Patents by Inventor Shih Lin Huang

Shih Lin Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240394460
    Abstract: Systems and methods are provided for predicting systematic design rule check (DRC) violations in a placement layout before routing is performed on the placement layout. A systematic DRC violation prediction system includes DRC violation prediction circuitry. The DRC violation prediction circuitry receives placement data associated with a placement layout. The DRC violation prediction circuitry inspects the placement data associated with the placement layout, and the placement data may include data associated with a plurality of regions of the placement layout, which may be inspected on a region-by-region basis. The DRC violation prediction circuitry predicts whether one or more systematic DRC violations would be present in the placement layout due to a subsequent routing of the placement layout.
    Type: Application
    Filed: July 31, 2024
    Publication date: November 28, 2024
    Inventors: Yi-Lin CHUANG, Shih-Yao LIN, Szu-ju HUANG, Yin-An CHEN, Shih Feng HONG
  • Publication number: 20240385399
    Abstract: A connector module capable of transmitting display data signals includes first and second light-emitting devices, a module connector including first and second terminals, and first and second optical transceivers respectively including at least one electrical-optical converting circuit and at least one optical-electrical converting circuit. One of the at least one electrical-optical converting circuit of the first optical transceiver is electrically coupled to the first light-emitting device and the first terminal, and one of the at least one electrical-optical converting circuit of the second optical transceiver is electrically coupled to the second light-emitting device and the second terminal. A portion of the at least one optical-electrical converting circuit of the first optical transceiver is electrically isolated to any optoelectronic device and the module connector.
    Type: Application
    Filed: March 20, 2024
    Publication date: November 21, 2024
    Inventors: Chang-Lin Hsieh, Che-Fu Liang, Shih-Jou Huang, Kun-Yin Wang
  • Publication number: 20240355684
    Abstract: A wafer stacking method includes the following steps. A first wafer is provided. A second wafer is bonded to the first wafer to form a first wafer stack structure. A first edge defect inspection is performed on the first wafer stack structure to find a first edge defect and measure a first distance in a radial direction between an edge of the first wafer stack structure and an end of the first edge defect away from the edge of the first wafer stack structure. A first trimming process with a range of a first width is performed from the edge of the first wafer stack structure to remove the first edge defect. Herein, the first width is greater than or equal to the first distance.
    Type: Application
    Filed: May 4, 2023
    Publication date: October 24, 2024
    Applicant: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Chih Feng Sung, Wei Han Huang, Ming-Jui Tsai, Yu Chi Chen, Yung-Hsiang Chang, Chun-Lin Lu, Shih-Ping Lee
  • Patent number: 12121988
    Abstract: A heat transmitting device is provided, including a main body and an integrating portion. The main body has at least one opening. The integrating portion is used to seal the opening, and has a first surface and a second surface opposite the first surface. A first welding pattern is formed on the first surface, a second welding pattern is formed on the second surface, and the position of the first welding pattern corresponds to that of the second welding pattern. The type of the first welding pattern and the type of the second welding pattern are asymmetric.
    Type: Grant
    Filed: July 17, 2023
    Date of Patent: October 22, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shih-Lin Huang, Tai-De Qi, Zhen-Hua Li
  • Publication number: 20240344774
    Abstract: A manufacturing method of a heat pipe structure is provided. Firstly, a step S1 is performed. An original heat pipe structure is provided. The original heat pipe structure includes an enclosed space in a sealed state and an original wick structure disposed within the enclosed space. Then, a step S2 is performed. Portion of the original heat pipe structure is deformed to form a deformation portion. The deformation portion clamps portion of the original wick structure. The enclosed space is separated into two subspaces. Then, a step S3 is performed. The deformation portion is cut to separate the two subspaces to form two heat pipe structures.
    Type: Application
    Filed: June 21, 2024
    Publication date: October 17, 2024
    Inventors: Shih-Lin Huang, Xiaojun Chen, Guangshuai Wang
  • Publication number: 20240295366
    Abstract: A vapor chamber is provided. The vapor chamber is adapted to be thermally connected to an electronic element. The vapor chamber includes a first member and a second member. The first member has a first heat transfer coefficient. The first member is connected to the electronic element. The second member has a second heat transfer coefficient. The second member is combined with the first member. The first member is located between the second member and the electronic element. The first heat transfer coefficient is greater than the second heat transfer coefficient.
    Type: Application
    Filed: May 13, 2024
    Publication date: September 5, 2024
    Inventors: Shih-Lin HUANG, Chiu-Kung CHEN, Ting-Yuan WU
  • Patent number: 11965698
    Abstract: A slim heat-dissipation module is provided. The slim heat-dissipation module includes a first plate, a second plate, a first porous structure, a second porous structure, a first fluid, and a second fluid. The second plate is combined with the first plate to form a first type chamber and a second type chamber, wherein the first type chamber and the second type chamber are sealed and independent, respectively. The first porous structure is disposed in the first type chamber. The second porous structure is disposed in the second type chamber. The first fluid is disposed in the first type chamber. The second fluid is disposed in the second type chamber.
    Type: Grant
    Filed: November 8, 2021
    Date of Patent: April 23, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shih-Lin Huang, Ting-Yuan Wu
  • Patent number: 11892243
    Abstract: A heat pipe comprises a first pipe and at least a second pipe. The first pipe includes an evaporator, a heat insulator and a condenser communicating with each other to define a hollow chamber. The second pipe disposed in the hollow chamber includes an accommodating space and a first capillary structure disposed in one end of the accommodating space closer to the evaporator. At least one side of an outer pipe wall of the second pipe directly abuts an inner pipe wall of the first pipe. The first pipe further includes a second capillary structure disposed in the hollow chamber closer to the evaporator and extended to an outside of the second pipe and occupies at least 2/3 volume of the evaporator. A first part of the first capillary structure and the second capillary structure are connected to each other by winding so as to enhance transportation therebetween.
    Type: Grant
    Filed: August 17, 2022
    Date of Patent: February 6, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shih-Lin Huang, Chiu-Kung Chen
  • Publication number: 20240017347
    Abstract: A heat transmitting device is provided, including a main body and an integrating portion. The main body has at least one opening. The integrating portion is used to seal the opening, and has a first surface and a second surface opposite the first surface. A first welding pattern is formed on the first surface, a second welding pattern is formed on the second surface, and the position of the first welding pattern corresponds to that of the second welding pattern. The type of the first welding pattern and the type of the second welding pattern are asymmetric.
    Type: Application
    Filed: July 17, 2023
    Publication date: January 18, 2024
    Inventors: Shih-Lin HUANG, Tai-De QI, Zhen-Hua LI
  • Publication number: 20240011719
    Abstract: A heat pipe comprises a flat tube and a wick structure. The flat tube includes a hollow chamber and has a front and a rear sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the flat tube. The wick structure is divided into a front, a middle and a rear sections sequentially along the axial direction. The front section is near the front sealed end, the rear section is near the rear sealed end. The front, middle and rear sections have a maximum length parallel to the width direction, respectively. The maximum length of the front section is greater than that of the middle section, and the maximum length of the middle section is greater than that of the rear section.
    Type: Application
    Filed: September 20, 2023
    Publication date: January 11, 2024
    Inventors: Shih-Lin HUANG, Chiu-Kung CHEN, Sheng-Hua LUO, Ti-Jun WANG
  • Publication number: 20230339053
    Abstract: A vapor chamber with a support structure is provided. The vapor chamber with the support structure includes a first plate, a second plate spaced apart from the first plate, and multiple support elements fixed between the first and second plates. On an outer surface of any of the first plate or the second plate, laser welding is performed on positions corresponding to the support elements so as to join the support elements to the first and second plates and to form weld ports on the outer surface of any of the plates. The invention solves the problem of fixing the support structure inside the thin vapor chamber, and therefore mass production can be realized.
    Type: Application
    Filed: June 27, 2023
    Publication date: October 26, 2023
    Inventors: Shih-Lin HUANG, Sien WU, Baoxun HE, Ti-Jun WANG
  • Patent number: 11796259
    Abstract: A heat pipe comprises a flat tube and a wick structure. The flat tube includes a hollow chamber and has a front and a rear sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the flat tube. The wick structure is divided into a front, a middle and a rear sections sequentially along the axial direction. The front section is near the front sealed end, the rear section is near the rear sealed end. The front, middle and rear sections have a maximum length parallel to the width direction, respectively, the maximum length of the middle section is greater than that of the front section and that of the rear section so as to be used as the evaporator of the heat pipe.
    Type: Grant
    Filed: January 12, 2023
    Date of Patent: October 24, 2023
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shih-Lin Huang, Chiu-Kung Chen, Sheng-Hua Luo, Ti-Jun Wang
  • Patent number: 11731220
    Abstract: A vapor chamber with a support structure and its manufacturing method are provided. The vapor chamber with the support structure includes a first plate, a second plate spaced apart from the first plate, and multiple support elements fixed between the first and second plates. On an outer surface of any of the first plate or the second plate, laser welding is performed on positions corresponding to the support elements so as to join the support elements to the first and second plates and to form weld ports on the outer surface of any of the plates. The invention solves the problem of fixing the support structure inside the thin vapor chamber, and therefore mass production can be realized.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: August 22, 2023
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shih-Lin Huang, Sien Wu, Baoxun He, Ti-Jun Wang
  • Publication number: 20230168046
    Abstract: A heat pipe comprises a flat tube and a wick structure. The flat tube includes a hollow chamber and has a front and a rear sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the flat tube. The wick structure is divided into a front, a middle and a rear sections sequentially along the axial direction. The front section is near the front sealed end, the rear section is near the rear sealed end. The front, middle and rear sections have a maximum length parallel to the width direction, respectively, the maximum length of the middle section is greater than that of the front section and that of the rear section so as to be used as the evaporator of the heat pipe.
    Type: Application
    Filed: January 12, 2023
    Publication date: June 1, 2023
    Inventors: Shih-Lin HUANG, Chiu-Kung CHEN, Sheng-Hua LUO, Ti-Jun WANG
  • Patent number: 11598585
    Abstract: A heat pipe comprises a tube and a wick structure. The tube includes a hollow chamber and has two sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the tube. The wick structure has a first section near one of the sealed ends, a third section near the other of the sealed ends, and a second section between the first and third sections. The wick structure is composed of the first, the second and the third sections, and cross-sections of the first section, the second section and the third section in the axial direction are rectangles, respectively. A cross-sectional area of the first section is greater than that of the second and that of third section. The edge of each of the sections of the wick structure has a smooth form without the sectional difference.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: March 7, 2023
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shih-Lin Huang, Chiu-Kung Chen, Sheng-Hua Luo, Ti-Jun Wang
  • Publication number: 20230021686
    Abstract: An internal structure of vapor chamber is provided. A first plate has an inner surface. A periphery of the first plate has a sealing edge extending outwardly; a level difference exists between the first plate and the sealing edge. Multiple supporting protrusions are formed on the inner surface of the first plate. A second plate has an inner surface spaced apart from the inner surface of the first plate. The brazing structure has a sealing portion and connecting portions, the sealing portion is fixed between the second plate and the sealing edges of the first plate, and the connecting portions are respectively disposed between the corresponding supporting portions of the first plate and of the second plate. The sealing portion is disposed around a periphery of the second plate to align and contact with the sealing edge.
    Type: Application
    Filed: October 4, 2022
    Publication date: January 26, 2023
    Inventors: Shih-Lin HUANG, Wen-Shiang CHEN, Shu-Cheng YANG
  • Patent number: 11561050
    Abstract: A slim vapor chamber includes a first plate, a second plate and a capillary structure. The periphery of the second plate is connected with that of the first plate to form a chamber. The capillary structure is disposed on an inner wall of the chamber. Both of a side of the first plate facing the second plate and a side of the second plate facing the first plate are formed with a plurality of supporting structures, which include a plurality of supporting pillars and a plurality of supporting plates, by an etching process.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: January 24, 2023
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shih-Lin Huang, Ting-Yuan Wu, Chiu-Kung Chen, Chun-Lung Chiu
  • Publication number: 20230016265
    Abstract: A PSMA-specific agent comprising a compound according to Formula I or Formula II: wherein S1 is absent or is an organic spacer group comprising 3-10 carbons; A is an amino acid chain comprising 1 to 5 amino acids wherein at least one of the amino acids is selected from glutamic acid and aspartic acid; S2 is absent or is an organic spacer group comprising 1 to 15 carbons and/or 0 to 2 amino acids; I1 is an imaging group; and I2 is absent or is an imaging group. The PSMA-specific agents can be used to image PSMA within a tissue region and/or for the treatment of a cancer, such as prostate cancer.
    Type: Application
    Filed: October 28, 2020
    Publication date: January 19, 2023
    Inventor: Steve Shih-lin Huang
  • Publication number: 20220390185
    Abstract: A heat pipe comprises a first pipe and at least a second pipe. The first pipe includes an evaporator, a heat insulator and a condenser communicating with each other to define a hollow chamber. The second pipe disposed in the hollow chamber includes an accommodating space and a first capillary structure disposed in one end of the accommodating space closer to the evaporator. At least one side of an outer pipe wall of the second pipe directly abuts an inner pipe wall of the first pipe. The first pipe further includes a second capillary structure disposed in the hollow chamber closer to the evaporator and extended to an outside of the second pipe and occupies at least 2/3 volume of the evaporator. A first part of the first capillary structure and the second capillary structure are connected to each other by winding so as to enhance transportation therebetween.
    Type: Application
    Filed: August 17, 2022
    Publication date: December 8, 2022
    Inventors: Shih-Lin HUANG, Chiu-Kung CHEN
  • Patent number: 11454456
    Abstract: A heat pipe comprises a first pipe and at least a second pipe. The first pipe includes an evaporator, a heat insulator and a condenser communicating with each other to define a hollow chamber. The second pipe disposed in the hollow chamber includes an accommodating space and a first capillary structure disposed in one end of the accommodating space closer to the evaporator. Two opposite sides of an outer pipe wall of the second pipe directly abut an inner pipe wall of the first pipe. The first pipe further includes a second capillary structure which is disposed in the hollow chamber closer to the evaporator and extended to an outside of the second pipe and occupies at least ? volume of the evaporator. A first part of the first capillary structure and the second capillary structure are connected to each other by winding so as to enhance transportation therebetween.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: September 27, 2022
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shih-Lin Huang, Chiu-Kung Chen