Abstract: A manufacturing method of an image-sensing module includes following steps. A substrate is provided. At least one photosensitive chip is disposed on the substrate, and each of the at least one photosensitive chip has an active area. At least one protection layer covers the at least one active area of the at least one photosensitive chip. A first manufacturing process is performed, and dust is generated during the first manufacturing process. The at least one protection layer is suitable for isolating the dust from the at least one active area. The at least one protection layer is removed to expose the at least one active area.

Abstract: A manufacturing method of an image-sensing module includes following steps. A substrate is provided. At least one photosensitive chip is disposed on the substrate, and each of the at least one photosensitive chip has an active area. At least one protection layer covers the at least one active area of the at least one photosensitive chip. A first manufacturing process is performed, and dust is generated during the first manufacturing process. The at least one protection layer is suitable for isolating the dust from the at least one active area. The at least one protection layer is removed to expose the at least one active area.

Abstract: An image sensor module is provided. The image sensor module includes a circuit board, a flat material, an image sensing chip, a holder and a covering plate. The flat material disposed on an assembling surface of the circuit board has a supporting surface and a bottom surface opposite thereto. The image sensing chip with its base surface facing to the supporting surface is configured on the supporting surface. The holder is disposed on the flat material, and the bottom plane of the holder faces to the supporting surface. The supporting surface is used to make the base surface parallel to the bottom plane. The covering plate is arranged on the holder to seal the image sensing chip.

Abstract: An optical auxiliary unit includes a housing frame, an optical filter and an actuator structure. The housing frame is temporarily placed on a temporary auxiliary carrying substrate, and the housing frame has a bottom opening enclosed by the temporary auxiliary carrying substrate and a top opening opposite to the bottom opening. The optical filter is fixed on the housing frame, and the top opening of the housing frame is enclosed by the optical filter. The actuator structure is fixed on the housing frame to cover the optical filter, and the actuator structure includes a lens holder fixed on the housing frame and a movable lens assembly movably disposed inside the lens holder and above the optical filter.

Abstract: An image capturing module for reducing assembly tilt angle includes an image sensing unit, an optical auxiliary unit and a leveling auxiliary unit. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The optical auxiliary unit includes a housing frame disposed on the carrier substrate to cover the image sensing chip and a lens assembly disposed inside the housing frame and above the image sensing chip. The leveling auxiliary unit includes a plurality of adhesive materials disposed on the image sensing chip and a light-transmitting leveling substrate supported above the image sensing chip by the adhesive materials. The housing frame directly contacts and downwardly abuts against the light-transmitting leveling substrate, and each adhesive material is formed by mixing adhesive glue and a plurality of micro support bodies.

Abstract: An image capturing module includes an image sensing unit and an actuator unit. The image sensing unit includes a circuit substrate and an image sensing chip disposed on the circuit substrate. The actuator unit includes a housing frame disposed on the circuit substrate and a movable lens assembly movably disposed inside the housing frame. The image sensing chip includes an image sensing area having a first geometric center line and a first geometric center point, and the movable lens assembly has a second geometric center line and a second geometric center point. Whereby, when the predetermined energy is provided for the actuator unit to shift the movable lens assembly, the second geometric center line (or the second geometric center point) of the movable lens assembly can be accurately aligned with the first geometric center line (or the first geometric center point) of the image sensing area.

Abstract: An optical auxiliary unit includes a housing frame, an optical filter and an actuator structure. The housing frame is temporarily placed on a temporary auxiliary carrying substrate, and the housing frame has a bottom opening enclosed by the temporary auxiliary carrying substrate and a top opening opposite to the bottom opening. The optical filter is fixed on the housing frame, and the top opening of the housing frame is enclosed by the optical filter. The actuator structure is fixed on the housing frame to cover the optical filter, and the actuator structure includes a lens holder fixed on the housing frame and a movable lens assembly movably disposed inside the lens holder and above the optical filter.

Abstract: An image capturing module includes an image sensing unit and an actuator unit. The image sensing unit includes a circuit substrate and an image sensing chip disposed on the circuit substrate. The actuator unit includes a housing frame disposed on the circuit substrate and a movable lens assembly movably disposed inside the housing frame. The image sensing chip includes an image sensing area having a first geometric center line and a first geometric center point, and the movable lens assembly has a second geometric center line and a second geometric center point. Whereby, when the predetermined energy is provided for the actuator unit to shift the movable lens assembly, the second geometric center line (or the second geometric center point) of the movable lens assembly can be accurately aligned with the first geometric center line (or the first geometric center point) of the image sensing area.

Abstract: An image capturing module for reducing assembly tilt angle includes an image sensing unit, an optical auxiliary unit and a leveling auxiliary unit. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The optical auxiliary unit includes a housing frame disposed on the carrier substrate to cover the image sensing chip and a lens assembly disposed inside the housing frame and above the image sensing chip. The leveling auxiliary unit includes a plurality of adhesive materials disposed on the image sensing chip and a light-transmitting leveling substrate supported above the image sensing chip by the adhesive materials. The housing frame directly contacts and downwardly abuts against the light-transmitting leveling substrate, and each adhesive material is formed by mixing adhesive glue and a plurality of micro support bodies.

Abstract: An image sensor module is provided. The image sensor module includes a circuit board, a flat material, an image sensing chip, a holder and a covering plate. The flat material disposed on an assembling surface of the circuit board has a supporting surface and a bottom surface opposite thereto. The image sensing chip with its base surface facing to the supporting surface is configured on the supporting surface. The holder is disposed on the flat material, and the bottom plane of the holder faces to the supporting surface. The supporting surface is used to make the base surface parallel to the bottom plane. The covering plate is arranged on the holder to seal the image sensing chip.

Abstract: The present invention provides a module structure of substrate inside type comprising a first substrate with a concave structure. A chip is configured on the concave structure of the first substrate, with a first contact pad and a sensing area. A second substrate is disposed on the first substrate, with at least one through hole structure and a second contact pad. The first contact is coupled to the second contact pad via a wire. The second substrate includes a first portion embedded into the module structure, and a second portion extended to outside of the module structure. A lens holder is disposed on the second substrate, and a lens is located on the top of the lens holder. A transparent material is disposed within the lens holder or the second substrate. The lens is substantially aligning to the transparent material and the sensing area.

Abstract: The present invention provides a chip module structure for particles protection. The structure includes a substrate. A chip is configured on the substrate, with a sensing area. A holder is disposed on the substrate, wherein the holder has a first rib. A transparent material is disposed on the holder, substantially aligning to the sensing area. A lens holder is disposed on the holder, and a lens is configured on the lens holder, substantially aligning to the transparent material and the sensing area. The lens has a second rib, wherein the second rib is disposed corresponding to the first rib for blocking particles entering into the chip module structure.

Abstract: The present invention provides a holder on chip module structure including a substrate. A chip is configured on the substrate, with a sensing area. A holder is disposed on the substrate, wherein a portion of the holder is directly contacted to the chip to reduce the tilt between the chip and the holder. A transparent material is disposed on the holder, substantially aligning to the sensing area. A lens holder is disposed on the holder, and a lens is configured on the lens holder, substantially aligning to the transparent material and the sensing area.

Abstract: The present invention provides a module structure comprising a substrate with a partial pierced region. A main chip has a sensing area. At least one component is included, wherein the main chip, the at least one component and the substrate are located at the same level. A holder is disposed on the substrate. A transparent material is disposed on the holder, substantially aligning to the sensing area. A lens holder is disposed on the holder, and a lens is configured on the lens holder, substantially aligning to the transparent material and the sensing area.

Abstract: The present invention provides a substrate connection type module structure comprising a substrate with a through hole structure and a first contact pad. A chip is configured on the through hole structure of the substrate, with a second contact pad and a sensing area. The first contact pad is coupled to the second contact pad via a wire. A second substrate is electrically connected to the first substrate. The second substrate and the chip are located at the same layer. A lens holder is disposed on the substrate, and a lens is located on the top of the lens holder. A transparent material is disposed within the lens holder. The lens is substantially aligning to the transparent material and the sensing area.

Abstract: The present invention provides a module structure comprising a substrate with a partial pierced region. A main chip has a sensing area. At least one component is included, wherein the main chip, the at least one component and the substrate are located at the same level. A holder is disposed on the substrate. A transparent material is disposed on the holder, substantially aligning to the sensing area. A lens holder is disposed on the holder, and a lens is configured on the lens holder, substantially aligning to the transparent material and the sensing area.

Abstract: The present invention provides a chip module structure for particles protection. The structure includes a substrate. A chip is configured on the substrate, with a sensing area. A holder is disposed on the substrate, wherein the holder has a first rib. A transparent material is disposed on the holder, substantially aligning to the sensing area. A lens holder is disposed on the holder, and a lens is configured on the lens holder, substantially aligning to the transparent material and the sensing area. The lens has a second rib, wherein the second rib is disposed corresponding to the first rib for blocking particles entering into the chip module structure.

Abstract: The present invention provides a holder on chip module structure including a substrate. A chip is configured on the substrate, with a sensing area. A holder is disposed on the substrate, wherein a portion of the holder is directly contacted to the chip to reduce the tilt between the chip and the holder. A transparent material is disposed on the holder, substantially aligning to the sensing area. A lens holder is disposed on the holder, and a lens is configured on the lens holder, substantially aligning to the transparent material and the sensing area.

Abstract: The present invention provides a window type camera module structure comprising a first substrate. A chip is configured on the first substrate, with a first contact pad and a sensing area. A second substrate is disposed on the first substrate, with a through hole structure and a second contact pad, wherein the chip is disposed within the through hole structure. The first contact is coupled to the second contact pad via a wire. A lens holder is disposed on the second substrate, and a lens is located on the top of the lens holder. A transparent material is disposed on the lens holder or the second substrate. The lens is substantially aligning to the transparent material and the sensing area.

Abstract: The present invention provides a pierced substrate on chip module structure comprising a first substrate. A chip is configured on the first substrate, with a first contact pad and a sensing area. A second substrate is disposed on the first substrate and the chip, with a concave structure, at least one through hole structure and a second contact pad, wherein the chip is disposed within the concave structure, and the first contact pad and the sensing area are exposed over the through hole structure. The first contact is coupled to the second contact pad via a wire. A transparent material is disposed on the second substrate, substantially aligning to the sensing area. A lens holder is disposed on the second substrate, and a lens is located on the top of the lens holder, substantially aligning to the transparent material and the sensing area.