Abstract: Structures with doping free connections and methods of fabrication are provided. An exemplary structure includes a substrate; a first region of a first conductivity type formed in the substrate; an overlying layer located over the substrate; a well region of a second conductivity type formed in the overlying layer; a conductive plug laterally adjacent to the well region and extending through the overlying layer to electrically contact with the first region; and a passivation layer located between the conductive plug and the well region.

Abstract: Example methods are provided to improve placement of an adaptor (210,220) to a mobile computing device (100) to measure a test strip (221) coupled to the adaptor (220) with a camera (104) and a screen (108) on a face of the mobile computing device (100). The method may include displaying a light area on a first portion of the screen (108). The first portion may be adjacent to the camera (104). The light area and the camera (104) may be aligned with a key area of the test strip (221) so that the camera (104) is configured to capture an image of the key area. The method may further include providing first guiding information for a user to place the adaptor (210,220) to the mobile computing device (100) according to a position of the light area on the screen (108).

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A method includes forming a test pattern and a reference pattern in an absorption layer of a photomask structure. The test pattern has a first trench and a second trench, the reference pattern has a third trench and a fourth trench, the test pattern and the reference pattern have substantially the same dimension in a top view, and the second trench is deeper than the first trench, the third trench, and the fourth trench. The method further includes emitting a light beam to the test pattern to obtain a first interference pattern reflected from the test pattern, emitting the light beam to the reference pattern to obtain a second interference pattern reflected from the reference pattern; and comparing the first interference pattern with the second interference pattern to obtain a measured complex refractive index of the absorption layer.

Abstract: A light sensor module is provided. The light sensor module is used to receive a first light beam and generate an electric current corresponding to an intensity of the first light beam. The light sensor module includes a substrate, a photodiode chip, and a wavelength conversion structure. The photodiode chip is disposed on the substrate. The wavelength conversion structure is disposed on the substrate, and the photodiode chip is covered by the wavelength conversion structure. The first light beam is converted into a second light beam by the wavelength conversion structure. The photodiode chip receives the second light beam, and then generates the electric current.

Abstract: A lighting device is provided. The lighting device includes a carrier, a light-emitting diode chip, and a wavelength up-conversion structure. The light-emitting diode chip is disposed on the carrier and is configured to emit a first light, which has a peak wavelength between 800 nm and 1000 nm. The wavelength up-conversion structure is disposed on the light-emitting diode chip and is configured to convert part of the first light into a second light, which has a converted spectrum between 400 nm and 700 nm.

Abstract: A display device includes a patterned panel and a light emitting module. The patterned panel includes a light-transmitting substrate, a first light-transmitting portion, a second light-transmitting portion and a third light-transmitting portion. Each of the light-transmitting portions respectively has a first transmission spectrum, a second transmission spectrum and a third transmission spectrum. The third light-transmitting portion is adjacent to the first light-transmitting portion and the second light-transmitting portion, and the third transmission spectrum has a first overlapping part with the first transmission spectrum, and has a second overlapping part with the second transmission spectrum. The light emitting module includes a first light emitting unit and a second light emitting unit, the first light emitting unit emits a first light having a peak wavelength in the first overlapping part, and the second light emitting unit emits a second light having a peak wavelength in the second overlapping part.

Abstract: A lighting device is provided. The lighting device includes a carrier, a light-emitting diode chip, and a wavelength up-conversion structure. The light-emitting diode chip is disposed on the carrier and is configured to emit a first light, which has a peak wavelength between 800 nm and 1000 nm. The wavelength up-conversion structure is disposed on the light-emitting diode chip and is configured to convert part of the first light into a second light, which has a converted spectrum between 400 nm and 700 nm.

Abstract: A display device includes a patterned panel and a light emitting module. The patterned panel includes a light-transmitting substrate, a first light-transmitting portion, a second light-transmitting portion and a third light-transmitting portion. Each of the light-transmitting portions respectively has a first transmission spectrum, a second transmission spectrum and a third transmission spectrum. The third light-transmitting portion is adjacent to the first light-transmitting portion and the second light-transmitting portion, and the third transmission spectrum has a first overlapping part with the first transmission spectrum, and has a second overlapping part with the second transmission spectrum. The light emitting module includes a first light emitting unit and a second light emitting unit, the first light emitting unit emits a first light having a peak wavelength in the first overlapping part, and the second light emitting unit emits a second light having a peak wavelength in the second overlapping part.

Abstract: A timing calibration system is applicable to a memory read system which includes a memory, a delay unit and a data read circuit. The memory outputs a data signal and a data latch signal. The delay unit delays the data latch signal by a delay value, to generate a read signal. The data read circuit reads the data signal according to the read signal. In the timing calibration system, a logic computation unit generates first and second charging signals according to the data signal and the read signal, and a capacitor-resistor charging unit performs charging operations according to the first and second charging signals, so as to generate first and second capacitor voltages, and a comparing unit can compare the first and second capacitor voltages, to generate a comparison result, thereby adjusting the delay value of the delay unit according to the comparison result.

Abstract: A timing calibration system is applicable to a memory read system which includes a memory, a delay unit and a data read circuit. The memory outputs a data signal and a data latch signal. The delay unit delays the data latch signal by a delay value, to generate a read signal. The data read circuit reads the data signal according to the read signal. In the timing calibration system, a logic computation unit generates first and second charging signals according to the data signal and the read signal, and a capacitor-resistor charging unit performs charging operations according to the first and second charging signals, so as to generate first and second capacitor voltages, and a comparing unit can compare the first and second capacitor voltages, to generate a comparison result, thereby adjusting the delay value of the delay unit according to the comparison result.

Abstract: A method for forming a light-emitting package structure provided with a predetermined view angle is provided. The method includes the steps of: disposing a flip chip on a carrier substrate; filling an underfill material between at least two electrodes of the flip chip for supporting the flip-chip; laser lifting-off a growing substrate from the flip chip for forming a thin film chip and exposing an epitaxial structure from the thin film chip; roughening the epitaxial structure exposed from the thin film chip; providing a view angle adjusting structure including a wavelength converting layer on the thin film chip, and selecting a predetermined view angle and achieving the predetermined view angle by adjusting the view angle adjusting structure according to a linear regression formula.

Abstract: A wireless network device with a communication assembly, which is rotatable for better signal strength, includes a power supply module and the communication assembly. The communication assembly is powered by the power supply module. The power supply module includes a base and a first electrode unit. The first electrode unit is positioned in the base. The first electrode unit partially extends out of the base. The communication assembly includes a case and a second electrode unit. The second electrode unit is positioned in the case. The second electrode unit partially extends out of the case towards the first electrode unit. The case is detachably installed on the base. The case can be rotated relative to the base. The second electrode unit is electrically connected to the first electrode unit.

Abstract: A method for forming a light-emitting package structure provided with a predetermined view angle is provided. The method includes the steps of: disposing a flip chip on a carrier substrate; filling an underfill material between at least two electrodes of the flip chip for supporting the flip-chip; laser lifting-off a growing substrate from the flip chip for forming a thin film chip and exposing an epitaxial structure from the thin film chip; roughening the epitaxial structure exposed from the thin film chip; providing a view angle adjusting structure including a wavelength converting layer on the thin film chip, and selecting a predetermined view angle and achieving the predetermined view angle by adjusting the view angle adjusting structure according to a linear regression formula.

Abstract: A method for forming a light-emitting package structure provided with a predetermined view angle is provided. The method includes the steps of: disposing a flip chip on a carrier substrate; filling an underfill material between at least two electrodes of the flip chip for supporting the flip-chip; laser lifting-off a growing substrate from the flip chip for forming a thin film chip and exposing an epitaxial structure from the thin film chip; roughening the epitaxial structure exposed from the thin film chip; providing a view angle adjusting structure including a wavelength converting layer on the thin film chip, and selecting a predetermined view angle and achieving the predetermined view angle by adjusting the view angle adjusting structure according to a linear regression formula.

Abstract: A method for manufacturing a light emitting diode structure uses a removable prefilled layer to attach the flip-type chip on a temporary substrate. A growth substrate of the flip-type chip is removed by laser lift-off, and then the light emitting diode structure is attached to a transparent support body. Lastly, the temporary substrate and the prefilled layer are removed.

Abstract: An LED package structure includes a conductive frame assembly, a reflective housing, an UV LED chip disposed on the conductive frame assembly, and a die-attach adhesive for bonding the UV LED chip to the conductive frame assembly. The reflective housing includes Silicone Molding Compound (SMC) and filler mixed in the SMC. The energy gap of the filler is greater than or equal to 4 eV. The energy gap of the filler thereof can be chosen by the following formulas. When the refractive index difference between the filler and the SMC is less than or equal to 0.2, the energy gap of the filler is satisfied the following formula. E?1240 (nm·eV)/(??150(nm)). When the refractive index difference between the filler and the SMC is greater than 0.2, the energy gap of the filler is satisfied the following formula. E?1240(nm·eV)/(??50(nm)).

Abstract: A wireless network device with a communication assembly, which is rotatable for better signal strength, includes a power supply module and the communication assembly. The communication assembly is powered by the power supply module. The power supply module includes a base and a first electrode unit. The first electrode unit is positioned in the base. The first electrode unit partially extends out of the base. The communication assembly includes a case and a second electrode unit. The second electrode unit is positioned in the case. The second electrode unit partially extends out of the case towards the first electrode unit. The case is detachably installed on the base. The case can be rotated relative to the base. The second electrode unit is electrically connected to the first electrode unit.

Abstract: A method for manufacturing a light emitting diode structure uses a removable prefilled layer to attach the flip-type chip on a temporary substrate. A growth substrate of the flip-type chip is removed by laser lift-off, and then the light emitting diode structure is attached to a transparent support body. Lastly, the temporary substrate and the prefilled layer are removed.

Abstract: A gas sensor includes a base, an insulating layer, two sensing electrodes, a heating layer, a gas-sensing material, and an exciting light source. A thru-hole is formed on the base, the insulating layer is disposed on the base to cover the thru-hole, and a portion of the insulating layer corresponding to the thru-hole is defined as an element area. Each sensing electrode disposed on the insulating layer has a sensing segment disposed on the element area and a sensing pad disposed outside the element area. The heating layer disposed on the insulating layer has a heating segment disposed on the element area and two heating pads disposed outside the element area. The gas-sensing material is disposed on the element area and covers the sensing segments and the heating segment. The exciting light source is arranged in the thru-hole and is configured to emit light toward the gas-sensing material.