Abstract: Structures with doping free connections and methods of fabrication are provided. An exemplary structure includes a substrate; a first region of a first conductivity type formed in the substrate; an overlying layer located over the substrate; a well region of a second conductivity type formed in the overlying layer; a conductive plug laterally adjacent to the well region and extending through the overlying layer to electrically contact with the first region; and a passivation layer located between the conductive plug and the well region.

Abstract: A device includes a fin extending from a substrate, a gate stack over and along sidewalls of the fin, a gate spacer along a sidewall of the gate stack, and an epitaxial source/drain region in the fin and adjacent the gate spacer. The epitaxial source/drain region includes a first epitaxial layer on the fin, the first epitaxial layer including silicon, germanium, and arsenic, and a second epitaxial layer on the first epitaxial layer, the second epitaxial layer including silicon and phosphorus, the first epitaxial layer separating the second epitaxial layer from the fin. The epitaxial source/drain region further includes a third epitaxial layer on the second epitaxial layer, the third epitaxial layer including silicon, germanium, and phosphorus.

Abstract: The present invention discloses a metal-free perovskite film and metal-free perovskite piezoelectric nanogenerators comprising the film. The metal-free perovskite film is organic, lead-free and metal-free. The open-circuit voltage of the metal-free perovskite piezoelectric nanogenerators can reach 9˜16 V and the short-circuit current of the metal-free perovskite piezoelectric nanogenerators can reach 38˜55 nA. Also, the metal-free perovskite piezoelectric nanogenerators can be used as self-powered strain sensor of human-machine interface application and be adopted in in vitro electrical stimulation devices.

Abstract: In some embodiments, the present disclosure relates to a single-photon avalanche detector (SPAD) device including a silicon substrate including a recess in an upper surface of the silicon substrate. A p-type region is arranged in the silicon substrate below a lower surface of the recess. An n-type avalanche region is arranged in the silicon substrate below the p-type region and meets the p-type region at a p-n junction. A germanium region is disposed within the recess over the p-n junction.

Abstract: The present invention provides diagnostic and therapeutic methods and compositions for cancer. The invention provides methods of determining whether a patient having a cancer is likely to respond to treatment comprising a MAPK signaling inhibitor, methods of predicting responsiveness of a patient having a cancer to treatment comprising one or more MAPK signaling inhibitors, methods of selecting a therapy for a patient having a cancer, and methods of treating cancer based on expression levels of biomarkers of the invention (e.g., the expression levels of DUSP6, ETV4, SPRY2, SPRY4, PHLDA1, ETV5, DUSP4, CCND1, EPHA2, and EPHA4).

Abstract: A balanced folding/unfolding device includes a top housing having a first string hole and a second string hole. A reverse winding portion and forward winding portion are mounted in the top housing. A vortex spring unit is mounted in the top housing and includes a first spring mechanism directly or indirectly connected to a first end of a first driving string and a first end of a second driving string. The first driving string and the second driving string extend in the same function. A second end of the first driving string extends around the forward winding portion and then passes downwards through the first cord hole for connection with a shade unit of a window shade without a pull cord. A second end of the second driving string extends around the reverse winding portion and then passes downwards through the second cord hole for connection with the shade unit.

Abstract: A decoration film, a decorated molded device, and a decoration molding process are provided. The decoration film includes a carrier layer; a releasing layer disposed on the carrier layer; a protection layer, wherein the releasing layer is located between the protection layer and the carrier layer; a decoration pattern layer disposed on the carrier layer; an impact resisting layer disposed on the carrier layer; an adhesion layer disposed on the carrier layer, wherein the total film thickness of the adhesion layer and the impact resisting layer is 2 ?m to 20 ?m and the impact resisting layer and the decoration pattern layer are located between the protection and the adhesion layer.

Abstract: A curing process for curing a decorated article is provided. The decorated article includes a substrate, an adhesion layer and a pattern layer disposed on the substrate, sequentially. Processing conditions of the curing process include the following: a temperature ranged between 50° C. to 180° C., a relative humidity ranged between 30% to 100%, and a processing time ranged between 6 hours to 72 hours. A decorated article and a method for manufacturing the decorated article are also provided. The method for manufacturing the decorated article includes bonding a decoration film onto a substrate, and curing the decoration film and the substrate with the curing process. The decorated article is manufactured with the method for manufacturing the decorated article.

Abstract: Decoration films and manufacturing methods for decorated articles are provided. One of the decoration films includes a substrate, a releasing layer formed on the substrate, an ink layer formed on whole surface of the releasing layer, and a first adhesive layer formed on part surface of the ink layer. Another one of the decoration films includes a substrate, a releasing layer formed on the substrate, and an adhesive ink layer formed on part surface of the releasing layer.

Abstract: A decoration film, a method of fabricating a decoration film, and a method of fabricating a decoration device are provided. The decoration film includes a substrate and a relief pattern layer disposed on the substrate. The relief pattern layer has a relief surface away from the substrate and includes a decoration relief portion and a marker relief portion located around the decoration relief portion, wherein the relief pattern layer is remained on the substrate after the decoration process.

Abstract: An abrasion-resistant transfer printing structure to transfer patterns and texts to a targeted object surface by press printing includes a hardened protecting layer and a release base layer. The hardened protection layer includes a first surface and a second surface. The first surface allows a transfer printing glue to be bonded to the targeted object to cover at least an area corresponding to the patterns and texts. The release base layer is located on the second surface of the hardened protection layer by a releasable manner and can be separated from the hardened protection layer by applying a release force after the press printing process is finished. Thus the hardened protection layer is exposed to isolate the patterns and texts from in contact with the exterior. The surface of the targeted object also is abrasion resistant.

Abstract: A decoration film, a decoration device and a method for manufacturing a decoration device are provided. The decoration film includes a substrate, a releasing layer, a pattern layer and an adhesion layer. The releasing layer is disposed on the substrate. The pattern layer is disposed on the releasing layer at a side far from the substrate. The adhesion layer is disposed on a portion of the pattern layer.

Abstract: The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector, and is electrically connected to the first surface and the second surface. The first surface and the second surface are electrically connected to at least a first chip and a second chip respectively. In addition, the first chip and the second chip are electrically connected by the through via.

Abstract: A decoration film is provided. The decoration film includes a flexible substrate, a first electrode layer disposed on the flexible substrate, a polymer photoelectric conversion layer disposed on the first electrode layer, a second electrode layer disposed on the polymer photoelectric conversion layer, and an adhesion layer disposed on the second electrode layer. The polymer photoelectric conversion layer is located between the first electrode layer and the second electrode layer. At least one of the first electrode layer and the second electrode layer is a transparent conductive layer. The first electrode layer, the polymer photoelectric conversion layer, and the second electrode layer are located between the adhesion layer and the flexible substrate.

Abstract: The present application describes methods of regulating or modulating (e.g., antagonizing or inhibiting) Wnt signaling by administering Axin stabilizers. The application also describes methods of using Axin stabilizers described herein for the treatment, diagnosis, prevention, and/or amelioration of Wnt signaling-related disorders.

Abstract: This invention relates to an object having a functional element embedded in its top surface and processes for its manufacturing. The object is in general formed by molding, stamping, lamination or a combination thereof. The functional element is includes any electrical or mechanical elements that are capable of performing a function.

Abstract: An abrasion-resistant transfer printing structure to transfer patterns and texts to a targeted object surface by press printing includes a hardened protecting layer and a release base layer. The hardened protection layer includes a first surface and a second surface. The first surface allows a transfer printing glue to be bonded to the targeted object to cover at least an area corresponding to the patterns and texts. The release base layer is located on the second surface of the hardened protection layer by a releasable manner and can be separated from the hardened protection layer by applying a release force after the press printing process is finished. Thus the hardened protection layer is exposed to isolate the patterns and texts from in contact with the exterior. The surface of the targeted object also is abrasion resistant.

Abstract: The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector, and is electrically connected to the first surface and the second surface. The first surface and the second surface are electrically connected to at least a first chip and a second chip respectively. In addition, the first chip and the second chip are electrically connected by the through via.

Abstract: A method of edge bevel rinse. First, a wafer having a coating material layer disposed thereon is provided. A light beam is optically projected on the wafer to form a reference pattern. The reference pattern defines a central region, and a bevel region surrounding the central region on the surface of the wafer. Subsequently, the coating material layer positioned in the bevel region is removed according to the reference pattern.