Abstract: Systems, devices, methods, and circuits for managing power supply in semiconductor devices are provided. The semiconductor devices can include 3D NAND flash memory devices with high capacity and/or high performance. In one aspect, a semiconductor device includes: a voltage pump, a pump switch circuit configured to be coupled to the voltage pump, and an interface including a voltage pin coupled to the pump switch circuit. The voltage pump has an input, an output, and a series of pump stages coupled between the input and the output. The pump switch circuit is configured to provide an input voltage received at the voltage pin to a corresponding node in the voltage pump to select a corresponding number of pump stages of the series of pump stages to output a target voltage at the output of the voltage pump.

Abstract: A flash memory and an operation method thereof are provided. The flash memory includes a plurality of memory cell strings and a pass voltage generator. Each of the memory cell strings includes a plurality of memory cells. The pass voltage generator is configured to provide a pass voltage to a plurality of word lines of a plurality of unselected memory cells of a selected memory string. During a reading operation, the pass voltage generator raises the pass voltage from a first voltage at a first time point, and raises the pass voltage to a second voltage at a second time point. The second voltage is lower than a target voltage times a preset ratio The first time point is earlier than a start time point of a bit line voltage received by the selected memory cell, and the second time point occurs at the start time point of the bit line voltage.

Abstract: A memory device comprises a first NAND string that includes a first plurality of memory cells and a first string select switch arranged in series, the first string select switch disposed between a first bit line and a first end of the first plurality, a second NAND string that includes a second plurality of memory cells and a second string select switch arranged in series, the second string select switch disposed between a second bit line and a first end of the second plurality, word lines coupled to memory cells in the first plurality and memory cells in the second plurality, and a string select line coupled to the first and second string select switches. A method of operating such a memory device comprises applying a voltage varying in a manner complementary to absolute temperature to at least one of the word lines and the string select line.

Abstract: A memory device comprises a first NAND string that includes a first plurality of memory cells and a first string select switch arranged in series, the first string select switch disposed between a first bit line and a first end of the first plurality, a second NAND string that includes a second plurality of memory cells and a second string select switch arranged in series, the second string select switch disposed between a second bit line and a first end of the second plurality, word lines coupled to memory cells in the first plurality and memory cells in the second plurality, and a string select line coupled to the first and second string select switches. A method of operating such a memory device comprises applying a voltage varying in a manner complementary to absolute temperature to at least one of the word lines and the string select line.

Abstract: A circuit for adjusting a select gate voltage of a non-volatile memory is provided. The circuit includes a well, a select gate, and an adjustment unit. There is a capacitive coupling between the well and the select gate. The adjustment unit generates a driving voltage for the select gate based on a non-constant voltage.

Abstract: A boost circuit includes a power rail to provide a supply voltage, a switch transistor controlling output of a boosted signal from a source of the switch transistor, and a timing and voltage control circuit configured to generate an equalization (EQ) signal to be applied to a gate of the switch transistor. The EQ waveform has a level being an EQ high level, an EQ low level lower than the EQ high level, or an EQ clamped level between the EQ low level and the EQ high level.

Abstract: A circuit for adjusting a select gate voltage of a non-volatile memory is provided. The circuit includes a well, a select gate, and an adjustment unit. There is a capacitive coupling between the well and the select gate. The adjustment unit generates a driving voltage for the select gate based on a non-constant voltage.

Abstract: A circuit for adjusting a select gate voltage of a non-volatile memory is provided. The circuit includes a well, a select gate, an adjustment unit, and a switch. There is a capacitive coupling between the well and the select gate. The adjustment unit generates a driving voltage for the select gate. The switch is coupled in series with the adjustment unit between the select gate and the well.

Abstract: A level shifter receiving an input with a relatively narrow voltage range and provides an output with a relatively wide voltage range. The level shifter including a transistor with a turn-on voltage. Control circuitry applies a bias to the level shifter such that the transistor does not receive the turn-on voltage.

Abstract: A boost circuit includes a power rail to provide a supply voltage, a switch transistor controlling output of a boosted signal from a source of the switch transistor, and a timing and voltage control circuit configured to generate an equalization (EQ) signal to be applied to a gate of the switch transistor. The EQ waveform has a level being an EQ high level, an EQ low level lower than the EQ high level, or an EQ clamped level between the EQ low level and the EQ high level.

Abstract: A method and a circuit for generating a clock signal from a clock integrated circuit are introduced herein. A compensation voltage is generated according to a temperature coefficient of a resistor and a clock period of a clock circuit, where the compensation voltage is resistor-corner independent. The clock period of the clock circuit is determined by the resistor and at least one capacitor of the clock circuit. The temperature dependence of the clock period of the clock circuit is reduced according to the compensation voltage.

Abstract: A boost circuit includes a power rail to provide a supply voltage, a switch transistor controlling output of a boosted signal from a source of the switch transistor, and a timing and voltage control circuit configured to generate an equalization (EQ) signal to be applied to a gate of the switch transistor. The EQ waveform has a level being an EQ high level, an EQ low level lower than the EQ high level, or an EQ clamped level between the EQ low level and the EQ high level.

Abstract: A circuit for adjusting a select gate voltage of a non-volatile memory is provided. The circuit includes a well, a select gate, an adjustment unit, and a switch. There is a capacitive coupling between the well and the select gate. The adjustment unit generates a driving voltage for the select gate. The switch is coupled in series with the adjustment unit between the select gate and the well.

Abstract: A level shifter receiving an input with a relatively narrow voltage range and provides an output with a relatively wide voltage range. The level shifter including a transistor with a turn-on voltage. Control circuitry applies a bias to the level shifter such that the transistor does not receive the turn-on voltage.

Abstract: A 3D memory device includes a plurality of ridge-shaped stacks, in the form of multiple strips of conductive material separated by insulating material, arranged as strings which can be coupled through decoding circuits to sense amplifiers. Diodes are connected to the bit line structures at either the string select of common source select ends of the strings. The strips of conductive material have side surfaces on the sides of the ridge-shaped stacks. A plurality of conductive lines arranged as word lines which can be coupled to row decoders, extends orthogonally over the plurality of ridge-shaped stacks. Memory elements lie in a multi-layer array of interface regions at cross-points between side surfaces of the conductive strips on the stacks and the conductive lines.

Abstract: A method and a circuit for generating a clock signal from a clock integrated circuit are introduced herein. A compensation voltage is generated according to a temperature coefficient of a resistor and a clock period of a clock circuit, where the compensation voltage is resistor-corner independent. The clock period of the clock circuit is determined by the resistor and at least one capacitor of the clock circuit. The temperature dependence of the clock period of the clock circuit is reduced according to the compensation voltage.

Abstract: A boost circuit includes a power rail to provide a supply voltage, a switch transistor controlling output of a boosted signal from a source of the switch transistor, and a timing and voltage control circuit configured to generate an equalization (EQ) signal to be applied to a gate of the switch transistor. The EQ waveform has a level being an EQ high level, an EQ low level lower than the EQ high level, or an EQ clamped level between the EQ low level and the EQ high level.

Abstract: A 3D memory device includes a plurality of ridge-shaped stacks, in the form of multiple strips of conductive material separated by insulating material, arranged as strings which can be coupled through decoding circuits to sense amplifiers. Diodes are connected to the bit line structures at either the string select of common source select ends of the strings. The strips of conductive material have side surfaces on the sides of the ridge-shaped stacks. A plurality of conductive lines arranged as word lines which can be coupled to row decoders, extends orthogonally over the plurality of ridge-shaped stacks. Memory elements lie in a multi-layer array of interface regions at cross-points between side surfaces of the conductive strips on the stacks and the conductive lines.

Abstract: A 3D memory device includes a plurality of ridges, in some embodiments ridge-shaped, in the form of multiple strips of conductive material separated by insulating material, arranged as bit lines which can be coupled through decoding circuits to sense amplifiers. The strips of conductive material have side surfaces on the sides of the stacks. A plurality of conductive lines arranged as word lines which can be coupled to row decoders, extends orthogonally over the plurality of stacks. The conductive lines conform to the surface of the stacks. Memory elements lie in a multi-layer array of interface regions at cross-points between side surfaces of the semiconductor material strips on the stacks and the conductive lines. The memory elements are programmable, like the anti-fuses or charge trapping structures. In some embodiments, the 3D memory is made using only two critical masks for multiple layers. Some embodiments include a staircase-shaped structure positioned at ends of the semiconductor material strips.

Abstract: A 3D memory device includes a plurality of ridges, in some embodiments ridge-shaped, in the form of multiple strips of conductive material separated by insulating material, arranged as bit lines which can be coupled through decoding circuits to sense amplifiers. The strips of conductive material have side surfaces on the sides of the stacks. A plurality of conductive lines arranged as word lines which can be coupled to row decoders, extends orthogonally over the plurality of stacks. The conductive lines conform to the surface of the stacks. Memory elements lie in a multi-layer array of interface regions at cross-points between side surfaces of the semiconductor material strips on the stacks and the conductive lines. The memory elements are programmable, like the anti-fuses or charge trapping structures. In some embodiments, the 3D memory is made using only two critical masks for multiple layers. Some embodiments include a staircase-shaped structure positioned at ends of the semiconductor material strips.