Patents by Inventor Shih-Ping Wang

Shih-Ping Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12243948
    Abstract: Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as pillars and/or holes, effectively increase the effective absorption length resulting in a greater absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more.
    Type: Grant
    Filed: September 3, 2024
    Date of Patent: March 4, 2025
    Assignee: W&W Sens Devices, Inc.
    Inventors: Shih-Yuan Wang, Shih-Ping Wang
  • Patent number: 12204163
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: February 5, 2024
    Date of Patent: January 21, 2025
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Publication number: 20250017968
    Abstract: The present disclosure relates to an antibody or antigen-binding fragment thereof that is specific to ephrin type-A receptor 10 (EphA10) and a fusion protein containing the antibody or antigen-binding fragment thereof. The present disclosure also relates to a pharmaceutical composition, a method for treating and/or preventing diseases and/or disorders caused by EphA10 in a subject in need, and a method for detecting EphA10 in a sample.
    Type: Application
    Filed: November 22, 2022
    Publication date: January 16, 2025
    Inventors: Long-Bin JENG, Shih-Ping LIU, Chie-Hong WANG
  • Publication number: 20240429332
    Abstract: Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as pillars and/or holes, effectively increase the effective absorption length resulting in a greater absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more.
    Type: Application
    Filed: September 3, 2024
    Publication date: December 26, 2024
    Inventors: Shih-Yuan WANG, Shih-Ping WANG
  • Patent number: 12094903
    Abstract: Microstructure enhanced photodector arrangements uses a CMOS image sensor (CIS) wafer of crystalline Si and a CMOS Logic Processor (CLP) wafer stacked on each other for electrical interaction. The wafers can be fabricated separately and stacked or can be regions of the same monolithic chip. The image can be a time-of-flight image. Bayer arrays are enhanced with microstructure holes. Avalanche photodiodes, single photon avalanche photodiodes and phototransistors can be laterally and/or vertically doped. Photodetectors/photosensors can have slanted sidewalls for improved optical confinement and reduced crosstalk.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: September 17, 2024
    Assignee: W&W SENS DEVICES, INC
    Inventors: Shih-Yuan Wang, Shih-Ping Wang
  • Patent number: 12087871
    Abstract: Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as pillars and/or holes, effectively increase the effective absorption length resulting in a greater absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more.
    Type: Grant
    Filed: October 30, 2023
    Date of Patent: September 10, 2024
    Assignee: W&W Sens Devices, Inc.
    Inventors: Shih-Yuan Wang, Shih-Ping Wang
  • Patent number: 11980342
    Abstract: An endoscope in which a reusable part is inserted into a sheath of a single-use portion that includes a needle with an imaging module at its tip and a part of the reusable portion that is not covered by the sheath is covered with a flexible cap that initially was sterile and covered the open end of the sheath, whereby the entire reusable portion is covered and sealed from the environment by the cap and the sheath during a medical procedure.
    Type: Grant
    Filed: November 8, 2021
    Date of Patent: May 14, 2024
    Assignee: MicronVision Corp.
    Inventors: Xiaolong OuYang, Shih-Ping Wang
  • Patent number: 11944267
    Abstract: An endoscopic system includes an integrated grasper device passing through a device lumen in the cannula. The grasper device has distal end forming two jaw portions that are biased to remain in an open position if unconstrained. The grasper has arch shaped portions that push against the inner surface of the device lumen when the grasper is retracted. To close the jaws of the grasper the grasper is retracted proximally until the arch shaped portions engage the opening of the device lumen. Further retraction causes the grasper jaws to close through engagement with the device lumen inner surface. The endoscopy system can include a single-use, removable cannula having a camera module on its distal tip. A re-usable portion can include the hand piece and display screen.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: April 2, 2024
    Assignee: UroViu Corp.
    Inventors: Xiaolong Ouyang, Shih-Ping Wang
  • Publication number: 20240063317
    Abstract: Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as pillars and/or holes, effectively increase the effective absorption length resulting in a greater absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more.
    Type: Application
    Filed: October 30, 2023
    Publication date: February 22, 2024
    Inventors: Shih-Yuan WANG, Shih-Ping WANG
  • Patent number: 11844498
    Abstract: A handheld surgical endoscope has a disposable, single-use handle, cannula and an imaging module at a distal tip. A multiple-use display unit is removably mounted on and supported by the handle and includes a touch-sensitive display screen configured to respond to touch commands to control taking of images with the imaging module and further configured to display the images. The display unit and the handle include respective mechanical connectors that engage each other to removably mount the display unit on the handle by sliding motion relative to each other, and the display unit is removable tool-free from said handle for disposal of the handle and cannula after a medical procedure therewith.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: December 19, 2023
    Assignee: UroViu Corporation
    Inventors: Xiaolong Ouyang, Shih-Ping Wang, Robert K. Deckman
  • Patent number: 11830954
    Abstract: Microstructures of micro and/or nano holes on one or more surfaces enhance photodetector optical sensitivity. Arrangements such as a CMOS Image Sensor (CIS) as an imaging LIDAR using a high speed photodetector array wafer of Si, Ge, a Ge alloy on SI and/or Si on Ge on Si, and a wafer of CMOS Logic Processor (CLP) ib Si fi signal amplification, processing and/or transmission can be stacked for electrical interaction. The wafers can be fabricated separately and then stacked or can be regions of the same monolithic chip. The image can be a time-of-flight image. Bayer arrays can be enhanced with microstructure holes. Pixels can be photodiodes, avalanche photodiodes, single photon avalanche photodiodes and phototransistors on the same array and can be Ge or Si pixels. The array can be of high speed photodetectors with data rates of 56 Gigabits per second, Gbps, or more per photodetector.
    Type: Grant
    Filed: October 26, 2022
    Date of Patent: November 28, 2023
    Assignee: W&WSens Devices Inc.
    Inventors: Shih-Yuan Wang, Shih-Ping Wang
  • Publication number: 20230346343
    Abstract: A method and apparatus for acquisition of volumetric breast images for screening and/or diagnosing breast cancers using a rotary scanning template and transducer.
    Type: Application
    Filed: April 28, 2021
    Publication date: November 2, 2023
    Inventor: Shih-Ping WANG
  • Publication number: 20230354620
    Abstract: Resistive RAM (RRAM) devices having increased reliability and related manufacturing methods are described in combination with stacked technology with CMOS ASIC wafters. Greater reliability of RRAM cells over time can be achieved by avoiding direct contact of metal electrodes with the device switching layer. Stacking technology can be used to address incompatibility of ReRAM processing and CMOS ASICs processing.
    Type: Application
    Filed: September 13, 2021
    Publication date: November 2, 2023
    Inventors: Shih-Yuan WANG, Shih-Ping WANG
  • Publication number: 20230329525
    Abstract: An endoscope in which a reusable portion is inserted nearly all the way into a hollow, pistol-grip handle of a single-use portion and the protruding part of the reusable portion and an adjacent part of the handle are covered with a flexible and resilient cap. The same cap covers the open end of the handle when the single-use portion is shipped from a manufacturing site. At a user's facility, a health professional tears the pouch, removes the cap from the handle, inserts the reusable portion, and covers the distal end of the reusable portion and an adjacent part of the handle with the same cap. Typically, a remote display connects to the endoscope wirelessly or through a cable, with a connector that fits through a hole in the cap configured to keep fluids from entering around the connector. The wireless transmission preferably uses a proprietary protocol to preserve medical data confidentiality.
    Type: Application
    Filed: June 21, 2023
    Publication date: October 19, 2023
    Inventors: Xiaolong OuYang, Shih-Ping Wang
  • Publication number: 20230329524
    Abstract: An endoscope in which a reusable portion is inserted nearly all the way into a hollow, pistol-grip handle of a single-use portion and the protruding part of the reusable portion and an adjacent part of the handle are covered with a flexible and resilient cap. The same cap covers the open end of the handle when the single-use portion is shipped from a manufacturing site. At a user's facility, a health professional tears the pouch, removes the cap from the handle, inserts the reusable portion, and covers the distal end of the reusable portion and an adjacent part of the handle with the same cap. Typically, a remote display connects to the endoscope wirelessly or through a cable, with a connector that fits through a hole in the cap configured to keep fluids from entering around the connector. The wireless transmission preferably uses a proprietary protocol to preserve medical data confidentiality.
    Type: Application
    Filed: April 13, 2022
    Publication date: October 19, 2023
    Inventors: Xiaolong OUYANG, Shih-Ping Wang
  • Patent number: 11791432
    Abstract: Lateral and vertical microstructure enhanced photodetectors and avalanche photodetectors are monolithically integrated with CMOS/BiCMOS ASICs and can also be integrated with laser devices using fluidic assembly techniques. Photodetectors can be configured in a vertical PIN arrangement or lateral metal-semiconductor-metal arrangement where electrodes are in an inter-digitated pattern. Microstructures, such as holes and protrusions, can improve quantum efficiency in silicon, germanium and III-V materials and can also reduce avalanche voltages for avalanche photodiodes. Applications include optical communications within and between datacenters, telecommunications, LIDAR, and free space data communication.
    Type: Grant
    Filed: February 23, 2021
    Date of Patent: October 17, 2023
    Assignee: W&WSens Devices, Inc.
    Inventors: Shih-Yuan Wang, Shih-Ping Wang
  • Publication number: 20230320573
    Abstract: A handheld endoscope has a disposable, single-use portion that includes a fluid hub, cannula, distal tip and is steerable by the operator though actuation of one or two levers. The endoscope also includes multiple-use portion that has a handle and display module. The distal tip includes LED illumination and an imaging module that feeds live video to the display module that is rotatable to allow viewing by the operator and others. The single-use and multiple-use portions mate and un-mate with each other via physically separated mechanical and electrical connectors. The component of the endoscope can be supplied to users in different combinations of pre-assembled configurations, some in a sterile package. The single use portion can include grasper device that can be actuated by an operator using an actuation tab.
    Type: Application
    Filed: June 14, 2023
    Publication date: October 12, 2023
    Inventors: Xiaolong Ouyang, Chih-Yu TING, Shih-Ping WANG
  • Patent number: 11771304
    Abstract: An endoscope in which a reusable portion is inserted nearly all the way into a hollow, pistol-grip handle of a single-use portion and the protruding part of the reusable portion and an adjacent part of the handle are covered with a flexible and resilient cap. The same cap covers the open end of the handle when the single-use portion is shipped from a manufacturing site. At a user's facility, a health professional tears the pouch, removes the cap from the handle, inserts the reusable portion, and covers the distal end of the reusable portion and an adjacent part of the handle with the same cap. Typically, a remote display connects to the endoscope wirelessly or through a cable, with a connector that fits through a hole in the cap configured to keep fluids from entering around the connector. The wireless transmission preferably uses a proprietary protocol to preserve medical data confidentiality.
    Type: Grant
    Filed: April 13, 2022
    Date of Patent: October 3, 2023
    Assignee: MicronVision Corp.
    Inventors: Xiaolong OuYang, Shih-Ping Wang
  • Publication number: 20230215962
    Abstract: Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as pillars and/or holes, effectively increase the effective absorption length resulting in a greater absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more.
    Type: Application
    Filed: February 23, 2023
    Publication date: July 6, 2023
    Inventors: Shih-Yuan WANG, Shih-Ping WANG
  • Patent number: 11684248
    Abstract: A medical endoscopy/stereo colposcopy instrument is configured to selectively take stereo colposcopy images of a patient's uterus and endoscopy images of the patient's bladder or uterus. Any of the images can be white light images or images for a selected narrow wavelength band or fluorescence images. The images can be displayed individually or as spatially registered composite images to highlight selected features of the imaged anatomy. A cup-shaped device can be positioned at the patient's cervix and provided with a light source and a fluorescence camera module to monitor changes in fluorescence in response to a photoactivated substance.
    Type: Grant
    Filed: June 8, 2022
    Date of Patent: June 27, 2023
    Assignee: MicronVision Corp.
    Inventors: Xiaolong Ouyang, James Ouyang, Diana Ouyang, Shih-Ping Wang