Abstract: Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as pillars and/or holes, effectively increase the effective absorption length resulting in a greater absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more.

Abstract: Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as pillars and/or holes, effectively increase the effective absorption length resulting in a greater absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more.

Abstract: Microstructure enhanced photodector arrangements uses a CMOS image sensor (CIS) wafer of crystalline Si and a CMOS Logic Processor (CLP) wafer stacked on each other for electrical interaction. The wafers can be fabricated separately and stacked or can be regions of the same monolithic chip. The image can be a time-of-flight image. Bayer arrays are enhanced with microstructure holes. Avalanche photodiodes, single photon avalanche photodiodes and phototransistors can be laterally and/or vertically doped. Photodetectors/photosensors can have slanted sidewalls for improved optical confinement and reduced crosstalk.

Abstract: Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as pillars and/or holes, effectively increase the effective absorption length resulting in a greater absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more.

Abstract: An endoscope in which a reusable part is inserted into a sheath of a single-use portion that includes a needle with an imaging module at its tip and a part of the reusable portion that is not covered by the sheath is covered with a flexible cap that initially was sterile and covered the open end of the sheath, whereby the entire reusable portion is covered and sealed from the environment by the cap and the sheath during a medical procedure.

Abstract: An endoscopic system includes an integrated grasper device passing through a device lumen in the cannula. The grasper device has distal end forming two jaw portions that are biased to remain in an open position if unconstrained. The grasper has arch shaped portions that push against the inner surface of the device lumen when the grasper is retracted. To close the jaws of the grasper the grasper is retracted proximally until the arch shaped portions engage the opening of the device lumen. Further retraction causes the grasper jaws to close through engagement with the device lumen inner surface. The endoscopy system can include a single-use, removable cannula having a camera module on its distal tip. A re-usable portion can include the hand piece and display screen.

Abstract: Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as pillars and/or holes, effectively increase the effective absorption length resulting in a greater absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more.

Abstract: A handheld surgical endoscope has a disposable, single-use handle, cannula and an imaging module at a distal tip. A multiple-use display unit is removably mounted on and supported by the handle and includes a touch-sensitive display screen configured to respond to touch commands to control taking of images with the imaging module and further configured to display the images. The display unit and the handle include respective mechanical connectors that engage each other to removably mount the display unit on the handle by sliding motion relative to each other, and the display unit is removable tool-free from said handle for disposal of the handle and cannula after a medical procedure therewith.

Abstract: Microstructures of micro and/or nano holes on one or more surfaces enhance photodetector optical sensitivity. Arrangements such as a CMOS Image Sensor (CIS) as an imaging LIDAR using a high speed photodetector array wafer of Si, Ge, a Ge alloy on SI and/or Si on Ge on Si, and a wafer of CMOS Logic Processor (CLP) ib Si fi signal amplification, processing and/or transmission can be stacked for electrical interaction. The wafers can be fabricated separately and then stacked or can be regions of the same monolithic chip. The image can be a time-of-flight image. Bayer arrays can be enhanced with microstructure holes. Pixels can be photodiodes, avalanche photodiodes, single photon avalanche photodiodes and phototransistors on the same array and can be Ge or Si pixels. The array can be of high speed photodetectors with data rates of 56 Gigabits per second, Gbps, or more per photodetector.

Abstract: A method and apparatus for acquisition of volumetric breast images for screening and/or diagnosing breast cancers using a rotary scanning template and transducer.

Abstract: Resistive RAM (RRAM) devices having increased reliability and related manufacturing methods are described in combination with stacked technology with CMOS ASIC wafters. Greater reliability of RRAM cells over time can be achieved by avoiding direct contact of metal electrodes with the device switching layer. Stacking technology can be used to address incompatibility of ReRAM processing and CMOS ASICs processing.

Abstract: An endoscope in which a reusable portion is inserted nearly all the way into a hollow, pistol-grip handle of a single-use portion and the protruding part of the reusable portion and an adjacent part of the handle are covered with a flexible and resilient cap. The same cap covers the open end of the handle when the single-use portion is shipped from a manufacturing site. At a user's facility, a health professional tears the pouch, removes the cap from the handle, inserts the reusable portion, and covers the distal end of the reusable portion and an adjacent part of the handle with the same cap. Typically, a remote display connects to the endoscope wirelessly or through a cable, with a connector that fits through a hole in the cap configured to keep fluids from entering around the connector. The wireless transmission preferably uses a proprietary protocol to preserve medical data confidentiality.

Abstract: An endoscope in which a reusable portion is inserted nearly all the way into a hollow, pistol-grip handle of a single-use portion and the protruding part of the reusable portion and an adjacent part of the handle are covered with a flexible and resilient cap. The same cap covers the open end of the handle when the single-use portion is shipped from a manufacturing site. At a user's facility, a health professional tears the pouch, removes the cap from the handle, inserts the reusable portion, and covers the distal end of the reusable portion and an adjacent part of the handle with the same cap. Typically, a remote display connects to the endoscope wirelessly or through a cable, with a connector that fits through a hole in the cap configured to keep fluids from entering around the connector. The wireless transmission preferably uses a proprietary protocol to preserve medical data confidentiality.

Abstract: Lateral and vertical microstructure enhanced photodetectors and avalanche photodetectors are monolithically integrated with CMOS/BiCMOS ASICs and can also be integrated with laser devices using fluidic assembly techniques. Photodetectors can be configured in a vertical PIN arrangement or lateral metal-semiconductor-metal arrangement where electrodes are in an inter-digitated pattern. Microstructures, such as holes and protrusions, can improve quantum efficiency in silicon, germanium and III-V materials and can also reduce avalanche voltages for avalanche photodiodes. Applications include optical communications within and between datacenters, telecommunications, LIDAR, and free space data communication.

Abstract: A handheld endoscope has a disposable, single-use portion that includes a fluid hub, cannula, distal tip and is steerable by the operator though actuation of one or two levers. The endoscope also includes multiple-use portion that has a handle and display module. The distal tip includes LED illumination and an imaging module that feeds live video to the display module that is rotatable to allow viewing by the operator and others. The single-use and multiple-use portions mate and un-mate with each other via physically separated mechanical and electrical connectors. The component of the endoscope can be supplied to users in different combinations of pre-assembled configurations, some in a sterile package. The single use portion can include grasper device that can be actuated by an operator using an actuation tab.

Abstract: An endoscope in which a reusable portion is inserted nearly all the way into a hollow, pistol-grip handle of a single-use portion and the protruding part of the reusable portion and an adjacent part of the handle are covered with a flexible and resilient cap. The same cap covers the open end of the handle when the single-use portion is shipped from a manufacturing site. At a user's facility, a health professional tears the pouch, removes the cap from the handle, inserts the reusable portion, and covers the distal end of the reusable portion and an adjacent part of the handle with the same cap. Typically, a remote display connects to the endoscope wirelessly or through a cable, with a connector that fits through a hole in the cap configured to keep fluids from entering around the connector. The wireless transmission preferably uses a proprietary protocol to preserve medical data confidentiality.

Abstract: Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as pillars and/or holes, effectively increase the effective absorption length resulting in a greater absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more.

Abstract: A medical endoscopy/stereo colposcopy instrument is configured to selectively take stereo colposcopy images of a patient's uterus and endoscopy images of the patient's bladder or uterus. Any of the images can be white light images or images for a selected narrow wavelength band or fluorescence images. The images can be displayed individually or as spatially registered composite images to highlight selected features of the imaged anatomy. A cup-shaped device can be positioned at the patient's cervix and provided with a light source and a fluorescence camera module to monitor changes in fluorescence in response to a photoactivated substance.

Abstract: A compact, hand-held, robotic assisted endoscopic system configured to derive the position and/or orientation CamPose of a distal part of a single-use portion relative to coordinates HandPose of a reusable portion of an endoscope and display juxtaposed images of an object such a patient's organ being diagnosed or treated in a medical procedure with the endoscope and the distal part of the endoscope, and to provide guidance to the system user with display of images such as prior images of the object, standardized images of the object of tutorial images related to the medical procedure.

Abstract: Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as pillars and/or holes, effectively increase the effective absorption length resulting in a greater absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more.