Abstract: A bonding material (10) of the present invention includes an amorphous silver film (12).

Abstract: A temperature plate includes a plate body and a supporting structure. The plate body has a first plate and a second plat, and a vacuum chamber is defined by the first plate and the second plate. The first plate has a first surface away from the vacuum chamber. The plate body is bent to form a bent portion with the first surface to be a compressive side, and the supporting structure is disposed corresponding to the bent portion. This configuration can prevent the deformation as bending the temperature plate and enhance the heat dissipation performance. In addition, a heat dissipation device adapting the temperature plate is also disclosed, and the heat dissipation device further includes a cooling fin assembly disposed on the first surface of the plate body.

Abstract: A manufacturing method of a heat conducting device includes following steps: providing a first plate, which includes a plate body and at least a heat conducting element, wherein the plate body has at least an inserting end disposed corresponding to the heat conducting element and defining a tube, and the heat conducting element is mounted at the tube; providing a second plate, which has a first opening end; disposing a first wick structure on an internal wall of the heat conducting element and a bottom surface of the plate body; disposing a second wick structure on an internal wall of the second plate; and connecting the plate body to the first opening end so as to connect the first plate and the second plate to form a chamber. Accordingly, the heat conducting device has a higher heat conducting efficiency.

Abstract: A multi-functional electronic control handlebar for bicycle or walk-assisting vehicle includes a control module that is built in a brake lever or a speed-change shifter or is mounted to a brake lever clip or a speed-change shifter clip. When the brake lever or the speed-change shifter is actuated, the brake lever or the speed-change shifter drives the control module to generate an electronic control signal to control a peripheral electronic accessory mounted to the vehicle body.

Abstract: This invention forms an indium or indium alloy layer on top of a Sn based lead-free solder. The indium or indium alloy layer can be formed by various methods, such as plating, deposition, printing, dipping, etc. The indium-containing layer melts during the soldering process, wets the substrate, and forms a sound solder joint. Since the melting point of indium is 156.6° C., even lower than that of the eutectic Sn—Pb which is at 183° C., so the soldering process can be carried out at a temperature lower than the conventional soldering process. During the soldering process, the indium reacts with the Sn based Pb-free solder alloy. Since the eutectic temperature of Sn—In is at 120° C., during the short time of the soldering process, the surface of the In deposited Pb-free solder remains as the liquid phase and have a good wetting with the substrate, while a In gradient is formed in the In deposited Pb-free solder.