Abstract: A semiconductor device including a substrate having a NMOS region and a PMOS region; a metal gate extending continuously along a first direction from the NMOS region to the PMOS region on the substrate; a first source/drain region extending along a second direction adjacent to two sides of the metal gate on the NMOS region; a second source/drain region extending along the second direction adjacent to two sides of the metal gate on the PMOS region; a first contact plug landing on the second source/drain region adjacent to one side of the metal gate; a second contact plug landing on the second source/drain region adjacent to another side of the metal gate; and a third contact plug landing directly on a portion of the metal gate on the PMOS region and between the first contact plug and the second contact plug.

Abstract: A semiconductor device including a substrate having a NMOS region and a PMOS region; a metal gate extending continuously along a first direction from the NMOS region to the PMOS region on the substrate; a first source/drain region extending along a second direction adjacent to two sides of the metal gate on the NMOS region; a second source/drain region extending along the second direction adjacent to two sides of the metal gate on the PMOS region; a first contact plug landing on the second source/drain region adjacent to one side of the metal gate; a second contact plug landing on the second source/drain region adjacent to another side of the metal gate; and a third contact plug landing directly on a portion of the metal gate on the PMOS region and between the first contact plug and the second contact plug.

Abstract: A semiconductor device including a substrate having a NMOS region and a PMOS region; a metal gate extending continuously along a first direction from the NMOS region to the PMOS region on the substrate; a first source/drain region extending along a second direction adjacent to two sides of the metal gate on the NMOS region; a second source/drain region extending along the second direction adjacent to two sides of the metal gate on the PMOS region; a first contact plug landing on the second source/drain region adjacent to one side of the metal gate; a second contact plug landing on the second source/drain region adjacent to another side of the metal gate; and a third contact plug landing directly on a portion of the metal gate on the PMOS region and between the first contact plug and the second contact plug.

Abstract: A semiconductor device including a substrate having a NMOS region and a PMOS region; a metal gate extending continuously along a first direction from the NMOS region to the PMOS region on the substrate; a first source/drain region extending along a second direction adjacent to two sides of the metal gate on the NMOS region; a second source/drain region extending along the second direction adjacent to two sides of the metal gate on the PMOS region; a first contact plug landing on the second source/drain region adjacent to one side of the metal gate; a second contact plug landing on the second source/drain region adjacent to another side of the metal gate; and a third contact plug landing directly on a portion of the metal gate on the PMOS region and between the first contact plug and the second contact plug.

Abstract: A semiconductor device includes a first metal-oxide semiconductor (MOS) transistor on a first substrate, a first interlayer dielectric (ILD) layer on the first MOS transistor, a second substrate on the first ILD layer, and a second MOS transistor on a second substrate. Preferably, the semiconductor device includes a static random access memory (SRAM) and the SRAM includes a first pull-up device, a second pull-up device, a first pull-down device, a second pull-down device, a first pass-gate device, a second pass-gate device, a read port pull-down device, and a read port pass-gate device, in which the read port pull-down device includes the first MOS transistor and the read port pass-gate device includes the second MOS transistor.

Abstract: A semiconductor device including a substrate having a NMOS region and a PMOS region; a metal gate extending continuously along a first direction from the NMOS region to the PMOS region on the substrate; a first source/drain region extending along a second direction adjacent to two sides of the metal gate on the NMOS region; a second source/drain region extending along the second direction adjacent to two sides of the metal gate on the PMOS region; a first contact plug landing on the second source/drain region adjacent to one side of the metal gate; a second contact plug landing on the second source/drain region adjacent to another side of the metal gate; and a third contact plug landing directly on a portion of the metal gate on the PMOS region and between the first contact plug and the second contact plug.

Abstract: A semiconductor device includes a substrate having a NMOS region and a PMOS region; a gate structure extending along a first direction from the NMOS region to the PMOS region on the substrate; and a first contact plug landing directly on the gate structure closer to the PMOS region from a boundary separating the NMOS region and the PMOS region. Preferably, the semiconductor device further includes a first source/drain region extending along a second direction adjacent to two sides of the gate structure on the NMOS region and a second source/drain region extending along the second direction adjacent to two sides of the gate structure on the PMOS region.

Abstract: A semiconductor device includes a first metal-oxide semiconductor (MOS) transistor on a first substrate, a first interlayer dielectric (ILD) layer on the first MOS transistor, a second substrate on the first ILD layer, and a second MOS transistor on a second substrate. Preferably, the semiconductor device includes a static random access memory (SRAM) and the SRAM includes a first pull-up device, a second pull-up device, a first pull-down device, a second pull-down device, a first pass-gate device, a second pass-gate device, a read port pull-down device, and a read port pass-gate device, in which the read port pull-down device includes the first MOS transistor and the read port pass-gate device includes the second MOS transistor.

Abstract: A semiconductor device includes a substrate having a NMOS region and a PMOS region; a gate structure extending along a first direction from the NMOS region to the PMOS region on the substrate; and a first contact plug landing directly on the gate structure closer to the PMOS region from a boundary separating the NMOS region and the PMOS region. Preferably, the semiconductor device further includes a first source/drain region extending along a second direction adjacent to two sides of the gate structure on the NMOS region and a second source/drain region extending along the second direction adjacent to two sides of the gate structure on the PMOS region.

Abstract: A method and a system for determining a discharging process of a battery are provided. The method includes the following steps. Measuring charging/discharging information of the battery. Calculating a charging/discharging characteristic of the battery according to the charging/discharging information. Aligning the charging/discharging characteristic of the battery according to a comparison characteristic point of a comparison characteristic to obtain an aligned charging/discharging characteristic. Determining whether the battery is normal according to the aligned charging/discharging characteristic or a coulombic efficiency of the battery. Calculating a safety probability of the battery according to the aligned charging/discharging characteristic and resistance of an internal short circuit of the battery when the battery is determined as abnormal. Determining a discharging process of the battery according to the safety probability of the battery.

Abstract: A fire control device comprises a box, a power wire, a pressure relieving check valve, a fire extinguishing check valve and a fire extinguisher. The box is configured to accommodate a battery system, and the power wire is configured to couple to the battery system. The pressure relieving check valve and the fire extinguishing check valve extend through the box, and a state of the pressure relieving check valve is switched between open and closed states according to a pressure difference between an inside and an outside of the box. A state of the fire extinguishing check valve is switched between open and close states according to a pressure difference between the inside and the outside of the box. The fire extinguisher is connected to the pressure relieving check valve. The fire extinguisher is switched between starting and stopping modes according to the state of the pressure relieving check valve.

Abstract: A method and a system for detecting resistance of an internal short circuit of a battery are provided. The method includes the following steps. Measuring charging/discharging information of the battery. Calculating a charging/discharging characteristic of the battery according to the charging/discharging information. Aligning the charging/discharging characteristic of the battery according to a comparison characteristic point of a comparison characteristic to obtain an aligned charging/discharging characteristic. Determining whether the battery is normal according to the aligned charging/discharging characteristic or a coulombic efficiency of the battery; and when the battery is determined as abnormal, calculating aligned charging/discharging information according to the aligned charging/discharging characteristic, and calculating the resistance of the internal short circuit of the battery according to the aligned charging/discharging information.

Abstract: A fire control device comprises a box, a power wire, a pressure relieving check valve, a fire extinguishing check valve and a fire extinguisher. The box is configured to accommodate a battery system, and the power wire is configured to couple to the battery system. The pressure relieving check valve and the fire extinguishing check valve extend through the box, and a state of the pressure relieving check valve is switched between open and closed states according to a pressure difference between an inside and an outside of the box. A state of the fire extinguishing check valve is switched between open and close states according to a pressure difference between the inside and the outside of the box. The fire extinguisher is connected to the pressure relieving check valve. The fire extinguisher is switched between starting and stopping modes according to the state of the pressure relieving check valve.

Abstract: The present invention provides a memory device, the memory device includes a first region having a plurality of oxide semiconductor static random access memories (OSSRAM) arranged in a first direction, and each of the OSSRAMs comprising a static random access memory (SRAM) and at least an oxide semiconductor dynamic random access memory (DOSRAM), wherein the DOSRAM is connected to the SRAM, wherein each of the DOSRAMs comprises an oxide semiconductor gate (OSG), and each of the OSGs extending in a second direction perpendicular to the first direction, and an oxide semiconductor channel extending in the first direction, an oxide semiconductor gate connection extending in the first direction to connect each of the OSGs, and a word line, a Vcc connection line and a Vss connection line extend in the first direction and are connected to the SRAMs in each OSSRAM.

Abstract: The present invention provides a memory device, the memory device includes a first region having a plurality of oxide semiconductor static random access memories (OSSRAM) arranged in a first direction, and each of the OSSRAMs comprising a static random access memory (SRAM) and at least an oxide semiconductor dynamic random access memory (DOSRAM), wherein the DOSRAM is connected to the SRAM, wherein each of the DOSRAMs comprises an oxide semiconductor gate (OSG), and each of the OSGs extending in a second direction perpendicular to the first direction, and an oxide semiconductor channel extending in the first direction, an oxide semiconductor gate connection extending in the first direction to connect each of the OSGs, and a word line, a Vcc connection line and a Vss connection line extend in the first direction and are connected to the SRAMs in each OSSRAM.

Abstract: A method and a system for determining a discharging process of a battery are provided. The method includes the following steps. Measuring charging/discharging information of the battery. Calculating a charging/discharging characteristic of the battery according to the charging/discharging information. Aligning the charging/discharging characteristic of the battery according to a comparison characteristic point of a comparison characteristic to obtain an aligned charging/discharging characteristic. Determining whether the battery is normal according to the aligned charging/discharging characteristic or a coulombic efficiency of the battery. Calculating a safety probability of the battery according to the aligned charging/discharging characteristic and resistance of an internal short circuit of the battery when the battery is determined as abnormal. Determining a discharging process of the battery according to the safety probability of the battery.

Abstract: A method and a system for detecting resistance of an internal short circuit of a battery are provided. The method includes the following steps. Measuring charging/discharging information of the battery. Calculating a charging/discharging characteristic of the battery according to the charging/discharging information. Aligning the charging/discharging characteristic of the battery according to a comparison characteristic point of a comparison characteristic to obtain an aligned charging/discharging characteristic. Determining whether the battery is normal according to the aligned charging/discharging characteristic or a coulombic efficiency of the battery; and when the battery is determined as abnormal, calculating aligned charging/discharging information according to the aligned charging/discharging characteristic, and calculating the resistance of the internal short circuit of the battery according to the aligned charging/discharging information.

Abstract: A battery module includes a crystal lattice type battery, a detection circuit, a control circuit and an excitation circuit. The detection circuit is electrically coupled to the battery. The control circuit is electrically coupled to the detection circuit. The excitation circuit is electrically coupled to the control circuit and the battery. When the battery is charged or discharged, the detection circuit is configured to detect an impedance of the battery. The control circuit is configured to compare the impedance and a threshold. And the control circuit is configured to produce a control signal. The excitation circuit is configured to selectively provide an excitation signal to the battery according to the control signal.

Abstract: A battery system includes a main control module and a battery pack. The battery pack includes a plurality of battery modules. During the transition of mode switching, each of the battery modules outputs a constant current. The battery modules monitor the battery status of the battery modules respectively. Based on a load requirement, the battery status of the battery modules and a conversion efficiency, the main control module dynamically controls a voltage conversion operation mode of a voltage converter of the battery system and dynamically controls the operation modes of the battery modules respectively.

Abstract: A battery module includes a crystal lattice type battery, a detection circuit, a control circuit and an excitation circuit. The detection circuit is electrically coupled to the battery. The control circuit is electrically coupled to the detection circuit. The excitation circuit is electrically coupled to the control circuit and the battery. When the battery is charged or discharged, the detection circuit is configured to detect an impedance of the battery. The control circuit is configured to compare the impedance and a threshold. And the control circuit is configured to produce a control signal. The excitation circuit is configured to selectively provide an excitation signal to the battery according to the control signal.