Abstract: A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a first component, a second component, and a protective element. The first component and the second component are arranged side by side in a first direction over the carrier. The protective element is disposed over a top surface of the carrier and extending from space under the first component toward a space under the second component. The protective element includes a first portion and a second portion protruded oppositely from edges of the first component by different distances, and the first portion and the second portion are arranged in a second direction angled with the first direction.

Abstract: Among other things, techniques are described for receiving, from at least one sensor of a vehicle, a sensor measurement indicative of at least one of a sound or a vibration associated with a road element; identifying the road element based on a pattern in the sensor measurement; determining, based on the road element, a vehicle behavior for the vehicle; and controlling the vehicle to operate according to vehicle behavior.

Abstract: An electronic device includes a substrate, a transistor, and a ring resonator. The transistor is over the substrate. The ring resonator is over the substrate and overlaps with the transistor. The ring resonator includes a conductive loop and an impedance matching element. The conductive loop includes a loop portion having two first parts and a second part and two feeding lines. Each of the first parts of the loop portion is between the second part of the loop portion and one of the feeding lines, and a tunnel barrier of the transistor is closer to the second part than to the feeding lines. The impedance matching element is closer to the feeding lines than to the second part.

Abstract: An apparatus for buffing a shoe part includes a housing adapted to be articulated around at least a portion of the footwear part. A rotating spindle is positioned in the housing and has a buffing surface for engagement with the footwear part. A carriage is slideably connected to the housing and holds the spindle such that the buffing surface can be moved closer to and further away from the footwear part. An actuator is in the housing and in contact with the carriage. The actuator applies force to the carriage to increase the force of the buffing surface onto the footwear part. A biasing member is in the housing and in contact with the carriage. The biasing member exerts force onto the carriage in a direction opposite the force exerted by the actuator.

Abstract: Microstructures of micro and/or nano holes on one or more surfaces enhance photodetector optical sensitivity. Arrangements such as a CMOS Image Sensor (CIS) as an imaging LIDAR using a high speed photodetector array wafer of Si, Ge, a Ge alloy on SI and/or Si on Ge on Si, and a wafer of CMOS Logic Processor (CLP) ib Si fi signal amplification, processing and/or transmission can be stacked for electrical interaction. The wafers can be fabricated separately and then stacked or can be regions of the same monolithic chip. The image can be a time-of-flight image. Bayer arrays can be enhanced with microstructure holes. Pixels can be photodiodes, avalanche photodiodes, single photon avalanche photodiodes and phototransistors on the same array and can be Ge or Si pixels. The array can be of high speed photodetectors with data rates of 56 Gigabits per second, Gbps, or more per photodetector.

Abstract: Resistive RAM (RRAM) devices having increased reliability and related manufacturing methods are described in combination with stacked technology with CMOS ASIC wafters. Greater reliability of RRAM cells over time can be achieved by avoiding direct contact of metal electrodes with the device switching layer. Stacking technology can be used to address incompatibility of ReRAM processing and CMOS ASICs processing.

Abstract: A method for overlay error correction includes generating a first overlay error based on a first overlay mark, wherein the first overlay error is indicative of a misalignment between a lower pattern and an upper pattern of the first overlay mark. The method also includes generating a second overlay error based on a second overlay mark, in response to an abnormal of the first overlay error is detected. The method further includes determining whether the abnormal of the first overlay error is caused by the misalignment between the lower pattern and the upper pattern depending on the second overlay error.

Abstract: Lateral and vertical microstructure enhanced photodetectors and avalanche photodetectors are monolithically integrated with CMOS/BiCMOS ASICs and can also be integrated with laser devices using fluidic assembly techniques. Photodetectors can be configured in a vertical PIN arrangement or lateral metal-semiconductor-metal arrangement where electrodes are in an inter-digitated pattern. Microstructures, such as holes and protrusions, can improve quantum efficiency in silicon, germanium and III-V materials and can also reduce avalanche voltages for avalanche photodiodes. Applications include optical communications within and between datacenters, telecommunications, LIDAR, and free space data communication.

Abstract: Among other things, techniques are described for receiving, from at least one sensor of a vehicle, sensor data associated with a surface along a path to be traveled by a vehicle; using a surface classifier to determine a classification of the surface based on the sensor data; determining, based on the classification of the surface, drivability properties of the surface; planning, based on the drivability properties of the surface, a behavior of the vehicle when driving near the surface or on the surface; and controlling the vehicle based on the planned behavior.

Abstract: A quantum dot composition includes a matrix resin, a quantum dot phosphor, and a polysilane polymer. The matrix resin includes epoxy-fluorene copolymer acrylic resin represented by Formula 1: Formula 1. In Formula 1, R1 and R4 each is independently hydrogen or a C1-C12 long alkyl carbon chain. R2 and R3 each is independently a is an integer from 1 to 10, and b and c each is independently an integer from 0 to 10. X is 0.1 to 0.9. A color conversion film including the quantum dot composition and a backlight module using the color conversion film are also provided.

Abstract: A method for manufacturing a hydrocarbon compound from carbon dioxide, said method including: (a) a step of preparing an absorption-conversion catalyst that includes an oxide carrier, a first component supported on the oxide carrier and including at least one type of metal selected from the group consisting of alkali metals and alkaline earth metals, and a second component supported on the oxide carrier and including at least one type of metal selected from the group consisting of Ni, Fe, Co, Cu, and Ru; (b) a step of bringing the absorption-conversion catalyst and a carbon dioxide-including gas into contact under higher pressure than atmospheric pressure, and causing the carbon dioxide to be stored in the absorption-conversion catalyst; and (c) a step of bringing the absorption-conversion catalyst that has the carbon dioxide stored therein and a reducing gas into contact under higher pressure than atmospheric pressure, and obtaining the hydrocarbon compound.

Abstract: A processing chamber includes a grid and a first disk. The grid includes a plurality of holes arranged in the processing chamber. The grid partitions the processing chamber into a first chamber in which plasma is generated and a second chamber in which a pedestal is configured to support a substrate. The first disk is arranged in the second chamber. The first disk is movable between the grid and the substrate when supported on the pedestal.

Abstract: Among other things, techniques are described for receiving, from at least one sensor of a vehicle, sensor data associated with a surface along a path to be traveled by a vehicle; using a surface classifier to determine a classification of the surface based on the sensor data; determining, based on the classification of the surface, drivability properties of the surface; planning, based on the drivability properties of the surface, a behavior of the vehicle when driving near the surface or on the surface; and controlling the vehicle based on the planned behavior.

Abstract: The present invention is directed to a Spatiotemporal scene-graph embedding methodology that models scene-graphs and resolves safety-focused tasks for autonomous vehicles. The present invention features a computing system comprising instructions for accepting the one or more images, extracting one or more objects from each image, computing an inverse-perspective mapping transformation of the image to generate a bird's-eye view (BEV) representation of each image, calculating relations between each object for each image, and generating a scene-graph for each image based on the aforementioned calculations. The system may further comprise instructions for calculating a confidence value for whether or not a collision will occur through the generation of a spatio-temporal graph embedding based on a spatial graph embedding and a temporal model.

Abstract: The present disclosure relates to security mechanisms for electric motors and associated systems. For example, the present technology includes a powertrain assembly having (1) a motor having multiple sets of coils; (2) a drive circuitry electrically coupled to the multiple sets of coils; and (3) a security unit electrically coupled to the drive circuitry and the multiple sets of coils. The security unit is configured to short-circuit at least one set of the multiple sets of coils responsive to a signal from a controller. The signal indicates that the motor is, or has been, turned off.

Abstract: A method for overlay error correction includes generating a first overlay error based on a first overlay mark, wherein the first overlay error is indicative of a misalignment between a lower pattern and an upper pattern of the first overlay mark. The method also includes generating a second overlay error based on a second overlay mark, in response to an abnormal of the first overlay error is detected. The method further includes determining whether the abnormal of the first overlay error is caused by the misalignment between the lower pattern and the upper pattern depending on the second overlay error.

Abstract: The present invention relates to an ethylene-vinyl alcohol copolymer composition, a single-layer film and a multilayer structure containing the same. Said ethylene-vinyl alcohol copolymer composition includes an ethylene-vinyl alcohol copolymer, an antioxidant, and a fluorine-containing compound; and the ratio of the antioxidant content to the fluorine content is 0.5 to 65. Thereby, the film containing said ethylene-vinyl alcohol copolymer composition not only has good heat resistance, but also can avoid the situation that a large number of gels are generated during the preparation process.

Abstract: Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as pillars and/or holes, effectively increase the effective absorption length resulting in a greater absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more.

Abstract: The present disclosure provides a method for overlay error correction. The method includes: obtaining an overlay error based on a lower-layer pattern and an upper-layer pattern of a wafer, wherein the lower-layer pattern is obtained by first fabrication equipment through which the wafer passes, and the upper-layer pattern is obtained by exposure equipment; generating a corrected overlay error based on the overlay error and fabrication processes performed on the wafer after the first fabrication equipment and prior to the exposure equipment; and adjusting the exposure equipment based on the corrected overlay error.

Abstract: The present disclosure provides a mark for overlay error measurement. The mark includes a first pattern and a second pattern. The first pattern is disposed on a substrate and at a first horizontal level. The first pattern includes a plurality of first sub-patterns and a plurality of second sub-patterns. The first sub-patterns extend along a first direction and are arranged along a second direction different from the first direction. The second sub-patterns are arranged along the second direction, wherein a profile of each of the plurality of first sub-patterns is different from a profile of each of the plurality of second sub-patterns. The second pattern is disposed at a second horizontal level different from the first horizontal level.