Abstract: The present invention provides a substrate connection type module structure comprising a substrate with a through hole structure and a first contact pad. A chip is configured on the through hole structure of the substrate, with a second contact pad and a sensing area. The first contact pad is coupled to the second contact pad via a wire. A second substrate is electrically connected to the first substrate. The second substrate and the chip are located at the same layer. A lens holder is disposed on the substrate, and a lens is located on the top of the lens holder. A transparent material is disposed within the lens holder. The lens is substantially aligning to the transparent material and the sensing area.

Abstract: The present invention provides a module structure of substrate inside type comprising a first substrate with a concave structure. A chip is configured on the concave structure of the first substrate, with a first contact pad and a sensing area. A second substrate is disposed on the first substrate, with at least one through hole structure and a second contact pad. The first contact is coupled to the second contact pad via a wire. The second substrate includes a first portion embedded into the module structure, and a second portion extended to outside of the module structure. A lens holder is disposed on the second substrate, and a lens is located on the top of the lens holder. A transparent material is disposed within the lens holder or the second substrate. The lens is substantially aligning to the transparent material and the sensing area.