Abstract: A vertical smelting system is disclosed by the present disclosure. The vertical smelting system comprises a high-temperature heating device, a reaction sample loading device, a reaction product receiving device, a cooling device, and a transmission device. The reaction sample loading device is detachably connected to the high-temperature heating device, and extends downwardly from the high-temperature heating device. The reaction product receiving device located below the reaction sample loading device is detachably connected to the reaction sample loading device. The cooling device is located below the high-temperature heating device. The transmission device respectively connected to the reaction sample loading device and the reaction product receiving device is configured to drive the reaction sample loading device to move relative to the high-temperature heating device, and is further configured to drive the reaction product receiving device to move relative to the reaction sample loading device.

Abstract: A hot-swappable pump unit (HSPU) and a coolant distribution unit (CDU) using the same are disclosed. The HSPU is connected to a loop inlet element, a loop outlet element and a fixed component of CDU along a matching direction. The HSPU includes a housing, a pump, a pump inlet element, a pump outlet element and a fastening component. The pump inlet element is in communication with the pump by passing through a first lateral wall of the housing. The pump outlet element is in communication with the pump by passing through the first lateral wall. The fastening component is arranged on the housing and configured to engage with the fixed component, to drive the hosing to move along the matching direction. Whereby, the pump inlet element and the loop outlet element are matched and connected, and the pump outlet element and the loop inlet element are matched and connected.

Abstract: A semi-solid alloy thermal interface composition and method for dissipating heat from an electronic component using the same are disclosed in the present disclosure. The semi-solid alloy thermal interface material comprises, based on total atoms of 100 at. %, 0.1-10 at. % of Bi, 20-30 at. % of In, and 65-75 at. % of Sn. In a method for dissipating heat from an electronic component using the semi-solid alloy thermal interface material, the semi-solid alloy thermal interface material is disposed between a chip and a heat sink, wherein the semi-solid alloy thermal interface material is completely solid at a room-temperature, and has a liquid content ranging from 0.1 to 70 mol % based on a total mole of 100 mol % of the semi-solid alloy thermal interface composition at a temperature of 40 to 130° C.

Abstract: A method of bonding multiple copper elements and a method of bonding multiple dielectric layers are disclosed. The method of bonding multiple copper elements comprises steps of: oxidizing a first copper element to form a first copper oxide structure on a surface of the first copper element, and oxidizing a second copper element to form a second copper oxide structure on a surface of the second copper element; immersing the first copper element and the second copper element into a reaction solution containing noble metal ions for a Galvanic reaction, so that the first copper oxide structure is replaced with a first noble metal oxide structure, and the second copper oxide structure is replaced with a second noble metal oxide structure; and bonding the first noble metal oxide structure and the second noble metal oxide structure, so that the first copper component and the second copper component are connected.

Abstract: A semiconductor package device is provided. The semiconductor package device includes a circuit substrate having a first terminal end; a chip disposed on the circuit substrate and having a conductive pad; an auxiliary structure disposed between the first terminal end and the conductive pad, wherein the chip is electrically connected to the circuit substrate through the auxiliary structure; and a protective layer disposed on the circuit substrate and surrounding the chip, wherein the width of the first terminal end is greater than or equal to the width of the auxiliary structure.

Abstract: A heat dissipation device includes at least a temperature plate and a cooling fin assembly. The temperature plate includes a plate body and a supporter. The plate body includes a vacuum chamber and a first external surface. The plate body is bent to form at least a bent portion with the first external surface being a compressive side, and the supporter is disposed at the bent portion. The supporter is disposed inside the vacuum chamber and connected to an inner wall of the vacuum chamber. The cooling fin assembly is disposed on the first external surface.

Abstract: A projection device configured to provide multiple projection modes is provided. The projection device includes a housing module and a projection module. The housing module includes a display screen and multiple protective walls. The display screen includes a display curved surface. The projection module includes an optomechanical assembly and a light guide assembly. In a first projection mode, the optomechanical assembly projects an image light beam to the light guide assembly along a first axis. The light guide assembly projects the image light beam to the display curved surface along a second axis, where the first axis and the second axis are not parallel to each other. In a second projection mode, the light guide assembly is moved out of a transmission path of the image light beam, so that the image light beam is directly projected out of the projection device.

Abstract: A vehicle structure material strengthening system and a vehicle containing the same are described. The vehicle structure material strengthening system has at least one collision sensor, a processor, and a power supply. The collision sensor is suitable for being mounted on the vehicle. The processor is electrically connected to the collision sensor for receiving a collision signal from the collision sensor, and determines whether to transmit a power activation signal according to the collision signal. The power supply is electrically connected to the processor and the vehicle. When the collision signal is greater than or equal to a collision threshold, the processor transmits the power activation signal to the power supply, wherein the power supply transmits a circuit to the vehicle according to the power activation signal; or when the collision signal is less than the collision threshold, the processor does not transmit the power activation signal.

Abstract: A hot-swappable pump unit (HSPU) and a coolant distribution unit (CDU) using the same are disclosed. The HSPU is connected to a loop inlet element, a loop outlet element and a fixed component of CDU along a matching direction. The HSPU includes a housing, a pump, a pump inlet element, a pump outlet element and a fastening component. The pump inlet element is in communication with the pump by passing through a first lateral wall of the housing. The pump outlet element is in communication with the pump by passing through the first lateral wall. The fastening component is arranged on the housing and configured to engage with the fixed component, to drive the hosing to move along the matching direction. Whereby, the pump inlet element and the loop outlet element are matched and connected, and the pump outlet element and the loop inlet element are matched and connected.

Abstract: A temperature plate device includes a plate body and a bent structure. The plate body includes a first plate and a second plate. A chamber is defined by the first plate and the second plate. The first plate has a first step section. The second plate has a second step section corresponding to the first step section. The bent structure is connected to and traverses the first step section between the first step section and the second step section.

Abstract: A projection device configured to provide multiple projection modes is provided. The projection device includes a housing module and a projection module. The housing module includes a display screen and multiple protective walls. The display screen includes a display curved surface. The projection module includes an optomechanical assembly and a light guide assembly. In a first projection mode, the optomechanical assembly projects an image light beam to the light guide assembly along a first axis. The light guide assembly projects the image light beam to the display curved surface along a second axis, where the first axis and the second axis are not parallel to each other. In a second projection mode, the light guide assembly is moved out of a transmission path of the image light beam, so that the image light beam is directly projected out of the projection device.

Abstract: A heat dissipation device includes at least a temperature plate and a cooling fin assembly. The temperature plate includes a plate body and a supporter. The plate body includes a vacuum chamber and a first external surface. The plate body is bent to form at least a bent portion with the first external surface being a compressive side, and the supporter is disposed at the bent portion. Wherein the supporter is disposed inside the vacuum chamber and connected to an inner wall of the vacuum chamber to enhance a structural strength of the bent portion and also to improve heat conduction. The cooling fin assembly is disposed on the first external surface.

Abstract: A vehicle structure material strengthening system and a vehicle containing the same are described. The vehicle structure material strengthening system has at least one collision sensor, a processor, and a power supply. The collision sensor is suitable for being mounted on the vehicle. The processor is electrically connected to the collision sensor for receiving a collision signal from the collision sensor, and determines whether to transmit a power activation signal according to the collision signal. The power supply is electrically connected to the processor and the vehicle. When the collision signal is greater than or equal to a collision threshold, the processor transmits the power activation signal to the power supply, wherein the power supply transmits a circuit to the vehicle according to the power activation signal; or when the collision signal is less than the collision threshold, the processor does not transmit the power activation signal.

Abstract: The disclosure provides a projection system and a projection method. The projection system includes a projection device. The projection device includes a projection module, a controller, and an audio player. The controller is coupled to the projection module. The audio player is coupled to the controller. When the controller executes the prepare-for-sleep mode, the controller operates the projection module to dim a projection beam or to project a predetermined projection image and operates the audio player to play a predetermined sound.

Abstract: A temperature plate includes a plate body and at least two supporters. The plate body has a first plate and a second plate, and a vacuum chamber is defined by the first plate and the second plate. The first plate has a first external surface, and the plate body is bent to form at least two bent portions with the first external surface being a compressive side, and the supporters are disposed inside the vacuum chamber and connected to an inner wall of the vacuum chamber to enhance a structural strength of the bent portions and also to improve heat conduction, wherein the temperature plate is combined with a cooling fin assembly, the cooling fin assembly is disposed on the first external surface. When the number of the bent portions are two, the configuration of the two bent portions allows the plate body to clip the cooling fin assembly.

Abstract: A bonding material (10) of the present invention includes an amorphous silver film (12).

Abstract: A manufacturing method of a heat conducting device includes following steps: providing a first plate, which includes a plate body and at least a heat conducting element, wherein the plate body has at least an inserting end disposed corresponding to the heat conducting element and defining a tube, and the heat conducting element is mounted at the tube; providing a second plate, which has a first opening end; disposing a first wick structure on an internal wall of the heat conducting element and a bottom surface of the plate body; disposing a second wick structure on an internal wall of the second plate; and connecting the plate body to the first opening end so as to connect the first plate and the second plate to form a chamber. Accordingly, the heat conducting device has a higher heat conducting efficiency.

Abstract: A temperature plate device includes a plate body and a bent supporting structure. The plate body includes a first plate and a second plate. A chamber is defined by the first plate and the second plate. The first plate has a first step section. The second plate has a second step section corresponding to the first step section. The bent supporting structure is connected to and traverses the first step section between the first step section and the second step section.

Abstract: An electric connection is provided, and has a first copper (Cu) layer, a second Cu layer, and a composite metal layer disposed between the first Cu layer and the second Cu layer. The composite metal layer has 0.01 wt. %?gallium (Ga)?20 wt. %, 0.01 wt. %?copper (Cu)?50 wt. %, and 30 wt. %?nickel (Ni)?99.98 wt. %. Moreover, a method of manufacturing the electric connection is provided, and has the steps of: (1) providing a first Cu layer and a second Cu layer; (2) forming a first Ni layer on the first Cu layer; (3) forming a second Ni layer on the second Cu layer; (4) forming a Ga layer on the first Ni layer; and (5) keeping the second Ni layer in contact with the Ga layer and carrying out a thermo-compress bonding therebetween to form the electric connection.

Abstract: A bonding material (10) of the present invention includes an amorphous silver film (12).