Patents by Inventor Shin-Ku Chu

Shin-Ku Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing pad and method of polishing wafer
    Publication number: 20050054277
    Abstract: A wafer polishing method is provided. A first polishing pad comprising a plurality of abrasive units is provided. A first polishing operation is performed on the first polishing pad to planarize a wafer. Thereafter, a second polishing pad comprising a plurality of abrasive units is provided. The surface of the abrasive unit in contact with the wafer is roughened. A second polishing operation is performed on the second polishing pad. Since a second polishing operation using a second polishing pad with a roughened surface is performed, gradual reduction of polishing rate as the polish layer is planarized can be avoided.
    Type: Application
    Filed: September 4, 2003
    Publication date: March 10, 2005
    Inventors: Teng-Chun Tsai, Hsiao-Ling Lu, Shin-Ku Chu, Gene Li