Abstract: A method for manufacturing a light emitting diode structure uses a removable prefilled layer to attach the flip-type chip on a temporary substrate. A growth substrate of the flip-type chip is removed by laser lift-off, and then the light emitting diode structure is attached to a transparent support body. Lastly, the temporary substrate and the prefilled layer are removed.

Abstract: A wireless network device with an LTE module which is rotatable for higher signal strength includes a power supply module and the LTE module. The LTE module is powered by the power supply module. The power supply module includes a base and a first electrode unit. The first electrode unit is positioned in the base. The first electrode unit partly extends out of the base. The LTE module includes a case and a second electrode unit. The second electrode unit is positioned in the case. The second electrode unit partly extends out of the case towards the first electrode unit. The case is detachably installed on the base. The case can be rotated relative to the base. The second electrode unit is electrically connected to the first electrode unit.

Abstract: A gas sensor includes a base, an insulating layer, two sensing electrodes, a heating layer, a gas-sensing material, and an exciting light source. A thru-hole is formed on the base, the insulating layer is disposed on the base to cover the thru-hole, and a portion of the insulating layer corresponding to the thru-hole is defined as an element area. Each sensing electrode disposed on the insulating layer has a sensing segment disposed on the element area and a sensing pad disposed outside the element area. The heating layer disposed on the insulating layer has a heating segment disposed on the element area and two heating pads disposed outside the element area. The gas-sensing material is disposed on the element area and covers the sensing segments and the heating segment. The exciting light source is arranged in the thru-hole and is configured to emit light toward the gas-sensing material.

Abstract: The instant disclosure provides a photoelectric semiconductor device including a substrate, a light-emitting diode chip, a converting material, an encapsulant, and a protective layer. The light-emitting diode chip is arranged on the substrate. The encapsulant has a Shore hardness of higher than D50 or a moisture-permeable value of less than 10 g/m2·24 hrs, and the converting material includes a first wavelength converting compound having a main peak wavelength in green spectrum and a second wavelength converting compound having a main peak wavelength in red spectrum which are fluorescent materials having a FWHM of equal to or less than 50 nm. The photoelectric semiconductor device provided by the instant disclosure exhibits improved NTSC, brightness and reliability.

Abstract: An LED package structure includes a conductive frame assembly, a reflective housing, an UV LED chip disposed on the conductive frame assembly, and a die-attach adhesive for bonding the UV LED chip to the conductive frame assembly. The reflective housing includes Silicone Molding Compound (SMC) and filler mixed in the SMC. The energy gap of the filler is greater than or equal to 4 eV. The energy gap of the filler thereof can be chosen by the following formulas. When the refractive index difference between the filler and the SMC is less than or equal to 0.2, the energy gap of the filler is satisfied the following formula. E?1240 (nm·eV)/(??150(nm)). When the refractive index difference between the filler and the SMC is greater than 0.2, the energy gap of the filler is satisfied the following formula. E?1240(nm·eV)/(??50(nm)).

Abstract: An LED package includes a chip carrier, an adhesive layer, one high-voltage LED die, and an encapsulating member. The chip carrier defines a receiving space. The adhesive layer is disposed in the receiving space and has a thermal conductivity of larger than or equal to 1 W/mK. The high-voltage LED die is attached to the adhesive layer to be received in the reflective space and has a top surface formed with a trench. The trench of the high-voltage LED die is disposed at an optical center of the receiving space. The encapsulating member encapsulates the high-voltage LED die and includes a plurality of diffusers. The trench is embedded with the encapsulating member and has a width ranging from 1 ?m to 10 ?m and a depth of less than or equal to 50 ?m.

Abstract: A white light emitting device includes an LED chip capable of emitting light with a peak wavelength of 390 to 430 nm, and a wavelength conversion layer including first, second and third fluorescent materials. The first fluorescent material is capable of being excited to emit light with a peak wavelength of 450 to 470 nm. The second fluorescent material is capable of being excited to emit light with a peak wavelength of 450 to 470 nm. The third fluorescent material is capable of being excited to emit light with a peak wavelength of 630 to 650 nm. Light emitted by the white light emitting device has a color temperature below 5000 K, and a general color rendering index value (Ra) and special color rendering index values (R9-R15) all greater than 90.

Abstract: A white light emitting device includes an LED chip capable of emitting light with a peak wavelength of 390 to 430 nm, and a wavelength conversion layer including first, second and third fluorescent materials. The first fluorescent material is capable of being excited to emit light with a peak wavelength of 450 to 470 nm. The second fluorescent material is capable of being excited to emit light with a peak wavelength of 450 to 470 nm. The third fluorescent material is capable of being excited to emit light with a peak wavelength of 630 to 650 nm. Light emitted by the white light emitting device has a color temperature below 5000 K, and a general color rendering index value (Ra) and special color rendering index values (R9-R15) all greater than 90.

Abstract: An electronic device includes a main body including a printed circuit board (PCB) and a sliding portion, a seat portion slideably engaging with the sliding portion and a connecting cable including a first connector, a second connector and a cable portion connected between the first connector and the second connector. The seat portion includes a winding post and a through hole extending into the winding post and communicating to the main body. The winding post defines a gap communicating the through hole to periphery of the winding post. The first connector is inserted into the main body to engage with the PCB. The second connector is exposed outside of the seat portion. The cable portion is received in the through hole and the gap and enabled to be wound around the winding post.

Abstract: A luminaire includes a base, a light-emitting unit, and a lamp cover. The base includes a first tube part, a second tube part having an inner diameter smaller than that of the first tube part, and a joint part connected between the first and second tube parts. An inner flow path is defined by at least the first tube part, the joint part, and the second tube part in a coaxial manner. The lamp cover is fixed on the base for covering the light-emitting unit. As such, air heated by the light-emitting unit flows out of the inner flow path to thereby allow cold air to be sucked into the inner flow path.

Abstract: An LED package includes a chip carrier, an adhesive layer, one high-voltage LED die, and an encapsulating member. The chip carrier defines a receiving space. The adhesive layer is disposed in the receiving space and has a thermal conductivity of larger than or equal to 1 W/mK. The high-voltage LED die is attached to the adhesive layer to be received in the reflective space and has a top surface formed with a trench. The trench of the high-voltage LED die is disposed at an optical center of the receiving space. The encapsulating member encapsulates the high-voltage LED die and includes a plurality of diffusers. The trench is embedded with the encapsulating member and has a width ranging from 1 ?m to 10 ?m and a depth of less than or equal to 50 ?m.

Abstract: A lead frame assembly includes a surrounding frame and a plurality of lead frame sets arranged in a matrix. Each lead frame set includes spaced-apart first and second lead frames and a connecting structure interconnecting one of the lead frame sets to an adjacent lead frame set. Each lead frame set is further connected to the surrounding frame through the connecting structure thereof. A plurality of insulated bars are spacedly formed on a lead frame panel. Each insulated bar covers a corresponding row of the lead frame sets and exposes bottom surfaces of the first and second lead frames. Each insulated bar further covers portions of the surrounding frame that are adjacent to two opposite outermost ones of the lead frame sets.

Abstract: A light-emitting device includes a light-emitting element and a heat-conducting and electrically-insulating element. The light-emitting element includes at least one first conductive frame having at least one first electrically-conducting portion and at least one heat-dissipating portion, at least one second conductive frame adjacent to the first conductive frame and having at least one second electrically-conducting portion, a casing enclosing the first conductive frame and the second conductive frame, and at least one light-emitting chip disposed on the first conductive frame. The heat-conducting and electrically-insulating element includes a heat-conducting and electrically-insulating layer disposed on the heat-dissipating portion for insulating an electrical current from the heat-dissipating portion.

Abstract: An illumination device having enhanced thermal dissipating capacity is provided. The illumination device includes a heat sink, an LED module, a cover, an LED driver, and a lamp base. The LED module is disposed at one end of the heat sink. The cover covers the LED module. The LED driver is in connection with the LED module, and includes a circuit board and at least one electrical contact member disposed on the circuit board. The lamp base is connected to the other end of the heat sink, and comprises an insulating unit, a first electrode, a second electrode and at least one contact port. The contact port is arranged on the lateral interior of the insulating unit, so that the electrical contact member of the LED driver may establish electrical connection with the lamp base.

Abstract: A large-scale data processing system, a large-scale data processing method, and a non-transitory tangible machine-readable medium are provided. The large-scale data processing system comprises an interface and a processor. The interface accesses a multi-dimensional data model, wherein the multi-dimensional data model comprises a plurality of dimensions, the dimensions form a multi-dimensional space of measures, each dimension is a single space comprising a plurality of members with a common set of attributes, and each measure is a data element organized and accessible through the multi-dimensional space of the cross-product of all dimensions. The processor builds at least one Tree Object (TO), wherein the TO is derived by converting the multi-dimensional data model into an N-level tree data structure according to a level order of N attributes, each tree node in the TO meets all conditions of attributes for all ancestor nodes, and N is a positive integer.

Abstract: A device includes a cover defining a sleeve, which allows a transmission cable to pass therethrough such that the transmission cable passes from an inner side of the device to an outer side of the device. An elastomer is filled in the sleeve and embedded with the transmission cable. A fastening member is employed to engage with the sleeve to tightly press the elastomer embedded with the transmission cable to prevent water from entering the device along the transmission cable and the sleeve.

Abstract: A lead frame assembly includes a surrounding frame and a plurality of lead frame sets arranged in a matrix. Each lead frame set includes spaced-apart first and second lead frames and a connecting structure interconnecting one of the lead frame sets to an adjacent lead frame set. Each lead frame set is further connected to the surrounding frame through the connecting structure thereof. A plurality of insulated bars are spacedly formed on a lead frame panel. Each insulated bar covers a corresponding row of the lead frame sets and exposes bottom surfaces of the first and second lead frames. Each insulated bar further covers portions of the surrounding frame that are adjacent to two opposite outermost ones of the lead frame sets.

Abstract: An illumination lamp comprises a lamp body, a light-emitting module, a power supply module, and a circuit module. The lamp body defines an inner space. The partitioning unit is disposed in the lamp body for dividing the inner space into a first space for receiving the power supply module, and a second space for receiving the circuit module. Due to the presence of the partitioning unit, thermal convection between the first and second spaces is prevented to reduce adverse influence of a high temperature of the circuit module on the power supply module.

Abstract: A large-scale data processing system, a large-scale data processing method, and a non-transitory tangible machine-readable medium are provided. The large-scale data processing system comprises an interface and a processor. The interface accesses a multi-dimensional data model, wherein the multi-dimensional data model comprises a plurality of dimensions, the dimensions form a multi-dimensional space of measures, each dimension is a single space comprising a plurality of members with a common set of attributes, and each measure is a data element organized and accessible through the multi-dimensional space of the cross-product of all dimensions. The processor builds at least one Tree Object (TO), wherein the TO is derived by converting the multi-dimensional data model into an N-level tree data structure according to a level order of N attributes, each tree node in the TO meets all conditions of attributes for all ancestor nodes, and N is a positive integer.

Abstract: A lighting device includes a light source module and a housing mated to a heat sink and covered by a cover. The housing has a first shell portion encircled by an inner sidewall of the heat sink. Alternatively, the housing may further has a second shell portion arranged between the first shell portion and the inner sidewall of the heat sink. The respective ends of the first and second shell portions are covered by a first plate portion and a connecting portion. A cavity is defined by the first shell portion and the first plate portion for accommodating the light source module. A plurality of first thru-holes, second thru holes, third thru holes, fourth thru-holes, and fifth thru holes are formed on the circuit board, the connecting portion, the cover, the first shell portion, and the first plate portion, respectively.