and allow water to be uniformly squeezed out from the wet paper web without crushing the wet paper web is provided by a papermaking press felt wherein a difference between a maximum value and a minimum value of an interval between an upper knuckle portion and an upper knuckle portion, an interval between upper and lower knuckle portions, or an interval between a lower knuckle portion and a lower knuckle portion is arranged to be a value corresponding to 1.0 piece or less of an upper warp yarn in a base fabric.

Abstract: With the method for manufacturing the solar cell module 100 according to the present embodiment, the width W1 of the connection region C in which the wiring member 11 and the connecting electrode 40 are electrically connected is set to be larger than the substantially half of the width W2 of the wiring member 11 in the thermocompression bonding process of the wiring member 11 using the resin adhesive 12 including the particles 13 onto the principal surface of the solar cell 10.

Abstract: A semiconductor device capable of stabilizing operations thereof is provided. This semiconductor device comprises a substrate provided with a region having concentrated dislocations at least on part of the back surface thereof, a semiconductor element layer formed on the front surface of the substrate, an insulator film formed on the region of the back surface of the substrate having concentrated dislocations and a back electrode formed to be in contact with a region of the back surface of the substrate other than the region having concentrated dislocations.

Abstract: A semiconductor device capable of stabilizing operations thereof is provided. This semiconductor device comprises a substrate provided with a region having concentrated dislocations at least on part of the back surface thereof, a semiconductor element layer formed on the front surface of the substrate, an insulator film formed on the region of the back surface of the substrate having concentrated dislocations and a back electrode formed to be in contact with a region of the back surface of the substrate other than the region having concentrated dislocations.

Abstract: A solar battery module is provided with a plurality of solar battery cells which are connected to each other by connecting bus bar electrodes (21) formed on the surfaces of the adjacent solar battery cells with wiring material (41a, 41b). The bus bar electrode (21) is embedded in the wiring material (41b), and the solar battery cell (1) and the wiring material (41b) are bonded with a resin.

Abstract: In a solar cell module, a plurality of solar cells are provided between a front surface protection member and a back surface protection member and bus bar electrodes 20 of the plurality of solar cells are electrically connected to each other by wiring members. The solar cell module includes an adhesive layer made of a resin 60 containing a plurality of conductive particles 70, the adhesive layer provided between each of the bus bar electrodes 20 and the wiring member 40. Each of the bus bar electrodes 20 and the corresponding wiring member 40 are electrically connected by the plurality of conductive particles 70. The resin 60 covers side surface of each of the bus bar electrodes 20 and configured to bond the wiring member 40 with the surface of a photoelectric conversion body 10.

Abstract: In a solar cell module, a plurality of solar cells are arranged between a front-surface protection member and a back-surface protection member, and electrodes of the plurality of solar cells is electrically connected to each other by a wring member. The solar cell module includes an adhesive layer including a resin 90 and a plurality of conductive particles 80, between the electrodes 10 and the wiring member 70. Each conductive particle 80 has a flattened shape that a maximum thickness D in a plane perpendicular to a solar cell 20 is smaller than a maximum length L in a plane parallel to the solar cell 20. Both ends of each conductive particle 80 in a thickness direction are respectively in contact with one of the electrodes 10 and the wiring member 70.

Abstract: A semiconductor device capable of stabilizing operations thereof is provided. This semiconductor device comprises a substrate provided with a region having concentrated dislocations at least on part of the back surface thereof, a semiconductor element layer formed on the front surface of the substrate, an insulator film formed on the region of the back surface of the substrate having concentrated dislocations and a back electrode formed to be in contact with a region of the back surface of the substrate other than the region having concentrated dislocations.

Abstract: An encapsulant for a photovoltaic module, which may inhibit the encapsulant from clouding when a hot spot phenomenon is caused. The encapsulant for a photovoltaic module includes: a resin for an encapsulant containing a silane-modified resin obtained by polymerizing an ethylenically unsaturated silane compound and polyethylene for a light stabilizer, a thermal stabilizer and polyethylene for use in a mater batch. The polyethylene for polymerization and the polyethylene for use in a master batch are metallocene based linear low density polyethylene having a density in the range of 0.895 g/cm3 to 0.910 g/cm3.

Abstract: With the method for manufacturing the solar cell module according to the present embodiment, the width W1 of the connection region C in which the wiring member 11 and the connecting electrode 40 are electrically connected is set to be larger than the substantially half of the width W2 of the wiring member 11 in the thermocompression bonding process of the wiring member 11 using the resin adhesive 12 including the particles 13 onto the principal surface of the solar cell 10.

Abstract: A semiconductor device capable of stabilizing operations thereof is provided. This semiconductor device comprises a substrate provided with a region having concentrated dislocations at least on part of the back surface thereof, a semiconductor element layer formed on the front surface of the substrate, an insulator film formed on the region of the back surface of the substrate having concentrated dislocations and a back electrode formed to be in contact with a region of the back surface of the substrate other than the region having concentrated dislocations.

Abstract: A semiconductor device capable of stabilizing operations thereof is provided. This semiconductor device comprises a substrate provided with a region having concentrated dislocations at least on part of the back surface thereof, a semiconductor element layer formed on the front surface of the substrate, an insulator film formed on the region of the back surface of the substrate having concentrated dislocations and a back electrode formed to be in contact with a region of the back surface of the substrate other than the region having concentrated dislocations.

Abstract: A semiconductor device capable of stabilizing operations thereof is provided. This semiconductor device comprises a substrate provided with a region having concentrated dislocations at least on part of the back surface thereof, a semiconductor element layer formed on the front surface of the substrate, an insulator film formed on the region of the back surface of the substrate having concentrated dislocations and a back electrode formed to be in contact with a region of the back surface of the substrate other than the region having concentrated dislocations.

Abstract: A semiconductor laser device capable of improving heat dissipativity, simplifying the fabrication process and improving the fabrication yield is obtained. This semiconductor laser device comprises a semiconductor layer formed on an emission layer while constituting a convex ridge portion, a current blocking layer consisting of a semiconductor formed to cover at least the side surfaces of the ridge portion, a first metal electrode formed to be in contact with the upper surface of the ridge portion and convex support portions arranged on both sides of the ridge portion at a prescribed interval from the ridge portion.

Abstract: A semiconductor laser device capable of improving heat dissipativity, simplifying the fabrication process and improving the fabrication yield is obtained. This semiconductor laser device comprises a semiconductor layer formed on an emission layer while constituting a convex ridge portion, a current blocking layer consisting of a semiconductor formed to cover at least the side surfaces of the ridge portion, a first metal electrode formed to be in contact with the upper surface of the ridge portion and convex support portions arranged on both sides of the ridge portion at a prescribed interval from the ridge portion.