Patents by Inventor Shimpei Otaka
Shimpei Otaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8197705Abstract: A method of manufacturing a substrate for a liquid discharge head having a silicon substrate in which a liquid supply port is provided includes providing the silicon substrate, an etching mask layer having an aperture being formed on one surface of the silicon substrate, forming a region comprising an amorphous silicon in the interior of the silicon substrate by irradiating the silicon substrate with laser light, forming a recess, which has an opening at a part of a portion exposed from the aperture on the one surface, from the one surface of the silicon substrate toward the region, and forming the supply port by performing etching on the silicon substrate in which the recess and the region have been formed from the one surface through the aperture of the etching mask layer.Type: GrantFiled: September 3, 2008Date of Patent: June 12, 2012Assignee: Canon Kabushiki KaishaInventors: Keisuke Kishimoto, Hirokazu Komuro, Satoshi Ibe, Takuya Hatsui, Kazuhiro Asai, Shimpei Otaka, Hiroto Komiyama
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Patent number: 8177988Abstract: A method for manufacturing a substrate for a liquid discharge head having a silicon substrate provided with a supply port of a liquid comprises steps of preparing a substrate which is provided with a passive film on one side face thereof, has a first recess and a second recess provided therein so as to penetrate from the one side face into the inner part through the passive film, wherein the recesses satisfy a relation of a ×tan 54.7 degrees?d, where a is defined as a distance between the first recess and the second recess, and d is defined as a depth of the second recess, and forming the supply port by anisotropically etching the crystal from the one side face.Type: GrantFiled: September 3, 2008Date of Patent: May 15, 2012Assignee: Canon Kabushiki KaishaInventors: Hiroto Komiyama, Hirokazu Komuro, Satoshi Ibe, Takuya Hatsui, Keisuke Kishimoto, Shimpei Otaka, Sadayoshi Sakuma
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Patent number: 8114305Abstract: A method of manufacturing a silicon substrate for a liquid discharge head with a liquid supply opening formed therein includes: forming one processed portion by laser processing on the substrate from one surface of the substrate; expanding the one processed portion to form a recess portion by performing laser processing at a position which overlaps a part of the one processed portion and does not overlap another part of the one processed portion; and etching from the one surface the substrate with the recess portion formed therein to form the liquid supply opening.Type: GrantFiled: September 3, 2008Date of Patent: February 14, 2012Assignee: Canon Kabushiki KaishaInventors: Hiroto Komiyama, Hirokazu Komuro, Satoshi Ibe, Takuya Hatsui, Keisuke Kishimoto, Kazuhiro Asai, Shimpei Otaka
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Patent number: 8091234Abstract: A manufacturing method, for a liquid discharge head that includes a silicon substrate in which a supply port is formed for supplying a liquid, includes the steps of providing the silicon substrate, a mask layer provided with an opening that corresponds to the supply port being provided on one face of the silicon substrate; forming a groove in the silicon substrate along the shape of the opening in the mask layer; removing, via sandblasting, silicon of the silicon substrate inward of the groove in the silicon substrate; and performing, from the one face, anisotropic etching of the silicon substrate that has been sandblasted, and forming the supply port.Type: GrantFiled: September 3, 2008Date of Patent: January 10, 2012Assignee: Canon Kabushiki KaishaInventors: Satoshi Ibe, Hirokazu Komuro, Takuya Hatsui, Kazuhiro Asai, Shimpei Otaka, Hiroto Komiyama, Keisuke Kishimoto
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Publication number: 20110279550Abstract: A liquid discharge head includes a recording element substrate including an energy generating element, a wiring substrate including wiring, a support substrate for supporting the recording element substrate and the wiring substrate so that a side end portion of the recording element substrate and a side end portion of the wiring substrate are adjacent to each other, and a sealing member, wherein the side end portion of the wiring substrate has a step portion, a distance between a second portion of the step portion on the side opposite to the support substrate and the side end portion of the recording element substrate is larger than a distance between a first portion of the step portion on the side of the support substrate and the side end portion of the recording element substrate, and a part of the wiring is formed in the first portion.Type: ApplicationFiled: May 12, 2011Publication date: November 17, 2011Applicant: CANON KABUSHIKI KAISHAInventors: Shimpei Otaka, Takayuki Ono
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Patent number: 7947336Abstract: An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): where: R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a t-butyl group; n represents an integer of 0 or more and 4 or less; and m represents an integer of 1 or more and 3 or less.Type: GrantFiled: June 4, 2010Date of Patent: May 24, 2011Assignee: Canon Kabushiki KaishaInventors: Shimpei Otaka, Kazunari Ishizuka, Isamu Horiuchi, Isao Imamura
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Patent number: 7887162Abstract: An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): where: R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a t-butyl group; n represents an integer of 0 or more and 4 or less; and m represents an integer of 1 or more and 3 or less.Type: GrantFiled: January 29, 2010Date of Patent: February 15, 2011Assignee: Canon Kabushiki KaishaInventors: Shimpei Otaka, Kazunari Ishizuka, Isamu Horiuchi, Isao Imamura
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Publication number: 20100248156Abstract: An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): where: R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a t-butyl group; represents an integer of 0 or more and 4 or less; and m represents an integer of 1 or more and 3 or less.Type: ApplicationFiled: June 4, 2010Publication date: September 30, 2010Applicant: CANON KABUSHIKI KAISHAInventors: Shimpei Otaka, Kazunari Ishizuka, Isamu Horiuchi, Isao Imamura
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Publication number: 20100134555Abstract: An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): where: R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a t-butyl group; n represents an integer of 0 or more and 4 or less; and m represents an integer of 1 or more and 3 or less.Type: ApplicationFiled: January 29, 2010Publication date: June 3, 2010Applicant: CANON KABUSHIKI KAISHAInventors: Shimpei Otaka, Kazunari Ishizuka, Isamu Horiuchi, Isao Imamura
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Patent number: 7709554Abstract: An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): where: R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a t-butyl group; n represents an integer of 0 or more and 4 or less; and m represents an integer of 1 or more and 3 or less.Type: GrantFiled: November 16, 2006Date of Patent: May 4, 2010Assignee: Canon Kabushiki KaishaInventors: Shimpei Otaka, Kazunari Ishizuka, Isamu Horiuchi, Isao Imamura
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Patent number: 7687552Abstract: An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): where: R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a t-butyl group; represents an integer of 0 or more and 4 or less; and m represents an integer of 1 or more and 3 or less.Type: GrantFiled: November 4, 2009Date of Patent: March 30, 2010Assignee: Canon Kabushiki KaishaInventors: Shimpei Otaka, Kazunari Ishizuka, Isamu Horiuchi, Isao Imamura
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Publication number: 20100045739Abstract: An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): where: R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a t-butyl group; n represents an integer of 0 or more and 4 or less; and m represents an integer of 1 or more and 3 or less.Type: ApplicationFiled: November 4, 2009Publication date: February 25, 2010Applicant: CANON KABUSHIKI KAISHAInventors: Shimpei Otaka, Kazunari Ishizuka, Isamu Horiuchi, Isao Imamura
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Publication number: 20090314742Abstract: A method for processing a substrate includes preparing a substrate having a first layer on a first surface side thereof, the first layer having a material capable of suppressing transmission of laser light, processing the substrate with laser light from a second surface that is opposite the first surface of the substrate toward the first surface of the substrate, and allowing the laser light to reach the first layer to form a hole in the substrate, and performing etching of the substrate from the second surface through the hole.Type: ApplicationFiled: June 15, 2009Publication date: December 24, 2009Applicant: CANON KABUSHIKI KAISHAInventors: Keisuke Kishimoto, Satoshi Ibe, Takuya Hatsui, Shimpei Otaka, Hiroto Komiyama, Hiroyuki Morimoto, Masahiko Kubota, Toshiyasu Sakai
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Publication number: 20090065482Abstract: Provided is a method of manufacturing a substrate for a liquid discharge head, the substrate including a silicon substrate with a liquid supply opening formed therein, the method including: forming one processed portion by laser processing on the substrate from one surface of the substrate; expanding the one processed portion to form a recess portion by performing laser processing at a position which overlaps a part of the one processed portion and does not overlap another part of the one processed portion; and etching from the one surface the substrate with the recess portion formed therein to form the liquid supply opening.Type: ApplicationFiled: September 3, 2008Publication date: March 12, 2009Applicant: CANON KABUSHIKI KAISHAInventors: Hiroto Komiyama, Hirokazu Komuro, Satoshi Ibe, Takuya Hatsui, Keisuke Kishimoto, Kazuhiro Asai, Shimpei Otaka
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Publication number: 20090065476Abstract: A method for manufacturing a substrate for a liquid discharge head having a silicon substrate provided with a supply port of a liquid comprises steps of preparing a substrate which is provided with a passive film on one side face thereof, has a first recess and a second recess provided therein so as to penetrate from the one side face into the inner part through the passive film, wherein the recesses satisfy a relation of a×tan 54.7 degrees?d, when a is defined as a distance between the first recess and the second recess, and d is defined as a depth of the second recess, and forming the supply port by anisotropically etching the crystal from the one side face.Type: ApplicationFiled: September 3, 2008Publication date: March 12, 2009Applicant: CANON KABUSHIKI KAISHAInventors: Hiroto Komiyama, Hirokazu Komuro, Satoshi Ibe, Takuya Hatsui, Keisuke Kishimoto, Shimpei Otaka, Sadayoshi Sakuma
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Publication number: 20090065472Abstract: To provide a manufacturing method, for a liquid discharge head substrate that includes a silicon substrate in which a liquid supply port is formed, includes the steps of: preparing the silicon substrate, on one face of which a mask layer, in which an opening has been formed, is deposited; forming a first recessed portion in the silicon substrate, so that the recessed portion is extended through the opening from the one face of the silicon substrate to the other, reverse face of the silicon substrate; forming a second recessed portion by performing wet etching for the substrate, via the first recessed portion, using the mask layer; and performing dry etching for the silicon substrate in a direction from the second recessed portion to the other face.Type: ApplicationFiled: September 3, 2008Publication date: March 12, 2009Applicant: CANON KABUSHIKI KAISHAInventors: Kazuhiro Asai, Hirokazu Komuro, Satoshi Ibe, Takuya Hatsui, Shimpei Otaka, Hiroto Komiyama, Keisuke Kishimoto
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Publication number: 20090065473Abstract: To provide a manufacturing method, for a liquid discharge head that includes a silicon substrate in which a supply port is formed for supplying a liquid, includes the steps of: providing the silicon substrate, a mask layer provided with an opening that corresponds to the supply port being provided on one face of the silicon substrate; forming a groove in the silicon substrate along the shape of the opening in the mask layer; removing, using sandblasting, silicon of the silicon substrate from the inner wall of the groove in the silicon substrate; and performing, from the one face, anisotropic etching of the silicon substrate that has been sandblasted, and forming the supply port.Type: ApplicationFiled: September 3, 2008Publication date: March 12, 2009Applicant: CANON KABUSHIKI KAISHAInventors: Satoshi Ibe, Hirokazu Komuro, Takuya Hatsui, Kazuhiro Asai, Shimpei Otaka, Hiroto Komiyama, Keisuke Kishimoto
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Publication number: 20090065481Abstract: A method of manufacturing a substrate for a liquid discharge head having a silicon substrate in which a liquid supply port is provided includes providing the silicon substrate, an etching mask layer having an opening being formed on a one surface of the silicon substrate, forming a region comprising an amorphous silicon in the interior of the silicon substrate by irradiating the silicon substrate with laser light, forming a recess, which has an opening at a part of a portion exposed from said opening on said one surface, from said one surface of the silicon substrate toward the region, and forming the supply port by performing etching on the silicon substrate in which the recess and the region have been formed from said one surface through the opening of the etching mask layer.Type: ApplicationFiled: September 3, 2008Publication date: March 12, 2009Applicant: CANON KABUSHIKI KAISHAInventors: Keisuke Kishimoto, Hirokazu Komuro, Satoshi Ibe, Takuya Hatsui, Kazuhiro Asai, Shimpei Otaka, Hiroto Komiyama
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Publication number: 20080309719Abstract: A liquid discharge head comprises a discharge port forming member having formed therein a discharge port arranged correspond to an energy generating element which generates energy to eject a liquid and a flow path forming member for forming a flow path to supply ink to the discharge port. At least one of the discharge port forming member and the flow path forming member is made of a cured material of a composition containing an epoxy resin and a phenol resin having a higher oxygen equivalent than that of the epoxy resin.Type: ApplicationFiled: May 28, 2008Publication date: December 18, 2008Applicant: CANON KABUSHIKI KAISHAInventors: Kazunari Ishizuka, Shimpei Otaka, Isao Imamura
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Publication number: 20070142491Abstract: An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): where: R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a t-butyl group; n represents an integer of 0 or more and 4 or less; and m represents an integer of 1 or more and 3 or less.Type: ApplicationFiled: November 16, 2006Publication date: June 21, 2007Applicant: CANON KABUSHIKI KAISHAInventors: Shimpei Otaka, Kazunari Ishizuka, Isamu Horiuchi, Isao Imamura