Abstract: The present disclosure provides a semiconductor structure including a substrate, a first die over the substrate, a second die over the first die, a heat spreader having a sidewall facing toward and proximal to a sidewall of the first die, and a thermal interface material (TIM) between the sidewall of the first die and the sidewall of the heat spreader. A thermal conductivity of the heat spreader is higher than a thermal conductivity of the TIM.

Abstract: A semiconductor device includes a vapor chamber lid for high power applications such as chip-on-wafer-on-substrate (CoWoS) applications using high performance processors (e.g., graphics processing unit (GPU)) and methods of manufacturing the same. The vapor chamber lid provides a thermal solution which enhances the thermal performance of a package with multiple chips. The vapor chamber lid improves hot spot dissipation in high performance chips, for example, at the three-dimensional (3D-IC) packaging level.

Abstract: The present disclosure provides a semiconductor structure including a substrate, a first die over the substrate, a second die over the first die, a heat spreader having a sidewall facing toward and proximal to a sidewall of the first die, and a thermal interface material (TIM) between the sidewall of the first die and the sidewall of the heat spreader. A thermal conductivity of the heat spreader is higher than a thermal conductivity of the TIM.

Abstract: A thermal dissipating module comprises a heat pipe with a first end and a second end, a first joint component connected to the first end, a second joint component connected to the second end, a first thermal conductive plate, and a second thermal conductive plate. It also can be used in an electronic apparatus with a thermal dissipating module.

Abstract: The present invention relates to a chassis structure for an electronic system containing a plurality of electronic components therein. The present invention provides a composite chassis structure comprising a nonmetal mesh cover formed on one or more surfaces of the metal chassis to obtain additional thermal budget and human-friendly chassis surface.

Abstract: The present invention relates to a chassis structure for an electronic system containing a plurality of electronic components therein. The present invention provides a composite chassis structure comprising a nonmetal mesh cover formed on one or more surfaces of the metal chassis to obtain additional thermal budget and human-friendly chassis surface.

Abstract: A fan-shaped dissipating device, which is assembled on a chip of an erect PCB, has a conductive board, and a plurality of fins. The fins are respectively connected on an outside surface of the conductive board. Each of the fins has a top end and a bottom end. An interval between each two adjacent top ends of the fins is larger that between each two adjacent bottom ends of the fins. The fins are arranged in a radiating manner toward two sides from the bottom ends to the upper ends, therefore reducing the density of the accumulated air between the top ends of the fins because of rising hot air, and providing a better dissipating effect.

Abstract: An IC package with an implanted heat-dissipation fin is introduced. The IC package provides a plastic package to seal an IC chip. One end of the heat-dissipation fin is implanted inside the plastic package, and another end is left outsides for directly heat-exchanging with a surrounding heat-transfer media. By providing the implanted heat-dissipation fin, a more efficient and broader heat-dissipation path for the IC package can be established so that the total heat dissipation of the IC package can be enhanced.

Abstract: A thermal dissipating module comprises a heat pipe with a first end and a second end, a first joint component connected to the first end, a second joint component connected to the second end, a first thermal conductive plate, and a second thermal conductive plate. It also can be used in an electronic apparatus with a thermal dissipating module.

Abstract: A heat-dissipating device has multiple conduction paths, and is especially adapted to a package with MPMs (Multiple Packaging Modules). The package is mounted on one side of a PCB. The heat-dissipating device has a first heat-dissipating unit, a second heat-dissipating unit, and a thermal bridge unit. The first heat-dissipating unit is contacted with a first heat source of the package element. The second heat-dissipating unit penetrates through the PCB and contacts with a second heat source of the package element. The thermal bridge unit penetrates through the PCB and connects the first heat-dissipating unit and the second heat-dissipating unit.

Abstract: A lateral airflow fan-sink for electronic devices is introduced to comprise a heat-fin with inter-fin slots and a plurality of axial fans surrounding the heat-fin. The axial fans are mounted individually at ventilating sides of the heat-fin for generating respective forced flow wiping through the inter-fin slots. Thereby, overall heat-dissipation efficiency of the fan-sink can be improved and operational jeopardy from breakdown of all axial fans can be totally removed.

Abstract: A modular heat-dissipation assembly structure for a PCB is described. The structure is formed in a modular way on a peripheral enclosure to meet the thermal budget of the PCB, and has a modular enclosure, a PCB, and at least one heat pipe. The modular enclosure has a plurality of boards and at least one assembly opening. One of the boards has a plurality of fins extending outwardly to form a heat-dissipation board. The PCB is assembled in the modular enclosure, and has at least one processing chip. The at least one heat pipe connects the processing chip to the heat-dissipation board.

Abstract: A fan-shaped dissipating device, which is assembled on a chip of an erect PCB, has a conductive board, and a plurality of fins. The fins are respectively connected on an outside surface of the conductive board. Each of the fins has a top end and a bottom end. An interval between each two adjacent top ends of the fins is larger that between each two adjacent bottom ends of the fins. The fins are arranged in a radiating manner toward two sides from the bottom ends to the upper ends, therefore reducing the density of the accumulated air between the top ends of the fins because of rising hot air, and providing a better dissipating effect.

Abstract: A multi-opening heat-dissipation device for high-power electronic components includes a body, an extension extended from the body, and a radial fan. The radial fan is mounted on a bottom aperture of the body. The body further comprises a primary opening on a first face and a cavity communicating between the bottom aperture and the primary opening as a wind path. The body further includes at least one additional opening on a second face of the body. The at least one additional comprises a second opening faces a circuit board on which a high-power electronic component is mounted. The cool air can flow to at least one of the topside and bottom side of the circuit board through the second opening and cool the high-power electronic components directly.

Abstract: A lateral airflow fan-sink for electronic devices is introduced to comprise a heat-fin with inter-fin slots and a plurality of axial fans surrounding the heat-fin. The axial fans are mounted individually at ventilating sides of the heat-fin for generating respective forced flow wiping through the inter-fin slots. Thereby, overall heat-dissipation efficiency of the fan-sink can be improved and operational jeopardy from breakdown of all axial fans can be totally removed.

Abstract: An IC package for a multi-chip module includes a substrate, a plurality of chips mounted on the substrate, and an encapsultant sealing the chips on the substrate. The IC package is characterized in that at least a thermal bridge is constructed with the encapsultant and each of the thermal bridge is used to bridge at least two chips. By providing the thermal bridge, heat transfer between chips can be upgraded and thereby overall heat-spreading effect and heat dissipation of the multi-chip module can be enhanced.

Abstract: An IC package with an implanted heat-dissipation fin is introduced. The IC package provides a plastic package to seal an IC chip. One end of the heat-dissipation fin is implanted inside the plastic package, and another end is left outsides for directly heat-exchanging with a surrounding heat-transfer media. By providing the implanted heat-dissipation fin, a more efficient and broader heat-dissipation path for the IC package can be established so that the total heat dissipation of the IC package can be enhanced.

Abstract: A multi-opening heat-dissipation device for high-power electronic components includes a body, an extension extended from the body, and a radial fan. The radial fan is mounted on a bottom aperture of the body. The body further comprises a primary opening on a first face and a cavity communicating between the bottom aperture and the primary opening as a wind path. The body further includes at least one additional opening on a second face of the body. The at least one additional comprises a second opening faces a circuit board on which a high-power electronic component is mounted. The cool air can flow to at least one of the topside and bottom side of the circuit board through the second opening and cool the high-power electronic components directly.