Abstract: A liquid discharge head includes a plurality of recording element substrates each having an energy generating element configured to generate energy for discharging liquid from a discharge port, and a sealing member with which a surround of each of the plurality of recording element substrates is filled. Each of the plurality of recording element substrates includes a recessed portion formed on an end surface facing a neighboring recording element substrate, and in the recessed portion, a gap between neighboring recording element substrates is wider than a gap between element surfaces on which the energy generating element is provided.

Abstract: At least one embodiment of a liquid discharge head includes a liquid discharge substrate, a support substrate on which a back surface of the liquid discharge substrate is joined, and a wiring substrate. A second edge of the liquid discharge substrate and at least one third edge that forms a surface of the support substrate and is in contact with the back surface of the liquid discharge substrate, intersect at an intersecting point. A sealing agent for sealing an electric connection portion between the liquid discharge substrate and the wiring substrate extends over a portion of the second edge extending toward at least one second side surface of the liquid discharge substrate from a space on a lower side of the electric connection portion, to reach at least the intersecting point.

Abstract: At least one embodiment of a liquid discharge head includes a liquid discharge substrate, a support substrate on which a back surface of the liquid discharge substrate is joined, and a wiring substrate. A second edge of the liquid discharge substrate and at least one third edge that forms a surface of the support substrate and is in contact with the back surface of the liquid discharge substrate, intersect at an intersecting point. A sealing agent for sealing an electric connection portion between the liquid discharge substrate and the wiring substrate extends over a portion of the second edge extending toward at least one second side surface of the liquid discharge substrate from a space on a lower side of the electric connection portion, to reach at least the intersecting point.

Abstract: A liquid discharge head includes a plurality of recording element substrates each having an energy generating element configured to generate energy for discharging liquid from a discharge port, and a sealing member with which a surround of each of the plurality of recording element substrates is filled. Each of the plurality of recording element substrates includes a recessed portion formed on an end surface facing a neighboring recording element substrate, and in the recessed portion, a gap between neighboring recording element substrates is wider than a gap between element surfaces on which the energy generating element is provided.

Abstract: A method of manufacturing a liquid discharge head in which a device substrate having an energy generating element and a supply port and a supporting member having a supply passage are bonded with each other an adhesive agent includes: a first step of applying the adhesive agent to an end surface of a wall; a second step of flattening out the adhesive agent on the end surface of the wall of the supply port in the height direction intersecting the end surface by moving the end surface of the wall of the supply port and the end surface of the wall of the supply passage toward each other; and a third step of moving the ridge line of the wall of the supply port in a direction along the end surface of the wall of the supply port.

Abstract: An electric connection method for connection between a semiconductor substrate and an electric wiring substrate includes a first process for providing the semiconductor substrate having a heating member and a pad and the electric wiring substrate having first wiring and second wiring, a second process for electrically connecting the first wiring and the heating member, a third process for causing the heating member to generate heat by supplying power to the heating member through the first wiring, and a fourth process for electrically connecting the pad and the second wiring at a temperature higher than a temperature for electrically connecting the first wiring and the heating member.

Abstract: Precise positioning of a film used to seal an electrical connection on a liquid ejecting head is made possible. Specifically, positioning is conducted in a state in which part of the film is held to a finger by suction. Next, the finger is moved downward while in the positioned state, and part of the film is pressed against a wiring board. With part of the film fixed to the wiring board in this way, a sealing resin flows while being covered by the film. Consequently, shifting of the position of the film as the sealing resin flows may be prevented. As a result, it becomes possible to conduct covering with the film in a precisely positioned state.

Abstract: A support substrate and a liquid ejecting element substrate are bonded to each other with an adhesive agent to manufacture a liquid ejection head. The support substrate is provided with a liquid supply port and a recess or through-hole in its main surface. The adhesive agent is applied onto the main surface of the support substrate by means of a roller holding the adhesive agent on its peripheral surface by moving the support substrate and the roller relative to each other such that the recess or through-hole faces the roller before the liquid supply port faces the roller.

Abstract: Precise positioning of a film used to seal an electrical connection on a liquid ejecting head is made possible. Specifically, positioning is conducted in a state in which part of the film is held to a finger by suction. Next, the finger is moved downward while in the positioned state, and part of the film is pressed against a wiring board. With part of the film fixed to the wiring board in this way, a sealing resin flows while being covered by the film. Consequently, shifting of the position of the film as the sealing resin flows may be prevented. As a result, it becomes possible to conduct covering with the film in a precisely positioned state.

Abstract: There is provided a method of manufacturing a liquid ejection head that includes a supporting member having a major surface provided with a plurality of supply paths, and a recording element substrate having a bonding surface bonded to the major surface and provided with a plurality of supply ports arranged side by side in an arranging direction in which the supply paths are arranged side by side, the supply ports having smaller widths than the respective supply paths in the arranging direction. The method includes applying a bonding agent on the major surface around each of the supply paths, spreading the bonding agent to inner side surfaces of the supply ports by pressing boundary portions between the bonding surface and the supply ports into the bonding agent applied, and bonding the bonding surface to the major surface at a bonding position where the supply ports face the respective supply paths.

Abstract: A liquid adhesive is applied onto a surface of a base plate having flow channels formed as recesses or through-grooves, by transferring the liquid adhesive from a rotating cylinder coated with it to the surface of the base plate. The base plate is then bonded to a cover plate having ejection energy generating elements via the applied adhesive to be made into a liquid ejection head. For evenly applying the liquid adhesive onto the surface having the recesses or through-grooves as flow channels, the surface is additionally provided with dummy recesses for compensating for variance of contact length orthogonal to the transfer direction due to uneven or asymmetrical arrangement of the recesses or through-grooves.

Abstract: An electric connection method for connection between a semiconductor substrate and an electric wiring substrate includes a first process for providing the semiconductor substrate having a heating member and a pad and the electric wiring substrate having first wiring and second wiring, a second process for electrically connecting the first wiring and the heating member, a third process for causing the heating member to generate heat by supplying power to the heating member through the first wiring, and a fourth process for electrically connecting the pad and the second wiring at a temperature higher than a temperature for electrically connecting the first wiring and the heating member.

Abstract: There is provided a method of manufacturing a liquid ejection head that includes a supporting member having a major surface provided with a plurality of supply paths, and a recording element substrate having a bonding surface bonded to the major surface and provided with a plurality of supply ports arranged side by side in an arranging direction in which the supply paths are arranged side by side, the supply ports having smaller widths than the respective supply paths in the arranging direction. The method includes applying a bonding agent on the major surface around each of the supply paths, spreading the bonding agent to inner side surfaces of the supply ports by pressing boundary portions between the bonding surface and the supply ports into the bonding agent applied, and bonding the bonding surface to the major surface at a bonding position where the supply ports face the respective supply paths.

Abstract: A method of manufacturing a liquid discharge head in which a device substrate having an energy generating element and a supply port and a supporting member having a supply passage are bonded with each other an adhesive agent includes: a first step of applying the adhesive agent to an end surface of a wall; a second step of flattening out the adhesive agent on the end surface of the wall of the supply port in the height direction intersecting the end surface by moving the end surface of the wall of the supply port and the end surface of the wall of the supply passage toward each other; and a third step of moving the ridge line of the wall of the supply port in a direction along the end surface of the wall of the supply port.

Abstract: A liquid recording head includes a protective layer having resistance to liquid and an adhesiveness improving film disposed on a second surface of a silicon substrate, opposite to a first surface. The first surface and the second surface have a plane direction (100). The protective layer is disposed in a peripheral region of an opening of a liquid supply port. A liquid ejection chip is bonded to a head substrate with an adhesive so that the liquid supply port communicates with a liquid introduction port on a side of the second surface of the silicon substrate.

Abstract: A manufacturing method, for a liquid discharge head substrate that includes a silicon substrate in which a liquid supply port is formed, includes the steps of: preparing the silicon substrate, on one face of which a mask layer, in which an opening has been formed, is deposited; forming a first recessed portion in the silicon substrate, so that the recessed portion is extended through the opening from the one face of the silicon substrate to the other, reverse face of the silicon substrate; forming a second recessed portion by performing wet etching for the substrate, via the first recessed portion, using the mask layer; and performing dry etching for the silicon substrate in a direction from the second recessed portion to the other face.

Abstract: A method for processing a substrate includes preparing a substrate having a first layer on a first surface side thereof, the first layer having a material capable of suppressing transmission of laser light, processing the substrate with laser light from a second surface that is opposite the first surface of the substrate toward the first surface of the substrate, and allowing the laser light to reach the first layer to form a hole in the substrate, and performing etching of the substrate from the second surface through the hole.

Abstract: Provided is a liquid recording head in which a protective layer having resistance to liquid and an adhesiveness improving film are disposed on a second surface opposite to a first surface of a silicon substrate. The first surface and the second surface have a plane direction. The protective layer is disposed in a peripheral region of an opening of a liquid supply port. A liquid ejection chip is bonded to a head substrate with an adhesive so that the liquid supply port communicates to a liquid introduction port on a side of the second surface of the silicon substrate.

Abstract: A liquid discharge head includes a recording element substrate including an energy generating element, a wiring substrate including wiring, a support substrate for supporting the recording element substrate and the wiring substrate so that a side end portion of the recording element substrate and a side end portion of the wiring substrate are adjacent to each other, and a sealing member, wherein the side end portion of the wiring substrate has a step portion, a distance between a second portion of the step portion on the side opposite to the support substrate and the side end portion of the recording element substrate is larger than a distance between a first portion of the step portion on the side of the support substrate and the side end portion of the recording element substrate, and a part of the wiring is formed in the first portion.

Abstract: A liquid discharge head comprises a discharge port forming member having formed therein a discharge port arranged corresponding to an energy generating element which generates energy to eject a liquid and a flow path forming member for forming a flow path to supply ink to the discharge port. At least one of the discharge port forming member and the flow path forming member is made of a cured material of a composition containing an epoxy resin and a phenol resin having a higher oxygen equivalent than that of the epoxy resin.